JPH03176919A - Welding method of multilayer contact - Google Patents
Welding method of multilayer contactInfo
- Publication number
- JPH03176919A JPH03176919A JP2114840A JP11484090A JPH03176919A JP H03176919 A JPH03176919 A JP H03176919A JP 2114840 A JP2114840 A JP 2114840A JP 11484090 A JP11484090 A JP 11484090A JP H03176919 A JPH03176919 A JP H03176919A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- multilayer
- welding
- base material
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003466 welding Methods 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims description 6
- 239000000463 material Substances 0.000 claims abstract description 34
- 239000010953 base metal Substances 0.000 claims abstract description 6
- 238000007789 sealing Methods 0.000 abstract 1
- 238000002845 discoloration Methods 0.000 description 3
- 238000005253 cladding Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910003336 CuNi Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005493 welding type Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
- H01H2011/0087—Welding switch parts by use of a laser beam
Landscapes
- Laser Beam Processing (AREA)
- Manufacture Of Switches (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野］
本発明は、リレーやスイッチ等の接点ばねや端子板に多
層接点を溶接する方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for welding multilayer contacts to contact springs and terminal plates of relays, switches, etc.
〔従来の技術］
従来この種の溶接は、接点を基材に位置ぎめしたのち、
前記接点および基材を電極間に挟持し、約１０００Ａ〜
１５００Ａ程度の高電流を流すという抵抗溶接が用いら
れていた。[Prior art] Conventionally, this type of welding involves positioning the contact on the base material and then
The contact point and the base material are sandwiched between electrodes, and a
Resistance welding was used in which a high current of about 1500A was passed.
〔発明が解決しようとする課題］
従来例で説明した抵抗溶接方法は、接点と基材間の高い
溶接強度が得られるという利点を有している。[Problems to be Solved by the Invention] The resistance welding method described in the conventional example has the advantage that high welding strength can be obtained between the contact and the base material.
しかしながら、通常接点で開閉する数Ａ程度の負荷電流
に比べて、前記溶接時には、数１００倍以上の電流が流
れるため、溶接電流値や電極による接点−基材への加圧
力など、溶接諸条件がうまく設定されていないと、散り
（基材等の）が発生し、基材の材料が接点の接触面に付
着したり、基材そのものが電極に付着することにより、
接点の接触面が荒れてしまい、接触信頼性が悪くなると
いう問題があった。However, compared to the load current of about several A that normally opens and closes with contacts, a current several hundred times or more flows during welding, so various welding conditions such as the welding current value and the pressure applied between the contact and the base material by the electrodes are required. If it is not set properly, scattering (of the base material, etc.) may occur, and the base material may adhere to the contact surface of the contact, or the base material itself may adhere to the electrode.
There was a problem in that the contact surfaces of the contacts became rough, resulting in poor contact reliability.
また、抵抗溶接は部材間の安定した溶接を得るためには
、ある程度以上（たとえば、約５０ｍ５ｅｃ）、の連続
して高電流を流す必要があるが、この溶接時に発生ずる
熱により、接点接触面が変色する場合かあり、この変色
によっても、接触抵抗等か高くなり接触信頼性が悪くな
るという問題があった。In addition, in resistance welding, in order to obtain stable welding between parts, it is necessary to continuously flow a high current of more than a certain level (for example, about 50 m5ec), but the heat generated during welding causes the contact surface to This discoloration also causes problems such as increased contact resistance and poor contact reliability.
本発明は前記問題点に着目し改善を図ったものであって
、その目的とするところは、接触面の荒れ等をなくし、
接触信頼性の高い多層接点の溶接方法を提供するにある
。The present invention focuses on the above-mentioned problems and attempts to improve them, and its purpose is to eliminate roughness of the contact surface, etc.
The object of the present invention is to provide a method for welding multilayer contacts with high contact reliability.
前記目的を達成するため、本発明では、前記多層接点の
母材を接点ばねの貫通孔をふさぐ位置に設け、該貫通孔
側より照射した・レーザー光により多層接点を接点ばね
に溶接し、かつ前記多層接点の溶接個所を少なくとも母
村内に収めている。In order to achieve the above object, the present invention provides the base material of the multilayer contact at a position that blocks the through hole of the contact spring, and the multilayer contact is welded to the contact spring by laser light irradiated from the through hole side, and The welding location of the multilayer contact is contained at least within the base.
〔作 用］
前記多層接点の母材を接点ばねの貫通孔をふさぐ位置に
設Ｌｊ、該貫通孔側より照射したレーザー光により多層
接点を接点ばねに溶接しているので、接触層の荒れがな
く、かつ前記多層接点の溶接個所を少なくとも母村内に
収めているので、接触層への溶接熱の影害を極力低く抑
えることができる。[Function] The base material of the multilayer contact is set at a position Lj that blocks the through hole of the contact spring, and the multilayer contact is welded to the contact spring by laser light irradiated from the through hole side, so that the contact layer is not rough. In addition, since the welding point of the multilayer contact is located at least within the base layer, the influence of welding heat on the contact layer can be suppressed to the lowest possible level.
以下本発明をリレーに適応した一実施例を第１図〜第２
図に基つき説明する。An embodiment in which the present invention is applied to a relay is shown in Figs. 1 to 2 below.
This will be explained based on the diagram.
１ば基材で、リン青銅のフープ材よりなり、所要の長さ
に分断して接点ばね５を構成するものである。The base material 1 is made of a phosphor bronze hoop material and is cut into required lengths to form the contact spring 5.
前記基材ｌは、約０．３〜０．５ｍｍの直径をした貫通
孔２を有している。The base material 1 has a through hole 2 having a diameter of approximately 0.3 to 0.5 mm.
３は多層接点であり、比較的低い熱伝導度のＣｕＮｉ等
の銅合金（たとえば、Ｎ１含有率が３０％の場合、０．
０６Ｃａ Ｉ／ｃｍ−３・’ Ｃ）よりなる母材３ａと
、該母材３ａに一体に積層された接触抵抗の低いＡｇＮ
ｉよりなる接触層３ｂと、該接触層３ｂの接触安定性
をさらに高めるためにその表面にごく薄く形成されたク
ランド層３ｃとより構成されている。3 is a multilayer contact, which has a relatively low thermal conductivity of a copper alloy such as CuNi (for example, when the N1 content is 30%, 0.
A base material 3a made of 06Ca I/cm-3・' C) and AgN with low contact resistance integrally laminated on the base material 3a.
The contact layer 3b is composed of a contact layer 3b made of aluminum, and a crand layer 3c formed very thinly on the surface of the contact layer 3b in order to further improve the contact stability of the contact layer 3b.
なお、比較的高容量の負荷を開閉する接点の場合はこの
クラット層３ｃを設げないこともある。Note that in the case of a contact that opens and closes a relatively high capacity load, this crut layer 3c may not be provided.
前記多層接点３を基材１に溶接する場合は、第１図（ａ
）に示すように、基材１を部材Ｘ−Ｙにて支持したのち
、部材Ｚによって多層接点３の母材３ａを前記基材１の
貫通孔２の位置に対応さ一已て加圧力Ｆで当接したのち
、貫通孔２側よりレーザー光Ａを照射し、同図（ｂ）に
示めされるように基材１と母＋Ａ’３ａの両者を溶かし
て、溶接接合するものである。When welding the multilayer contact 3 to the base material 1, the method shown in FIG.
), after the base material 1 is supported by the member X-Y, the base material 3a of the multilayer contact 3 is aligned with the position of the through hole 2 of the base material 1 by the member Z, and a pressing force F is applied. After making contact with each other, the laser beam A is irradiated from the side of the through hole 2, melting both the base material 1 and the base material + A'3a as shown in the same figure (b), and joining them by welding. .
前記レーザー光Ａによる溶接は、従来の抵抗溶接のよう
に接触層３ｂ（クラッド層３Ｃを設けた場合は、このク
ラッド層３ｃ）の表面を溶接時の高電流で荒らすことが
ない。また、このレーザー光Ａは、瞬間的に極めて高い
エネルギーを出して溶接することができるので、多層接
点３の溶接を短時間で行うことができ、しかもその溶接
部分が母材３ａ内に収められているので、前記接触層３
ｂの溶融が発生せず、そのため、該接触層３ｂの溶接熱
影響を極力低く抑えることができ、接触面の変色が発生
しない。Welding using the laser beam A does not damage the surface of the contact layer 3b (or the cladding layer 3c if a cladding layer 3C is provided) due to high current during welding, unlike conventional resistance welding. In addition, since this laser beam A can instantaneously emit extremely high energy for welding, the multilayer contact 3 can be welded in a short time, and the welded portion can be contained within the base metal 3a. Since the contact layer 3
Therefore, the influence of welding heat on the contact layer 3b can be suppressed as low as possible, and discoloration of the contact surface does not occur.
第２図には、前記基材１を所定形状に分断して形成した
接点ばね５を用いているリレーの一実施例が示されてい
る。同図において、Ａ’Ｃは接点部で、前記接点ばね５
および該接点ばね５の多層接点３により開閉される固定
した多層接点３゛を有する固定接点板６とより構成され
ている。FIG. 2 shows an embodiment of a relay using a contact spring 5 formed by cutting the base material 1 into predetermined shapes. In the figure, A'C is a contact portion, and the contact spring 5
and a fixed contact plate 6 having fixed multilayer contacts 3' opened and closed by the multilayer contacts 3 of the contact spring 5.
第３図は、前記多層接点３の裏面に基材１の貫通孔２に
嵌合される突起７を形成したものであって、基月１へ溶
接する前に多層接点３の位置ぎめを精度よくできるとと
もに、該接点３の仮固定ができ、かつ溶接体積が大きく
なり、溶接強度を高めることができる。FIG. 3 shows a structure in which a protrusion 7 is formed on the back surface of the multilayer contact 3 to be fitted into the through hole 2 of the base material 1, and the multilayer contact 3 is precisely positioned before welding to the base material 1. Not only can the contact points 3 be easily fixed, but also the welding volume can be increased and the welding strength can be increased.
以上説明したように、本発明は、多層接点の母材を接点
ばねの貫通孔をふさぐ位置に設け、該貫通孔側より照射
したレーザー光により多層接点を接点ばねに溶接してい
るので、従来の抵抗溶接のように接触層に高電流を流す
必要がなくなり、接触層の荒れがなく、接触信頼性の高
い多層接点の溶接ができるとともに前記多層接点の溶接
個所を少なくとも母村内に収めているので、接触層への
溶接熱の影Ｕを極力低く抑えることができ、接触面の変
色を防止することができるので、さらに接触信頼性を高
めることができるものである。As explained above, in the present invention, the base material of the multilayer contact is provided in a position that closes the through hole of the contact spring, and the multilayer contact is welded to the contact spring using a laser beam irradiated from the through hole side. Unlike resistance welding, there is no need to run a high current through the contact layer, the contact layer does not become rough, and multilayer contacts can be welded with high contact reliability, and the welding points of the multilayer contacts are kept at least within the main area. Therefore, the influence U of welding heat on the contact layer can be kept as low as possible, and discoloration of the contact surface can be prevented, so that contact reliability can be further improved.
第１図（ａ）は、本発明の一実施例を示した溶接状態の
縦断面図、
同図（ｂ）は、同上の縦断面図、
第２図は、本発明をリレーに適応した斜視図、第３図は
、他の実施例を示す縦断面図である。
２・・・貫通孔、
３・・・多層接点、３ａ・・
・接触層、
５・・・接点ばね、
Ａ・・・レーザー光。
母材、３ｂ・・FIG. 1(a) is a vertical cross-sectional view of an embodiment of the present invention in a welded state; FIG. 1(b) is a vertical cross-sectional view of the same as the above; FIG. 2 is a perspective view of the present invention applied to a relay. 3 are longitudinal sectional views showing other embodiments. 2... Through hole, 3... Multilayer contact, 3a... Contact layer, 5... Contact spring, A... Laser light. Base material, 3b...
Claims (1)
と、 熱伝導度が前記接点ばねと近似している高熱伝導度材料
からなる母材と低熱伝導度材料からなる接触層を積層し
て形成した多層接点とを有し、前記多層接点の母材を接
点ばねの貫通孔をふさぐ位置に設け、該貫通孔側より照
射したレーザー光により多層接点を接点ばねに溶接する
ものであって、 前記多層接点の溶接個所を少なくとも母材内に収めてな
ることを特徴とする多層接点の溶接方法。(1) A contact spring made of a high thermal conductivity material having a through hole, a base material made of a high thermal conductivity material whose thermal conductivity is similar to that of the contact spring, and a contact layer made of a low thermal conductivity material are laminated. A base material of the multilayer contact is provided at a position that closes a through hole of a contact spring, and the multilayer contact is welded to the contact spring by a laser beam irradiated from the through hole side, A method for welding a multilayer contact, characterized in that the welding location of the multilayer contact is contained at least within a base metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2114840A JPH03176919A (en) | 1990-04-27 | 1990-04-27 | Welding method of multilayer contact |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2114840A JPH03176919A (en) | 1990-04-27 | 1990-04-27 | Welding method of multilayer contact |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56152626A Division JPS5853118A (en) | 1981-09-26 | 1981-09-26 | Method of welding multilayer contact |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03176919A true JPH03176919A (en) | 1991-07-31 |
| JPH0434246B2 JPH0434246B2 (en) | 1992-06-05 |
Family
ID=14648021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2114840A Granted JPH03176919A (en) | 1990-04-27 | 1990-04-27 | Welding method of multilayer contact |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03176919A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104570415A (en) * | 2014-12-05 | 2015-04-29 | 合肥鑫晟光电科技有限公司 | Metal wire repairing method and metal wire repairing equipment |
| CN109986203A (en) * | 2019-04-23 | 2019-07-09 | 嘉兴宜鸿贸易有限公司 | A kind of laser soldering device |
-
1990
- 1990-04-27 JP JP2114840A patent/JPH03176919A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104570415A (en) * | 2014-12-05 | 2015-04-29 | 合肥鑫晟光电科技有限公司 | Metal wire repairing method and metal wire repairing equipment |
| US9772533B2 (en) | 2014-12-05 | 2017-09-26 | Boe Technology Group Co., Ltd. | Method and device for repairing metal wire |
| CN109986203A (en) * | 2019-04-23 | 2019-07-09 | 嘉兴宜鸿贸易有限公司 | A kind of laser soldering device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0434246B2 (en) | 1992-06-05 |
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