JPH0249835B2 - - Google Patents
Info
- Publication number
- JPH0249835B2 JPH0249835B2 JP56152626A JP15262681A JPH0249835B2 JP H0249835 B2 JPH0249835 B2 JP H0249835B2 JP 56152626 A JP56152626 A JP 56152626A JP 15262681 A JP15262681 A JP 15262681A JP H0249835 B2 JPH0249835 B2 JP H0249835B2
- Authority
- JP
- Japan
- Prior art keywords
- base material
- contact
- multilayer
- welding
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 32
- 238000003466 welding Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 3
- 238000007788 roughening Methods 0.000 description 2
- 229910002695 AgAu Inorganic materials 0.000 description 1
- 229910017727 AgNi Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910003336 CuNi Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000005493 welding type Methods 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
- Manufacture Of Switches (AREA)
Description
【発明の詳細な説明】
この発明は、例えばリレーやスイツチの接点ば
ねや端子板に多層接点を溶接する方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for welding multilayer contacts to contact springs and terminal plates of relays and switches, for example.
従来この種の溶接は、接点を基材に位置決めし
たのち、接点及び基材を電極間に挟持し、約1000
〜1500Aの電流を流すことによつて抵抗溶接を行
つていた。従つて、せいぜい数Ａの開閉を行う接
点に対し、溶接時には約1000〜1500Aを流すこと
によつて、電流や電極の加圧力という条件が適当
でないと散り等が生じることによつて接触面が荒
れ接触面積の減少、接触抵抗の増大となり、接触
信頼性が悪くなるものである。 Conventionally, this type of welding involves positioning the contact on the base material, then sandwiching the contact and the base material between electrodes, and
Resistance welding was performed by passing a current of ~1500A. Therefore, when welding a contact that opens and closes at most a few amperes, by passing about 1000 to 1500 amperes, if the conditions of current and electrode pressure are not appropriate, the contact surface will be damaged due to expulsion, etc. This results in a decrease in rough contact area and an increase in contact resistance, resulting in poor contact reliability.
この発明は上記の事情に着目してなされたもの
であり、その目的とするところは接触面を荒らす
こと無く多層接点を溶接して接触信頼性を向上さ
せると共に、散り等の材料の飛散を防止する多層
接点の溶接方法を提供するにある。 This invention was made in view of the above-mentioned circumstances, and its purpose is to improve contact reliability by welding multilayer contacts without roughening the contact surfaces, and to prevent materials from scattering such as splintering. The present invention provides a method for welding multilayer contacts.
以下この発明の一実施例をリレーに応用した第
１図ａ乃至第２図に基づいて説明する。１はリン
青銅のフープ材からなる基材であり、例えば0.3
mm〜0.5mmの直径を有する貫通孔２を形成してい
る。３は多層接点であり、この実施例ではCuNi
からなる母材３に重ねたAgNiからなる中間層３
ｂと、この中間層３ｂの上に重ねて接触抵抗を小
さくする良導電体のAgAuからなる接触層３ｃの
三層となつている。そして、第１図ａに示す如く
基材１を部材Ｘ・Ｙにて支持したのち部材Ｚによ
つて多層接点３の母材３ａを貫通孔２に対応させ
て基材１に力Ｆでもつて当接させたのち、貫通孔
２側より照射したレーザ光Ａによつて第１図ｂに
示す如く、基材１と母材３ａを溶かして基材１に
多層接点３を溶接するものである。４はリレーで
あり、この基材１を分断することによつて接点ば
ね５としている。６は固定接点板であり、基材１
を横銅としてレーザ光Ａによつて多層接点３を溶
接している。 An embodiment of the present invention will be described below with reference to FIGS. 1a to 2 in which it is applied to a relay. 1 is a base material made of phosphor bronze hoop material, for example, 0.3
A through hole 2 having a diameter of mm to 0.5 mm is formed. 3 is a multilayer contact, in this example CuNi
Intermediate layer 3 made of AgNi layered on base material 3 made of
The contact layer 3c is composed of a contact layer 3c made of AgAu, which is a good conductor and is layered on the intermediate layer 3b to reduce contact resistance. Then, as shown in FIG. 1a, after the base material 1 is supported by members X and Y, the base material 3a of the multilayer contact 3 is aligned with the through hole 2 by member Z, and is applied to the base material 1 with a force F. After bringing them into contact, the multilayer contact 3 is welded to the base material 1 by melting the base material 1 and the base material 3a as shown in FIG. . 4 is a relay, which is made into a contact spring 5 by dividing the base material 1. 6 is a fixed contact plate, and base material 1
The multilayer contact 3 is welded by laser beam A using the horizontal copper.
而して、抵抗溶接に較べ、接触層３ｃに1000〜
1500Aという大電流を流すことなく、レーザ光Ａ
の短時間の照射で多層接点３の溶接が完了するも
のである。 Therefore, compared to resistance welding, the contact layer 3c has a
Laser light A without flowing a large current of 1500A
Welding of the multilayer contact 3 is completed in a short period of time.
第３図は、貫通孔２を二つ設けて、多層接点
３，３を表裏にそれぞれ溶接できるようにした、
他の実施例を表したものである。 FIG. 3 shows a case where two through holes 2 are provided so that multilayer contacts 3, 3 can be welded on the front and back sides, respectively.
This represents another embodiment.
この発明は以上説明したように、貫通孔を形成
した高熱伝導度材料よりなる基材と、
接触抵抗の低い接触層と前記基材の熱伝導度と
近似した熱伝導度を有する母材とを積層して形成
した多層接点とよりなり、
前記多層接点の母材を基材の貫通孔をふさぐ形
で位置させ、該貫通孔側より照射したレーザー光
により、基材に多層接点を溶接しているので、抵
抗溶接のような高電流を接触層に流す必要がなく
なり、散り等の現象が発生しなくなるので、接触
層の荒れがなく、接触信頼性の高い多層接点の溶
接ができると共に、接点を多層化したことによ
り、接触層は高い接触安定性が得られたうえで、
接点母材の熱伝導度を基材の熱伝導度に近似させ
ることができ、両者間のレーザー溶接による溶接
整合性が高められ、安定した溶接ができる。 As explained above, the present invention comprises a base material made of a high thermal conductivity material with through holes formed therein, a contact layer with low contact resistance, and a base material having a thermal conductivity similar to that of the base material. The base material of the multilayer contact is positioned so as to close a through hole in the base material, and the multilayer contact is welded to the base material using a laser beam irradiated from the side of the through hole. This eliminates the need for high current to flow through the contact layer as in resistance welding, and phenomena such as scattering do not occur, making it possible to weld multilayer contacts with high contact reliability without roughening the contact layer. By making the contact layer multi-layered, the contact layer has high contact stability and
The thermal conductivity of the contact base material can be approximated to the thermal conductivity of the base material, and the welding consistency between the two by laser welding is improved, allowing stable welding.
第１図ａ乃至第２図はこの発明の一実施例を示
し、第１図ａは溶接状態を示す縦断面図、第１図
ｂは縦断面図、第２図は斜視図である。第３図
は、この発明の他の実施例を示す縦断面図であ
る。
１…基材、２…貫通孔、３…多層接点、３ａ…
母材、３ｃ…接触層、Ａ…レーザ光。
1a to 2 show an embodiment of the present invention, in which FIG. 1a is a longitudinal sectional view showing a welded state, FIG. 1b is a longitudinal sectional view, and FIG. 2 is a perspective view. FIG. 3 is a longitudinal sectional view showing another embodiment of the invention. 1...Base material, 2...Through hole, 3...Multilayer contact, 3a...
Base material, 3c... contact layer, A... laser light.
Claims (1)
材と、 接触抵抗の低い接触層と前記基材の熱伝導度と
近似した熱伝導度を有する母材とを積層して形成
した多層接点とよりなり、 前記多層接点の母材を基材の貫通孔をふさぐ形
で位置させ、該貫通孔側より照射したレーザー光
により、基材に多層接点を溶接してなることを特
徴とする多層接点の溶接方法。[Claims] 1. A base material made of a high thermal conductivity material with through holes formed therein, a contact layer with low contact resistance, and a base material having a thermal conductivity similar to that of the base material are laminated. The base material of the multilayer contact is positioned so as to close a through hole in the base material, and the multilayer contact is welded to the base material using a laser beam irradiated from the side of the through hole. A method for welding multilayer contacts characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56152626A JPS5853118A (en) | 1981-09-26 | 1981-09-26 | Method of welding multilayer contact |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56152626A JPS5853118A (en) | 1981-09-26 | 1981-09-26 | Method of welding multilayer contact |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2114840A Division JPH03176919A (en) | 1990-04-27 | 1990-04-27 | Welding method of multilayer contact |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5853118A JPS5853118A (en) | 1983-03-29 |
| JPH0249835B2 true JPH0249835B2 (en) | 1990-10-31 |
Family
ID=15544486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56152626A Granted JPS5853118A (en) | 1981-09-26 | 1981-09-26 | Method of welding multilayer contact |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5853118A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5676865A (en) * | 1995-08-25 | 1997-10-14 | Thomas & Betts Corporation | Method of and apparatus for providing welded joints |
| DE19681102C2 (en) * | 1995-10-31 | 2003-06-12 | Toto Ltd | shower |
| JP2007265962A (en) * | 2006-02-28 | 2007-10-11 | Hitachi Ltd | Method of laser welding, manufacturing method of control unit, and vehicular control unit |
| JP2012016741A (en) * | 2010-07-09 | 2012-01-26 | Denso Corp | Laser fillet welding method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS493862A (en) * | 1972-05-04 | 1974-01-14 |
-
1981
- 1981-09-26 JP JP56152626A patent/JPS5853118A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS493862A (en) * | 1972-05-04 | 1974-01-14 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5853118A (en) | 1983-03-29 |
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