JPH01146317A - Film capacitor - Google Patents
Film capacitorInfo
- Publication number
- JPH01146317A JPH01146317A JP62306304A JP30630487A JPH01146317A JP H01146317 A JPH01146317 A JP H01146317A JP 62306304 A JP62306304 A JP 62306304A JP 30630487 A JP30630487 A JP 30630487A JP H01146317 A JPH01146317 A JP H01146317A
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- point metal
- lead
- lead wire
- protruding electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 33
- 238000002844 melting Methods 0.000 claims abstract description 28
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052718 tin Inorganic materials 0.000 claims abstract 3
- 229910052725 zinc Inorganic materials 0.000 claims abstract 3
- 230000008018 melting Effects 0.000 claims description 22
- 229910018182 Al—Cu Inorganic materials 0.000 abstract description 4
- 229910045601 alloy Inorganic materials 0.000 abstract description 4
- 239000000956 alloy Substances 0.000 abstract description 4
- 230000006378 damage Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 3
- 238000007747 plating Methods 0.000 abstract description 3
- 150000002739 metals Chemical class 0.000 abstract 4
- 238000003466 welding Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000003870 refractory metal Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 230000003685 thermal hair damage Effects 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004826 seaming Methods 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
この発明は、融電体としてフィルムを用いたフィルムコ
ンデンサに関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention relates to a film capacitor using a film as a melting body.
従来の技術
従来この種のフィルムコンデンサは、例えば特許６１−
３２５０８号公報に示されているように、第３図のよう
な構造になっていた。2. Prior Art Conventionally, this type of film capacitor has been disclosed in, for example, Patent No. 61-
As shown in Japanese Patent No. 32508, it had a structure as shown in FIG.
すなわち、１け両面または片面が金属化されたフィルム
を積層するか巻締した素子で、端面にメタリコン金属が
溶射され端面突出電極部２が形成されている。３け電極
引出し用リード線で表面は半田付は性を良好にするため
半田４がメツキされている。電極引出し用リード線３と
端面突出電極部２は溶接により電気的に接合されている
。素子１は二点鎖線６の内側に樹脂でモールドされてい
る。That is, it is an element made by laminating or seaming films that are metallized on both sides or one side, and metallicon metal is thermally sprayed on the end face to form the end face protruding electrode portion 2. The surface of the three electrode lead wires is plated with solder 4 to improve solderability. The electrode lead wire 3 and the end surface protruding electrode portion 2 are electrically connected by welding. The element 1 is molded with resin inside the two-dot chain line 6.
発明が解決しようとする問題点
しかし、このような構造のものでは、特に素子の小型化
に伴い電極引出し用リード線を端面突出電部高に溶接す
る際の熱影響で、素子のフィルムと端面突出電極部のコ
ンタクト部に外れが生じ誘電圧接特性の劣化や静電容量
減少という問題が発生していた。Problems to be Solved by the Invention However, with such a structure, due to the heat effect when welding the electrode lead wire to the height of the end protruding electric part due to the miniaturization of the element, the film of the element and the end face may be damaged. The contact portion of the protruding electrode portion may come off, causing problems such as deterioration of dielectric contact characteristics and reduction of capacitance.
また、溶接時の熱影響を少なくするためにリード線に低
融点の半田メツキを行、なったり、端面突出電極部にＺ
ｎ−８ｎ共晶合金を溶射したりする方法があるが、ＰＰ
Ｓのような熱可塑性の樹脂をモールドする際に電極引出
し用リード線と端面突出部との間の接合部（第２図に６
で示す）が高温の樹脂の流れにより加熱・加圧され、外
れが発生するという問題があった。In addition, in order to reduce the heat effect during welding, the lead wires are plated with low melting point solder, and the protruding electrodes on the end surfaces are coated with Z.
There is a method of thermal spraying n-8n eutectic alloy, but PP
When molding thermoplastic resin such as S, the joint between the electrode lead wire and the end protrusion (6
) was heated and pressurized by the flow of high-temperature resin, causing the problem that it would come off.
そこで本発明は、端面突出電極部と電極引出し用リード
線の接合部における耐熱性を向上させるとともに、素子
のフィルムと端面突出電極部のコンタクト部分の熱ダメ
ージを少なくすることができる構造のフィルムコンデン
サを提供することを目的とするものである。Therefore, the present invention provides a film capacitor having a structure that improves the heat resistance at the joint between the end protruding electrode part and the electrode lead wire, and also reduces heat damage to the contact part between the element film and the end protruding electrode part. The purpose is to provide the following.
問題を解決するだめの手段
そして上記問題点を解決するための本発明の技術的手段
は、素子の電極引出し用リード線が溶接される端面突出
電極部を、素子側ではＣｕ系の高融点金属によって、引
出し用リード線側ではＺｎ系、またはＳｎ系の低融点金
属によって構成したことを特徴とする。A means to solve the problem and a technical means of the present invention to solve the above-mentioned problems is to replace the protruding electrode portion on the end surface to which the lead wire for drawing out the electrode of the element is welded with a Cu-based high melting point metal on the element side. According to the invention, the lead wire side is made of a Zn-based or Sn-based low melting point metal.
作 用 この技術的手段による作用は次のようになる。For production The effect of this technical means is as follows.
すなわち、端面突出電極部の素子側ではＣｕ系の高融点
金属が溶射されておシ、素子の端面にある間隙にこの高
融点金属が入り込んで確実にコンタクトをとっている。That is, a Cu-based high melting point metal is thermally sprayed on the element side of the end face protruding electrode portion, and this high melting point metal enters the gap on the end face of the element to ensure contact.
このためこの高融点金属層の上にＺｎ系、またはＳｎ系
の金属からなる低融点金属層に電極引出し用リード線を
溶接する際、両者の溶接が容易でその溶接強度を確保す
ることができ、熱によって素子と高融点金属のコンタク
ト部が外れたシダメージをうけることはなく、誘電正接
特性お・よび静電容量を安定させることができる。Therefore, when an electrode lead wire is welded to a low melting point metal layer made of Zn-based or Sn-based metal on top of this high-melting point metal layer, both can be easily welded and the welding strength can be ensured. In this case, the contact portion between the element and the high-melting point metal does not come off due to heat and is not damaged, and the dielectric loss tangent characteristic and capacitance can be stabilized.
実施例
以下、本発明の一実施例を添付図面にもとづいて説明す
る。第１図において８は両面または片面が金属化された
フィルムを積層するか巻回した素子であシ、その端面９
には間隙が形成されている。Embodiment Hereinafter, one embodiment of the present invention will be described based on the accompanying drawings. In FIG. 1, 8 is an element made by laminating or winding films metallized on both sides or one side, and its end surface 9
A gap is formed between.
１ｏは端面突出電極部の素子側の高融点金属で、実施例
ではＡｌ−Ｃｕ合金をアーク溶射し、素子端面９の前記
間隙に侵入させ確実にコンタクトをとっている。１１は
前記高融点金属１０の上に形成された低融点金属で、実
施例ではＺｎをアーク溶射している。１２は電極引出し
用リード線で表面には半田付は性を考慮してＳｎメツキ
１３が施されている。低融点金属１１と電極引出し用リ
ード線１２の接合は、レーザ光１６を電極引出し線１２
の外側に集光させて加熱し、電極引出し用リード線１２
の表面に施されているＳｎメツキ１３と低融点金属１１
との間に相互拡散層１４を形成することによって行なう
。Reference numeral 1o denotes a high melting point metal on the element side of the end face protruding electrode portion, and in the embodiment, an Al-Cu alloy is arc sprayed and penetrates into the gap in the element end face 9 to ensure contact. 11 is a low melting point metal formed on the high melting point metal 10, and in the example, Zn is arc sprayed. Reference numeral 12 denotes a lead wire for drawing out the electrode, and the surface thereof is coated with Sn plating 13 in consideration of solderability. To join the low melting point metal 11 and the electrode lead wire 12, the laser beam 16 is connected to the electrode lead wire 12.
The light is focused on the outside of the electrode lead wire 12 and heated.
Sn plating 13 and low melting point metal 11 applied to the surface of
This is done by forming an interdiffusion layer 14 between them.
この様に本実施例ではフィルム素子８の端面９に高融点
金属であるＡｌ−Ｃｕ合属１０を侵入させて確実にコン
タクトをとっているため、磁極引出し用リード線１３の
外側より加熱しても高融点金属１ｏが溶融することはな
く確実にコンタクトが保たれている。素子８が小型化し
た場合、端面突出電極部の厚みが０．３になった場合で
も電極引出し用リード線１２を低融点金属１１へ溶接し
てもコンタクト部に熱ダメージを与えることはなかった
。As described above, in this embodiment, since the Al-Cu alloy 10, which is a high melting point metal, is infiltrated into the end surface 9 of the film element 8 to ensure contact, the magnetic pole lead wire 13 is heated from the outside. Also, the high melting point metal 1o does not melt and the contact is reliably maintained. When the element 8 was miniaturized, even when the thickness of the end protruding electrode portion became 0.3, no thermal damage was caused to the contact portion even when the electrode lead wire 12 was welded to the low melting point metal 11. .
なお上記実施例では端面突出電極部の素子側の高融点金
属１０としてＡｌ−Ｃｕ合金を用いたが実験を重ねた結
果、端面突出金属の素子側に高融金属として黄銅を用い
た場合も同じように小型の素子８に電極引出し用リード
線１２の溶接が可能となり溶接によるコンタクト部の熱
ダメージはなかった。In the above example, an Al-Cu alloy was used as the refractory metal 10 on the element side of the end protruding electrode portion, but as a result of repeated experiments, the same result can be obtained when brass is used as the refractory metal on the element side of the end protruding metal. As such, it became possible to weld the electrode lead wire 12 to the small element 8, and there was no heat damage to the contact portion due to welding.
また上記実施例では、前記高融点金属１０の上に形成さ
れた低融点金属１１としてＺｎを用いたが実験を重ねた
結果、低融点金属として５ｂ−Ｓｎ−ｐｂ 系半田を用
いた場合も同じように電極引出し用リード線との溶接強
度を確保でき、なおかつ、コンタクト部への熱ダメージ
はなかった。Further, in the above embodiment, Zn was used as the low melting point metal 11 formed on the high melting point metal 10, but as a result of repeated experiments, the same effect can be obtained when 5b-Sn-pb based solder is used as the low melting point metal. As such, welding strength with the electrode lead wire could be ensured, and there was no heat damage to the contact area.
さらに、上記実施例では溶接方法として、非接触方式の
レーザ光を用いたが、加圧力を正確にコントロールでき
加圧時の素子破壊がなければ同等の効果が得られる。Further, although a non-contact type laser beam is used as the welding method in the above embodiment, the same effect can be obtained if the pressurizing force can be accurately controlled and the element is not destroyed during pressurization.
発明の効果
本発明によれば、素子の端面突出電極部に電極引出し用
リード線を溶接する際、素子と端面突出電極部のコンタ
クト部分に与えられる熱ダメージを少くすることができ
るので、誘電圧接特性および静電容量の安定した信頼性
の高いフィルムコンデンサを提供することができる。Effects of the Invention According to the present invention, when an electrode lead wire is welded to the end surface protruding electrode portion of the element, it is possible to reduce the thermal damage caused to the contact portion between the element and the end surface protruding electrode portion, thereby reducing dielectric voltage contact. It is possible to provide a highly reliable film capacitor with stable characteristics and capacitance.
第１図は本発明の一実施例のフィルムコンデンサを示す
断面図、第２図は従来のフィルムコンデンサを示す断面
図である。
８・・・・・・素子、９・・・・・・端面、１０・・・
・・・高融点金属、１１・・・・・・低融点金属、１２
・・・・・・電極引出し用リード線。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名８−
１ｊ：、率FIG. 1 is a sectional view showing a film capacitor according to an embodiment of the present invention, and FIG. 2 is a sectional view showing a conventional film capacitor. 8... Element, 9... End face, 10...
...High melting point metal, 11...Low melting point metal, 12
...Lead wire for electrode extraction. Name of agent: Patent attorney Toshio Nakao and 1 other person8-
1j:, rate
Claims (1)
極部を、素子側ではＣｕ系の高融点金属によって、引出
し用リード線側ではＺｎ系、またはＳｎ系の低融点金属
によって構成したことを特徴とするフィルムコンデンサ
。The end face protruding electrode part to which the lead wire for drawing out the electrode of the element is welded is made of a high melting point metal such as Cu on the element side and a low melting point metal such as Zn or Sn on the side of the lead wire for drawing out. film capacitor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62306304A JPH01146317A (en) | 1987-12-03 | 1987-12-03 | Film capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62306304A JPH01146317A (en) | 1987-12-03 | 1987-12-03 | Film capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01146317A true JPH01146317A (en) | 1989-06-08 |
Family
ID=17955492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62306304A Pending JPH01146317A (en) | 1987-12-03 | 1987-12-03 | Film capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01146317A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106601503A (en) * | 2016-12-21 | 2017-04-26 | 南通新江海动力电子有限公司 | Film capacitor metal spraying process |
| CN110136957A (en) * | 2019-04-25 | 2019-08-16 | 浙江倍禹电气科技有限公司 | A kind of production technology of capacitor |
-
1987
- 1987-12-03 JP JP62306304A patent/JPH01146317A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106601503A (en) * | 2016-12-21 | 2017-04-26 | 南通新江海动力电子有限公司 | Film capacitor metal spraying process |
| CN110136957A (en) * | 2019-04-25 | 2019-08-16 | 浙江倍禹电气科技有限公司 | A kind of production technology of capacitor |
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