JPH0434246B2 - - Google Patents
Info
- Publication number
- JPH0434246B2 JPH0434246B2 JP2114840A JP11484090A JPH0434246B2 JP H0434246 B2 JPH0434246 B2 JP H0434246B2 JP 2114840 A JP2114840 A JP 2114840A JP 11484090 A JP11484090 A JP 11484090A JP H0434246 B2 JPH0434246 B2 JP H0434246B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- base material
- multilayer
- hole
- contact spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 43
- 238000003466 welding Methods 0.000 claims description 16
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims 1
- 238000002845 discoloration Methods 0.000 description 4
- 238000005253 cladding Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910003336 CuNi Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000005493 welding type Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
- H01H2011/0087—Welding switch parts by use of a laser beam
Landscapes
- Manufacture Of Switches (AREA)
- Laser Beam Processing (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、リレーやスイツチ等の接点ばねや端
子板に多層接点を溶接する方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for welding multilayer contacts to contact springs and terminal plates of relays, switches, etc.
従来この腫の溶接は、接点を基材に位置ぎめし
たのち、前記接点および基材を電極間に挟持し、
約1000A〜1500A程度の高電流を流すという抵抗
溶接が用いられていた。
Conventionally, this type of welding involves positioning the contact on the base material, then sandwiching the contact and the base material between electrodes,
Resistance welding was used, which involves passing a high current of about 1000A to 1500A.
従来例で説明した抵抗溶接方法は、接点と基材
間の高い溶接強度が得られるという利点を有して
いる。
The resistance welding method described in the conventional example has the advantage that high welding strength can be obtained between the contact and the base material.
しかしながら、通常接点で開閉する数Ａ程度の
負荷電流に比べて、前記溶接時には、数100倍以
上の電流が流れるため、溶接電流値や電極による
接点−基材への加圧力など、溶接諸条件がうまく
設定されていないと、散り（基材等の）が発生
し、基材の材料が接点の接触面に付着したり、基
材そのものが電極に付着することにより、接点の
接触面が荒れてしまい、接触信頼性が悪くなると
いう問題があつた。 However, compared to the load current of about several A that is normally used to open and close contacts, a current several hundred times higher flows during welding. If it is not set properly, scattering (of the base material, etc.) may occur, and the base material may adhere to the contact surface of the contact, or the base material itself may adhere to the electrode, causing the contact surface of the contact to become rough. This caused a problem in that contact reliability deteriorated.
また、抵抗溶接は部材間の安定した溶接を得る
ためには、ある程度以上（たとえば、約50msec）
の連続して高電流を流す必要があるが、この溶接
時に発生する熱により、接点接触面が変色する場
合があり、この変色によつても、接触抵抗等が高
くなり接触信頼性が悪くなるという問題があつ
た。 In addition, in resistance welding, in order to obtain stable welding between parts, it is necessary to
A high current needs to be passed continuously during welding, but the heat generated during welding may cause discoloration of the contact surface, and this discoloration also increases contact resistance and deteriorates contact reliability. There was a problem.
本発明は前記問題点に着目して改善を図つたも
のであつて、その目的とするところは、接触面の
荒れ等をなくし、接触信頼性の高い多層接点の溶
接方法を提供するにある。 The present invention is an attempt to improve the above-mentioned problems, and its purpose is to provide a welding method for multilayer contacts that eliminates roughness of the contact surface and has high contact reliability.
前記目的を達成するため、本発明では、前記多
層接点の母材を接点ばねの貫通孔をふさぐ位置に
設けるとともに該貫通孔に係合される突起を設
け、前記貫通孔を中心としてレーザー光を照射さ
せ突起及びその周辺の接点ばねのみを溶融するこ
とにより多層接点を接点ばねに溶接している。
In order to achieve the above object, in the present invention, the base material of the multilayer contact is provided in a position that blocks the through hole of the contact spring, and a protrusion that is engaged with the through hole is provided, and a laser beam is emitted centered around the through hole. The multilayer contact is welded to the contact spring by irradiating it and melting only the protrusion and the contact spring around it.
前記多層接点の母材を接点ばねの貫通孔をふさ
ぐ位置に設けるとともに該貫通孔に係合された突
起を設けてなり、貫通孔を中心として照射したレ
ーザー光により前記突起及びその周辺の接点ばね
のみを溶融して多層接点を該接点ばねに溶接して
いるので、低熱伝導度材料からなる接触層にはレ
ーザー光溶接による熱がほとんど伝達されなくな
り、前記接触層の荒れがなくなる。
The base material of the multilayer contact is provided at a position that blocks the through hole of the contact spring, and a protrusion is provided that is engaged with the through hole, and the contact spring in the protrusion and its surroundings is irradiated with a laser beam centered on the through hole. Since the multilayer contact is welded to the contact spring by melting only the contact layer, almost no heat due to laser beam welding is transmitted to the contact layer made of a low thermal conductivity material, and the contact layer is free from roughness.
以下本発明をリレーに適応した一実施例を第１
図〜第２図に基づき説明する。
The following is a first embodiment of the present invention applied to a relay.
This will be explained based on FIGS.
１は基材で、熱の伝導が高い高熱伝導度材料か
らなるリン青銅のフープ材よりなり、所要の長さ
に分断して接点ばね５を構成するものである。ま
た、前記基材１は、約0.3〜0.5mmの直径をした貫
通孔２を有している。 Reference numeral 1 denotes a base material, which is made of a phosphor bronze hoop material made of a material with high thermal conductivity and is divided into required lengths to form the contact spring 5. Further, the base material 1 has a through hole 2 having a diameter of about 0.3 to 0.5 mm.
３は多層接点であり、前記基材１と同等の比較
的高熱伝導度のCuNi等の銅合金（たとえば、Ni
含有率が30％の場合、0.06Cal／cm・Ｓ・℃）か
らなる母材３ａと、該母材３ａに一体に積層され
た母材３ａに比べ、熱伝導度が低く接触抵抗の低
いAgNiからなる接触層３ｂと、該接触層３ｂの
接触安定性をさらに高めるためにその表面にごく
薄く形成されたクラツド層３ｃとより構成されて
いる。 3 is a multilayer contact, which is made of a copper alloy such as CuNi (for example, Ni
When the content is 30%, the base material 3a consists of 0.06Cal/cm・S・℃) and the base material 3a is laminated integrally with the base material 3a. and a cladding layer 3c formed very thinly on the surface of the contact layer 3b in order to further enhance the contact stability of the contact layer 3b.
なお、前記母材３ａには、基材１の貫通孔２に
嵌合される突起７が一体に形成されており、前記
多層接点３を基材１にレーザー光Ａを照射して溶
接し固着する場合の多層接点３の取付位置決めが
精度よくできるようにしている。 Note that the base material 3a is integrally formed with a protrusion 7 that fits into the through hole 2 of the base material 1, and the multilayer contact 3 is welded and fixed by irradiating the base material 1 with laser light A. The mounting position of the multilayer contact 3 can be determined with high accuracy when the multilayer contact 3 is used.
なお、比較的高容量の負荷を開閉する接点の場
合は、前記クラツド層３ｃを設けなくてもよい。 Note that in the case of a contact that opens and closes a relatively high capacity load, the cladding layer 3c may not be provided.
前記多層接点３を基材１に溶接する場合は、第
１図ａに示すように、基材１を部材Ｘ，Ｙにて支
持したのち、部材Ｚによつて多層接点３の母材３
ａに設けた突起７を前記基材１の貫通孔２に嵌合
させた状態で加圧力Ｆにより多層接点３を接点ば
ね５に弾接し、貫通孔２の上方よりレーザー光Ａ
を照射し、同図ｂに示されるように基材１の貫通
孔２の周辺と母材３ａの突起７を溶融させる、こ
の時の接合状態は突起７および基材１間の両者が
溶融していればよく、溶融範囲は少なくとも同図
に示すように母材３ａ内に収まるように構成す
る、通常その接合条件に設定するには、各々設定
したレーザー光Ａにより得られる実験試料の多層
接点３内の断面写真から判断して最適レーザー光
照射条件を設定するものである。 When welding the multilayer contact 3 to the base material 1, as shown in FIG.
The multilayer contact 3 is brought into elastic contact with the contact spring 5 by pressing force F with the protrusion 7 provided in the base material 1 fitted into the through hole 2 of the base material 1, and the laser beam A is applied from above the through hole 2.
is irradiated to melt the periphery of the through hole 2 of the base material 1 and the protrusion 7 of the base material 3a, as shown in FIG. The melting range should be at least within the base material 3a as shown in the figure.Usually, in order to set the bonding conditions, the multilayer contact of the experimental sample obtained by each set laser beam A is The optimum laser light irradiation conditions are determined based on the cross-sectional photograph in 3.
なお、前記母材３ａは前述のごとく基材１と同
等の高熱伝導度材料からなつているため、レーザ
ー光Ａの熱量により該基材１とともになじみなが
ら両者同じように溶融する。この時に発生する溶
融熱は、接触層３ｂには、該層３ｂが低伝導度材
料からなるため極めて伝達され難く、特に溶融個
所から離れている接触表面には伝達されにくく、
その結果、接触表面の変色発生が殆ど起きないも
のである。 Since the base material 3a is made of a material with the same high thermal conductivity as the base material 1 as described above, it melts in the same manner as the base material 1 while blending in with the base material 1 due to the amount of heat of the laser beam A. The heat of fusion generated at this time is extremely difficult to be transmitted to the contact layer 3b because the layer 3b is made of a low conductivity material, and especially to the contact surface that is far from the melting point.
As a result, discoloration of the contact surface hardly occurs.
第２図には、前記基材１を所定形状に分断して
形成した接点ばね５を用いているリレーの一実施
例が示されている。同図において、ACは接点部
で、前記接点ばね５および該接点ばね５の多層接
点３により開閉される固定した多層接点３′を有
する固定接点板６とより構成されている。 FIG. 2 shows an embodiment of a relay using a contact spring 5 formed by cutting the base material 1 into predetermined shapes. In the figure, AC is a contact section, which is composed of the contact spring 5 and a fixed contact plate 6 having fixed multilayer contacts 3' that are opened and closed by the multilayer contacts 3 of the contact spring 5.
以上説明したように、本発明は、多層接点の母
材を接点ばねの貫通孔をふさぐ位置に設けるとと
もに該母材に貫通孔に係合する突起を設け、貫通
孔を中心に照射したレーザー光により多層接点を
接点ばねに溶接しているので、従来の抵抗溶接の
ように接触層に高電流を流す必要がなくなり、接
触層の荒れがなく、かつ、基材と母材の突起間で
の溶融を行つてるため、溶融個所は殆ど母材内に
収まり、接触層への溶接熱の影響を極力低く抑え
ることができ、接触面の変色を防止することがで
きるので、さらに接触信頼性を高めることができ
るものである。
As explained above, the present invention provides a base material of a multilayer contact at a position that blocks the through hole of a contact spring, and also provides a protrusion on the base material that engages with the through hole, and a laser beam irradiated centered on the through hole. Since the multi-layer contact is welded to the contact spring, there is no need to run high current through the contact layer as in conventional resistance welding, there is no roughening of the contact layer, and there is no need to apply a high current to the contact layer between the base material and the protrusion of the base material. Since the welding process is carried out, most of the melted parts are contained within the base metal, and the influence of welding heat on the contact layer can be kept to a minimum, and discoloration of the contact surface can be prevented, further improving contact reliability. It is something that can be improved.
第１図ａは、本発明の一実施例を示した溶接状
態の縦断面図、同図ｂは、同上の縦断面図、第２
ずは、本発明をリレーに適応した斜視図である。
２……貫通孔、３……多層接点、３ａ……母
材、３ｂ……接触層、５……接点ばね、７……突
起、Ａ……レーザー光。
FIG. 1a is a longitudinal cross-sectional view of a welded state showing one embodiment of the present invention, FIG. 1b is a longitudinal cross-sectional view of the same as the above, and
1 is a perspective view in which the present invention is applied to a relay. 2...Through hole, 3...Multilayer contact, 3a...Base material, 3b...Contact layer, 5...Contact spring, 7...Protrusion, A...Laser light.
Claims (1)
ばねと、 熱伝導度が前記接点ばねと近似している高熱伝
導度材料からなる母材と低熱伝導度材料からなる
接触層を積層して形成した多層接点とを有し、 前記多層接点の母材を接点ばねの貫通孔をふさ
ぐ位置に設け、該貫通孔を中心に照射したレーザ
ー光により多層接点を接点ばねに溶接するもので
あつて、 前記母材に接点ばねの貫通孔に係合される突起
を形成し、該突起及びその周辺の接点ばねのみを
溶融することにより多層接点を接点ばねに溶接し
てなることを特徴とする多層接点の溶接方法。[Scope of Claims] 1. A contact spring made of a high thermal conductivity material having a through hole, a base material made of a high thermal conductivity material whose thermal conductivity is similar to that of the contact spring, and a contact layer made of a low thermal conductivity material. a multilayer contact formed by laminating layers, the base material of the multilayer contact is provided at a position that blocks the through hole of the contact spring, and the multilayer contact is welded to the contact spring using a laser beam irradiated centered on the through hole. The multilayer contact is welded to the contact spring by forming a protrusion on the base material to be engaged with the through hole of the contact spring, and melting only the protrusion and the contact spring around the protrusion. Characteristic multilayer contact welding method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2114840A JPH03176919A (en) | 1990-04-27 | 1990-04-27 | Welding method of multilayer contact |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2114840A JPH03176919A (en) | 1990-04-27 | 1990-04-27 | Welding method of multilayer contact |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56152626A Division JPS5853118A (en) | 1981-09-26 | 1981-09-26 | Method of welding multilayer contact |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03176919A JPH03176919A (en) | 1991-07-31 |
| JPH0434246B2 true JPH0434246B2 (en) | 1992-06-05 |
Family
ID=14648021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2114840A Granted JPH03176919A (en) | 1990-04-27 | 1990-04-27 | Welding method of multilayer contact |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03176919A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104570415B (en) * | 2014-12-05 | 2017-07-18 | 合肥鑫晟光电科技有限公司 | The restorative procedure and prosthetic appliance of metal wire |
| CN109986203B (en) * | 2019-04-23 | 2021-05-25 | 昆山顺天金属制品有限公司 | Laser welding device |
-
1990
- 1990-04-27 JP JP2114840A patent/JPH03176919A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03176919A (en) | 1991-07-31 |
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