JP6817509B2 - Inductor parts and their manufacturing methods - Google Patents

Inductor parts and their manufacturing methods Download PDF

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JP6817509B2
JP6817509B2 JP2017025196A JP2017025196A JP6817509B2 JP 6817509 B2 JP6817509 B2 JP 6817509B2 JP 2017025196 A JP2017025196 A JP 2017025196A JP 2017025196 A JP2017025196 A JP 2017025196A JP 6817509 B2 JP6817509 B2 JP 6817509B2
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lead
joint
coil
phase diffusion
wire
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JP2018133403A (en
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佐藤 学
学 佐藤
樋渡 英敏
英敏 樋渡
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Panasonic Intellectual Property Management Co Ltd
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Description

本発明は、各種電子機器に用いられるインダクター部品およびその製造方法に関するものである。 The present invention relates to inductor components used in various electronic devices and methods for manufacturing the same.

従来から、インダクター部品のコイルの導線と金属端子とを溶接接合した構成を用いて、
金属端子に導線を絡げ配線した場合に比べてインダクター部品を小型化することが提案されている。
Conventionally, a configuration in which a coil lead wire of an inductor component and a metal terminal are welded and joined has been used.
It has been proposed that the inductor components be made smaller than when the wire is entwined with the metal terminals.

このような従来のインダクター部品について図面を参照しながら説明する。 Such a conventional inductor component will be described with reference to the drawings.

図13は従来のインダクター部品5を示す透過斜視図であり、図13において後述するブロック体6の内部を破線で示している。 FIG. 13 is a transparent perspective view showing the conventional inductor component 5, and the inside of the block body 6 described later in FIG. 13 is shown by a broken line.

図13に示すように従来のインダクター部品は、断面の直径が0.6〜1.5mmの導線1を巻回して面積が13mm×13mm程度のコイル2を形成し、コイル2の導線の端部3と外部回路とを接続するための金属端子4をアーク溶接により接続してインダクター部品5が構成されていた。 As shown in FIG. 13, in the conventional inductor component, a lead wire 1 having a cross-sectional diameter of 0.6 to 1.5 mm is wound to form a coil 2 having an area of about 13 mm × 13 mm, and an end portion of the lead wire of the coil 2 is formed. An inductor component 5 was formed by connecting a metal terminal 4 for connecting 3 and an external circuit by arc welding.

そして、コイル2と、コイル2の導線の端部3と金属端子4の溶接部分を磁性材料から成るブロック体6の内部に埋設し、金属端子4の外部接続部分をブロック体6の外部に露出させて、磁性体にコイル2を埋設したコイル埋設型のインダクター部品が構成されていた。 Then, the coil 2, the end portion 3 of the lead wire of the coil 2, and the welded portion of the metal terminal 4 are embedded inside the block body 6 made of a magnetic material, and the external connection portion of the metal terminal 4 is exposed to the outside of the block body 6. Then, a coil-embedded inductor component in which the coil 2 was embedded in the magnetic material was configured.

なお、この出願の発明に関連する先行技術文献情報としては、例えば、特許文献1が知られている。 As the prior art document information related to the invention of this application, for example, Patent Document 1 is known.

特開2004−103862号公報Japanese Unexamined Patent Publication No. 2004-103862

近年、電子機器の小型化が進み、インダクター部品にも小型化が要求され、例えばコイル埋設型のインダクター部品の面積が例えば4mm×4mmといった小型化の要求がされてきており、このような小型のインダクター部品では、コイルを形成する導線の断面の直径が0.1mm〜0.3mm程度の細い導線を用いて小さいコイルを形成する必要がある。 In recent years, the miniaturization of electronic devices has progressed, and the inductor components are also required to be miniaturized. For example, the area of the coil-embedded inductor component is required to be miniaturized, for example, 4 mm × 4 mm. In the inductor component, it is necessary to form a small coil by using a thin wire having a cross-sectional diameter of about 0.1 mm to 0.3 mm of the wire forming the coil.

そして、このような細い導線を用いてコイルを小さくしていくと、導線と金属端子との接続部分の面積が小さくなって、導線と金属端子の接続強度が不安定になりやすく、特に、コイル埋設型のインダクター部品とする場合には、接続部分の導線が磁性材料を成形するとときの応力を受けて外れてしまうという接続信頼性を低下させる恐れが生じてくる。 If the coil is made smaller by using such a thin conductor, the area of the connection portion between the conductor and the metal terminal becomes smaller, and the connection strength between the conductor and the metal terminal tends to become unstable. In particular, the coil In the case of an embedded inductor component, there is a risk that the connection reliability will be reduced because the lead wire of the connection portion will come off due to the stress of molding the magnetic material.

また、アーク溶接などで導線と金属端子を溶融させて接続しようとすると、コイルが小さいので溶融したときの熱がコイルに伝わりやすく、導線の絶縁被膜を熱劣化させて信頼
性を低下させる恐れが生じてくる。
Also, if you try to melt and connect the lead wire and the metal terminal by arc welding etc., the heat when melted is easily transferred to the coil because the coil is small, and there is a risk that the insulating coating of the lead wire will be thermally deteriorated and reliability will be reduced. It will occur.

本発明は、インダクター部品の小型化に起因した信頼性が低下することを防止した、インダクター部品およびその製造方法を提供することを目的としている。 An object of the present invention is to provide an inductor component and a method for manufacturing the inductor component in which reliability is prevented from being lowered due to miniaturization of the inductor component.

本発明は上記課題を解決するために、本発明のインダクター部品の構成は、導線が巻回されたコイル部と、導線の端部がコイル部の外方向に引き出された引き出し部と、金属板からなり、引き出し部が接続された継線部と、継線部と一体に形成され外部回路に接続される外部端子部を有する端子電極を備え、継線部が、引き出し部に沿って延伸された形状をしており、引き出し部の端末とコイル部との間に、引き出し部と継線部が固相拡散接合された固相拡散接合部を有し、引き出し部の端末に、引き出し部と継線部が溶融接合された溶融接合部を有する構成としたものである。 In order to solve the above problems, the present invention comprises a coil portion in which a lead wire is wound, a lead-out portion in which the end portion of the lead wire is pulled out in the outward direction of the coil portion, and a metal plate. It is provided with a terminal electrode having a joint wire portion to which a lead wire portion is connected and an external terminal portion formed integrally with the joint wire portion and connected to an external circuit, and the joint wire portion is extended along the lead wire portion. It has a solid shape, and has a solid-phase diffusion junction in which the lead-out portion and the connecting wire portion are solid-phase diffusion-bonded between the end of the lead-out portion and the coil portion. It is configured to have a melt-joint portion in which the joint wire portion is melt-joined.

また、本発明のインダクター部品の製造方法は、導線を巻回してコイル部を形成し、導線の端部をコイル部の外方向に引き出した引き出し部を形成する工程と、金属板を打ち抜き加工することにより、引き出し部を接続する継線部と、継線部と一体に外部回路に接続される外部端子部を有する端子電極を形成する工程と、引き出し部と継線部を接続する工程を備え、継線部は、引き出し部に沿って延伸された形状に形成するものであり、引き出し部と継線部を接続する工程は、引き出し部の端末とコイル部との間に、引き出し部と継線部を抵抗溶接により固相拡散接合した固相拡散接合部を形成し、固相拡散接合部を形成した後に、引き出し部の端末と継線部をレーザー溶接により溶融接合した溶融接合部を形成する製造方法としたものである。 Further, the method for manufacturing an inductor component of the present invention includes a step of winding a lead wire to form a coil portion and forming a lead-out portion in which the end portion of the lead wire is pulled out in the outward direction of the coil portion, and a metal plate is punched. This includes a step of forming a terminal electrode having a joint wire portion for connecting the lead wire portion and an external terminal portion integrally connected to the external circuit with the joint wire portion, and a step of connecting the lead wire portion and the joint wire portion. The joint wire portion is formed in a shape extended along the lead-out portion, and the step of connecting the lead-out portion and the joint wire portion is performed between the end of the lead-out portion and the coil portion between the lead-out portion and the joint portion. A solid-phase diffusion junction is formed by solid-phase diffusion bonding of the wire portion by resistance welding, and after the solid-phase diffusion junction is formed, a fusion junction is formed by fusion-bonding the end of the lead-out portion and the joint wire portion by laser welding. It is a manufacturing method to be used.

上記構成により、継線部が、引き出し部に沿って延伸された形状しているので、引き出し部の端末とコイル部との間に、引き出し部と継線部が固相拡散接合された固相拡散接合部を設けることができ、また、引き出し部の端末に、引き出し部と継線部が溶融接合された溶融接合部を設けることができ、継線部に引き出し部を二箇所接合された接続部分を有することにより、二箇所の接続部分が互いに補いながら引き出し部が継線部から外れることを抑制することができる。 With the above configuration, the connecting wire portion has a shape extended along the lead-out portion, so that the lead-out portion and the joint wire portion are solid-phase diffusion-bonded between the end of the lead-out portion and the coil portion. A diffusion joint can be provided, and the end of the lead-out can be provided with a melt-joint in which the lead-out and the joint are melt-joined, and the lead-out is joined in two places. By having the portion, it is possible to prevent the lead-out portion from coming off from the joint wire portion while the two connecting portions complement each other.

また、引き出し部の端末とコイル部との間に、引き出し部と継線部が固相拡散接合された固相拡散接合部を有し、引き出し部の端末に、引き出し部と継線部が溶融接合された溶融接合部を有する構成にして、コイル部に近い側の接続部を固相拡散接合部としているので、固相拡散接合は溶融接合に比べて、接合時の熱量を小さくすることができるために、導線の絶縁被膜の劣化を抑制することができるものである。 Further, between the end of the lead-out portion and the coil portion, the lead-out portion and the joint wire portion are solid-phase diffusion-bonded to each other, and the lead-out portion and the joint wire portion are melted at the end of the lead-out portion. Since the structure has a fused melt-bonded portion and the connection portion on the side close to the coil portion is a solid-phase diffusion junction, the solid-phase diffusion junction can reduce the amount of heat at the time of joining as compared with the melt-bonded. Therefore, it is possible to suppress the deterioration of the insulating film of the conducting wire.

また、本発明の製造方法では、引き出し部と継線部を接続する工程は、引き出し部の端末とコイル部との間に、引き出し部と継線部を抵抗溶接により固相拡散接合した固相拡散接合部を形成し、固相拡散接合部を形成した後に、引き出し部の端末と継線部をレーザー溶接により溶融接合した溶融接合部を形成する方法としているので、コイル部に近い側の固相拡散接合部の引き出し部と継線部の接触部分のみを、抵抗溶接の溶融しない温度での加熱と溶接電極の加圧力により固相拡散接合することができ、引き出し部の端末部分のレーザー溶接による溶融接合よりも小さい熱量となるために、導線の絶縁被膜の劣化を抑制することができる。 Further, in the manufacturing method of the present invention, in the step of connecting the lead-out portion and the joint wire portion, the lead-out portion and the joint wire portion are solid-phase diffusion-welded between the end of the lead-out portion and the coil portion by resistance welding. Since the method is to form a diffusion joint, a solid phase diffusion joint, and then a melt joint in which the end of the lead-out part and the joint wire are melt-welded by laser welding, the solid on the side close to the coil part is formed. Only the contact portion between the lead-out portion and the joint wire portion of the phase diffusion joint can be solid-phase diffuse-welded by heating at a temperature at which resistance welding does not melt and the pressure of the welding electrode, and laser welding of the end portion of the lead-out portion. Since the amount of heat is smaller than that of hot-dip welding, deterioration of the insulating coating of the conducting wire can be suppressed.

さらに、固相拡散接合部を形成した後に、引き出し部の端末と継線部をレーザー溶接により溶融接合した溶融接合部を形成しているので、レーザー溶接したときの熱は固相拡散接合部から継線部を通じて端子電極に放熱されるために、より導線の絶縁被膜の劣化を抑
制することができるものである。
Further, after the solid-phase diffusion junction is formed, the end of the lead-out portion and the joint wire portion are melt-bonded by laser welding to form a fusion junction, so that the heat generated by laser welding is generated from the solid-phase diffusion junction. Since heat is dissipated to the terminal electrodes through the joint wire portion, deterioration of the insulating coating of the lead wire can be suppressed.

このように、本発明のインダクター部品の構成およびその製造方法は、インダクター部品の小型化に起因した、コイルの引き出し部と端子電極の継線部との接続信頼性が低下することを抑制することができ、さらに引き出し部と継線部とを接続するときの導線の絶縁被膜の熱劣化を抑制することができるものである。 As described above, the structure of the inductor component and the method for manufacturing the inductor component of the present invention suppress the decrease in connection reliability between the coil lead-out portion and the terminal electrode joint wire portion due to the miniaturization of the inductor component. Further, it is possible to suppress thermal deterioration of the insulating coating of the lead wire when connecting the lead-out portion and the joint wire portion.

本発明の一実施の形態におけるインダクター部品の底面側の斜視図A perspective view of the bottom surface of the inductor component according to the embodiment of the present invention. 本発明の一実施の形態におけるインダクター部品の上面側の斜視図Top side perspective view of the inductor component according to the embodiment of the present invention. 本発明の一実施の形態におけるインダクター部品の底面側の透過斜視図Transparent perspective view of the bottom surface side of the inductor component according to the embodiment of the present invention. 本発明の一実施の形態におけるインダクター部品の上面側の透過斜視図Transparent perspective view of the upper surface side of the inductor component according to the embodiment of the present invention. 本発明の一実施の形態におけるインダクター部品の製造工程を説明する図The figure explaining the manufacturing process of the inductor component in one Embodiment of this invention. 本発明の一実施の形態におけるインダクター部品の製造工程を説明する図The figure explaining the manufacturing process of the inductor component in one Embodiment of this invention. 本発明の一実施の形態におけるインダクター部品の製造工程を説明する図The figure explaining the manufacturing process of the inductor component in one Embodiment of this invention. 本発明の一実施の形態におけるインダクター部品の製造工程を説明する図The figure explaining the manufacturing process of the inductor component in one Embodiment of this invention. 本発明の一実施の形態におけるインダクター部品の製造工程を説明する図The figure explaining the manufacturing process of the inductor component in one Embodiment of this invention. 本発明の一実施の形態におけるインダクター部品の製造工程を説明する図The figure explaining the manufacturing process of the inductor component in one Embodiment of this invention. 本発明の一実施の形態におけるインダクター部品の製造工程を説明する図The figure explaining the manufacturing process of the inductor component in one Embodiment of this invention. 本発明の一実施の形態におけるインダクター部品の製造工程を説明する図The figure explaining the manufacturing process of the inductor component in one Embodiment of this invention. 従来のインダクター部品の上面側の透過斜視図Transparent perspective view of the upper surface side of a conventional inductor component

以下、本発明の一実施の形態におけるインダクター部品について図1〜図4を参照して説明する。 Hereinafter, the inductor component according to the embodiment of the present invention will be described with reference to FIGS. 1 to 4.

なお、図3、図4は、後述する成形体24を透過した透過斜視図であり、成形体24の輪郭を破線で示している。さらに、図3、図4では理解を得やすくするために、後述する一対の外部端子部17の内、図面手前側の外部端子部17を透過して示しており、その輪郭を一点鎖線で示している。 It should be noted that FIGS. 3 and 4 are transparent perspective views that have passed through the molded body 24 described later, and the outline of the molded body 24 is shown by a broken line. Further, in FIGS. 3 and 4, in order to make it easier to understand, the external terminal portion 17 on the front side of the drawing is transparently shown among the pair of external terminal portions 17 described later, and the outline thereof is shown by a chain line. ing.

図1〜図4に示すように、本実施の形態のインダクター部品30は、絶縁被膜付き導線12が巻回されたコイル部11と、導線12の両端部の絶縁被膜が除去されコイル部11の外方向に引き出された引き出し部13と、金属板26からなり、引き出し部13が接続された継線部16と、継線部16と一体に形成され外部回路に接続される外部端子部17を有する一対の端子電極15を備えている。 As shown in FIGS. 1 to 4, in the inductor component 30 of the present embodiment, the coil portion 11 around which the conducting wire 12 with an insulating coating is wound and the insulating coatings at both ends of the conducting wire 12 are removed from the coil portion 11. A connecting wire portion 16 composed of a lead-out portion 13 drawn out in the outward direction and a metal plate 26 to which the lead-out portion 13 is connected, and an external terminal portion 17 formed integrally with the joint wire portion 16 and connected to an external circuit. It is provided with a pair of terminal electrodes 15 having the same.

そして、コイル部11、引き出し部13および継線部16が軟磁性体粉末と樹脂とからなる成形体24に埋設され、外部端子部17の一部が成形体から露出され、磁性体にインダクター部品30を埋設したコイル埋設型のインダクター部品を構成している。 Then, the coil portion 11, the lead-out portion 13, and the connecting wire portion 16 are embedded in the molded body 24 made of soft magnetic material powder and resin, a part of the external terminal portion 17 is exposed from the molded body, and the inductor component is formed in the magnetic material. It constitutes a coil-embedded inductor component in which 30 is embedded.

この内、コイル部11はポリアミドイミド等の絶縁被膜付きの導線12を巻き芯の形状を長円形状に巻回して形成されたものである。巻き芯の形状は長円形状に限定されるものではなく、円形状や四角形状のものであってもよい。 Of these, the coil portion 11 is formed by winding a lead wire 12 with an insulating film such as polyamide-imide around the winding core into an oval shape. The shape of the winding core is not limited to the oval shape, and may be a circular shape or a quadrangular shape.

このコイル部11を形成する導線12の断面の直径寸法は、成形体24の平面視の寸法が例えば4mm×4mm相当の小型のインダクター部品の場合、0.1mm〜0.3mm程度の細い導線を用いて、コイル部を巻回形成される。 The diameter of the cross section of the lead wire 12 forming the coil portion 11 is as thin as 0.1 mm to 0.3 mm in the case of a small inductor component having a plan view dimension of the molded body 24, for example, 4 mm × 4 mm. It is used to wind and form a coil portion.

引き出し部13は、コイル部11を平面視したときに、コイル部11の導線12の両端
部をコイル部11の外方向に引き出したもので、引き出した部分の導線12の絶縁被膜は剥離して除去されている。
When the coil portion 11 is viewed in a plan view, the lead-out portion 13 has both ends of the lead wire 12 of the coil portion 11 pulled out in the outward direction of the coil portion 11, and the insulating coating of the lead wire 12 of the drawn portion is peeled off. It has been removed.

そして、引き出し部13は、長円形状に形成したコイル部11の長手方向の外形よりも内側から、コイル部11の短手方向と同じ方向に引き出されている。 The drawer portion 13 is pulled out from the inside of the outer shape of the coil portion 11 formed in an oval shape in the longitudinal direction in the same direction as the lateral direction of the coil portion 11.

端子電極15は、厚さが0.1mmのりん青銅や純銅などの金属板からなり、引き出し部13が接続される継線部16と、継線部16と連接しコイル部11が固定されるコイル固定部18と、コイル固定部18と連接し外部回路に接続されるための外部端子部17を有し、継線部16とコイル固定部18および外部端子部17は一体に形成されている。 The terminal electrode 15 is made of a metal plate such as phosphor bronze or pure copper having a thickness of 0.1 mm, and is connected to the joint wire portion 16 to which the lead-out portion 13 is connected and the coil portion 11 to be fixed. It has a coil fixing portion 18 and an external terminal portion 17 for connecting to the coil fixing portion 18 and being connected to an external circuit, and the connecting wire portion 16, the coil fixing portion 18, and the external terminal portion 17 are integrally formed. ..

外部端子部17は、外部回路接続する形態に合わせて適宜加工される。図1〜図4に示したコイル埋設型のインダクター部品とした場合では、外部端子部17は成形体24の側面から突出させて露出され、成形体24の側面から底面に向かって折り曲げられ、成形体24の底面形成された外部端子部17を収納する収容凹部25に配置されて表面実装型の外部端子部17に加工されている。 The external terminal portion 17 is appropriately processed according to the form of connecting to an external circuit. In the case of the coil-embedded inductor component shown in FIGS. 1 to 4, the external terminal portion 17 is projected from the side surface of the molded body 24 to be exposed, and is bent from the side surface of the molded body 24 toward the bottom surface for molding. It is arranged in a housing recess 25 for accommodating the external terminal portion 17 formed on the bottom surface of the body 24, and is processed into a surface mount type external terminal portion 17.

コイル固定部18は、コイル部11の一部の形状に沿った形に形成され、コイル部11が接着剤27等で固定されている。図3、図4に示した例では、長円形状に形成したコイル部11の短手方向部分に沿う形状に形成されている。 The coil fixing portion 18 is formed in a shape that follows a part of the shape of the coil portion 11, and the coil portion 11 is fixed with an adhesive 27 or the like. In the examples shown in FIGS. 3 and 4, the coil portion 11 is formed in an oval shape along the lateral portion of the coil portion 11.

継線部16は、コイル固定部18に連接して引き出し部13に沿って延伸された形状に形成されている。 The connecting wire portion 16 is formed in a shape that is connected to the coil fixing portion 18 and extended along the drawing portion 13.

そして、継線部16には引き出し部13が重ね合わせられており、引き出し部13の端末14とコイル部11との間に、引き出し部13と継線部16が固相拡散接合された固相拡散接合部19を有し、引き出し部13の端末14に、引き出し部13と継線部16が溶融接合された溶融接合部20を有する。 A lead-out portion 13 is superposed on the joint wire portion 16, and the lead-out portion 13 and the joint wire portion 16 are solid-phase diffusion-bonded between the terminal 14 of the lead-out portion 13 and the coil portion 11. It has a diffusion joint portion 19, and the terminal 14 of the lead-out portion 13 has a melt-joint portion 20 in which the lead-out portion 13 and the connecting wire portion 16 are melt-bonded.

このようにすることにより、継線部16が、引き出し部13に沿って延伸された形状しているので、引き出し部13の端末14とコイル部11との間に、引き出し部13と継線部16が固相拡散接合された固相拡散接合部19を設けることができ、また、引き出し部13の端末14に、引き出し部13と継線部16が溶融接合された溶融接合部20を設けることができ、継線部16に引き出し部13を二箇所接合された接続部分を有することにより、二箇所の接続部分が互いに補いながら引き出し部13が継線部16から外れることを抑制して接続強度を向上することができる。 By doing so, since the joint wire portion 16 has a shape extended along the lead-out portion 13, the lead-out portion 13 and the joint wire portion are between the terminal 14 of the lead-out portion 13 and the coil portion 11. A solid-phase diffusion bonding portion 19 in which the 16 is solid-phase diffusion-bonded can be provided, and the terminal 14 of the lead-out portion 13 is provided with a melt-bonded portion 20 in which the lead-out portion 13 and the connecting wire portion 16 are melt-bonded. By having a connecting portion in which the lead-out portion 13 is joined in two places to the joint wire portion 16, the connection strength is suppressed by suppressing the lead-out portion 13 from coming off from the joint wire portion 16 while the two connection portions complement each other. Can be improved.

そして特に、コイル部11を埋設したコイル埋設型のインダクター部品としても、軟磁性体粉末と樹脂からなる磁性材料にコイル部11と継線部16を埋め込んで成形するときの応力に対して、二箇所接合された接続部分よって、引き出し部13が継線部16から外れることを抑制することができ、小型化したインダクター部品30であっても、コイル埋設型のインダクター部品を構成することができる。 In particular, even as a coil-embedded inductor component in which the coil portion 11 is embedded, the stress caused by embedding the coil portion 11 and the connecting wire portion 16 in a magnetic material made of soft magnetic material powder and resin is two. It is possible to prevent the lead-out portion 13 from coming off from the joint wire portion 16 due to the connection portion joined at the location, and even the miniaturized inductor component 30 can form a coil-embedded inductor component.

さらにまた、引き出し部13の端末14とコイル部11との間に、引き出し部13と継線部16が固相拡散接合された固相拡散接合部19を有し、引き出し部13の端末14に、引き出し部13と継線部16が溶融接合された溶融接合部20を有する構成にして、コイル部11に近い側の接続部を固相拡散接合部19としているので、固相拡散接合は溶融接合に比べて、接合時の熱量を小さくすることができるために、小型化したインダクター部品30であっても、導線12の絶縁被膜の劣化を抑制することができるものである。 Furthermore, between the terminal 14 of the lead-out portion 13 and the coil portion 11, there is a solid-phase diffusion joint portion 19 in which the lead-out portion 13 and the connecting wire portion 16 are solid-phase diffusion-bonded, and the terminal 14 of the lead-out portion 13 has a solid-phase diffusion joint portion 19. Since the lead-out portion 13 and the connecting wire portion 16 are melt-bonded to each other and the connection portion on the side close to the coil portion 11 is the solid-phase diffusion joint portion 19, the solid-phase diffusion joint is melted. Since the amount of heat at the time of joining can be reduced as compared with the joining, deterioration of the insulating coating of the conducting wire 12 can be suppressed even in the miniaturized inductor component 30.

また、継線部16は、引き出し部13の端末14とコイル部11との間に、引き出し部13に巻きついた帯状の固相拡散接合用係止片21を一体に有し、引き出し部13の端末14と継線部16の接触部分、ならびに引き出し部13と固相拡散接合用係止片21の接触部分が、固相拡散接合された固相拡散接合部19とすることが望ましい。 Further, the connecting wire portion 16 integrally has a band-shaped solid-phase diffusion bonding locking piece 21 wound around the drawing portion 13 between the terminal 14 of the drawing portion 13 and the coil portion 11, and the drawing portion 13 has a strip-shaped locking piece 21. It is desirable that the contact portion between the terminal 14 and the connecting wire portion 16 and the contact portion between the lead-out portion 13 and the locking piece 21 for solid-phase diffusion bonding be the solid-phase diffusion bonding portion 19 in which the solid-phase diffusion bonding is performed.

このようにすることにより、引き出し部13が継線部16と固相拡散接合用係止片21に挟み込まれて、引き出し部13の端末14と継線部16、引き出し部13と固相拡散接合用係止片21の接触部分の2箇所の固相拡散接合部19が形成されているので、引き出し部13と継線部16の接続信頼性をより向上することができる。 By doing so, the lead-out portion 13 is sandwiched between the joint wire portion 16 and the locking piece 21 for solid-phase diffusion bonding, and the terminal 14 and the joint wire portion 16 of the lead-out portion 13 and the lead-out portion 13 and the solid-phase diffusion bonding are joined. Since the solid-state diffusion joints 19 are formed at the two contact portions of the locking piece 21, the connection reliability between the lead-out portion 13 and the joint wire portion 16 can be further improved.

さらにまた、継線部16は、固相拡散接合用係止片21と間隔を空けて引き出し部13の端末14側に、引き出し部13に巻きついた帯状の溶融接合用係止片22を一体に有し、引き出し部13の端末14側の溶融接合用係止片22と引き出し部13の端末14および継線部16とが溶融接合された溶融接合部20とすることが望ましい。 Furthermore, the joint wire portion 16 integrates a strip-shaped fusion joining locking piece 22 wound around the drawing portion 13 on the terminal 14 side of the drawing portion 13 at a distance from the solid phase diffusion joining locking piece 21. It is desirable to form a melt-joined portion 20 in which the locking piece 22 for melt-joining on the terminal 14 side of the lead-out portion 13 and the terminal 14 and the joint wire portion 16 of the lead-out portion 13 are melt-bonded.

このようにすることにより、引き出し部13の端末14と継線部16だけを溶融接合した場合に比べて、引き出し部13の端末14側の溶融接合用係止片22と引き出し部13の端末14および継線部16を溶融接合したときの溶融玉23が大きくなり、引き出し部13と継線部16をより確実に接合することができるものである。 By doing so, as compared with the case where only the terminal 14 of the lead-out portion 13 and the connecting wire portion 16 are melt-bonded, the lock piece 22 for melt-joining on the terminal 14 side of the lead-out portion 13 and the terminal 14 of the drawer portion 13 The molten ball 23 when the joint wire portion 16 is melt-joined becomes larger, and the lead-out portion 13 and the joint wire portion 16 can be joined more reliably.

ここで、固相拡散接合用係止片21や溶融接合用係止片22が引き出し部13に巻きついたとは、固相拡散接合用係止片21や溶融接合用係止片22が、引き出し部13の周面に面接触することに限定されるものではなく、継線部16から折り返して、引き出し部13の延伸方向に沿った継線部16とは反対側の引き出し部13に被さっているものを含むものであり、固相拡散接合用係止片21や溶融接合用係止片22が引き出し部13に、面接触や線接触されていれば良いものである。 Here, the fact that the locking piece 21 for solid-phase diffusion bonding and the locking piece 22 for fusion bonding are wound around the drawer portion 13 means that the locking piece 21 for solid-phase diffusion bonding and the locking piece 22 for fusion bonding are drawn out. The surface contact is not limited to the peripheral surface of the portion 13, but the joint wire portion 16 is folded back and covered with the lead-out portion 13 on the side opposite to the joint wire portion 16 along the extending direction of the lead-out portion 13. It suffices that the locking piece 21 for solid-phase diffusion bonding and the locking piece 22 for melt bonding are in surface contact or line contact with the drawing portion 13.

次に、上記した本実施の形態のインダクター部品30の製造方法について図5〜図12を参照して説明する。 Next, the method of manufacturing the inductor component 30 of the present embodiment described above will be described with reference to FIGS. 5 to 12.

図5〜図12は、本発明の一実施の形態におけるインダクター部品30を用い、インダクター部品30を磁性体に埋設したコイル埋設型のインダクター部品の製造工程を説明する図である。なお、図5〜図12では、インダクター部品30の底面となる側を図面の上側にして示している。 5 to 12 are views for explaining a manufacturing process of a coil-embedded inductor component in which the inductor component 30 is embedded in a magnetic material using the inductor component 30 according to the embodiment of the present invention. In FIGS. 5 to 12, the side of the inductor component 30 which is the bottom surface is shown as the upper side of the drawing.

最初に、図5に示すように、絶縁被膜付き導線12を巻回してコイル部11を形成し、導線12の両端部の絶縁被膜を除去してコイル部11の外方向に引き出した引き出し部13を形成する。このコイル部11は長円形状に形成し、両引き出し部13は、長円形状に形成したコイル部11の長手方向の外形よりも内側から、コイル部11の短手方向と同じ方向に引き出す。 First, as shown in FIG. 5, a lead wire 12 with an insulating coating is wound to form a coil portion 11, the insulating coatings at both ends of the lead wire 12 are removed, and the lead wire portion 13 is pulled out outward from the coil portion 11. To form. The coil portion 11 is formed in an oval shape, and both drawing portions 13 are pulled out from the inside of the outer shape of the coil portion 11 formed in an oval shape in the longitudinal direction in the same direction as the lateral direction of the coil portion 11.

次に、図6に示すように、 金属板26を打ち抜き加工することにより一対の端子電極15を形成する。 Next, as shown in FIG. 6, a pair of terminal electrodes 15 are formed by punching the metal plate 26.

一対の端子電極15は、それぞれ引き出し部13を接続する継線部16と、継線部16と連接しコイル部11を固定するコイル固定部18と、コイル固定部18と連接し外部回路に接続されるための外部端子部17を一体に形成する。 The pair of terminal electrodes 15 are connected to an external circuit by connecting to a joint wire portion 16 connecting the lead-out portion 13, a coil fixing portion 18 connecting to the connecting wire portion 16 and fixing the coil portion 11, and a coil fixing portion 18. The external terminal portion 17 for being used is integrally formed.

継線部16は、コイル部11の引き出し部13に沿うように、予め引き出し部13の位置および寸法に合わせて形成し、コイル固定部18は、コイル部11の一部の形状に沿っ
た形に形成する。図6に示した例では長円形状に形成したコイル部11の短手方向部分の形状に沿う形に形成している。一対の外部端子部17は、互いに反対方向に延伸させて形成する。
The connecting wire portion 16 is formed in advance according to the position and dimensions of the drawer portion 13 so as to be along the lead-out portion 13 of the coil portion 11, and the coil fixing portion 18 has a shape that follows a part of the shape of the coil portion 11. To form. In the example shown in FIG. 6, the coil portion 11 is formed in a shape that follows the shape of the lateral portion of the coil portion 11 that is formed in an oval shape. The pair of external terminal portions 17 are formed by extending them in opposite directions.

また、継線部16には、引き出し部13の端末14とコイル部11との間に、継線部16の延伸方向と交差する方向に帯状の固相拡散接合用係止片21を一体に形成する。図6に示した例では、継線部16の延伸方向と直交する方向に固相拡散接合用係止片21を形成している。 Further, in the joint wire portion 16, a band-shaped locking piece 21 for solid-phase diffusion bonding is integrally formed between the terminal 14 of the lead-out portion 13 and the coil portion 11 in a direction intersecting the extending direction of the joint wire portion 16. Form. In the example shown in FIG. 6, the solid-phase diffusion bonding locking piece 21 is formed in the direction orthogonal to the extending direction of the connecting wire portion 16.

さらに、継線部16には、固相拡散接合用係止片21と間隔を空けて、引き出し部13の端末14が配置される側に、継線部16の延伸方向と交差する方向に延びる帯状の溶融接合用係止片22を一体に形成する。図6に示した例では、継線部16の延伸方向と直交する方向に溶融接合用係止片22を形成している。 Further, the joint wire portion 16 extends in a direction intersecting the extension direction of the joint wire portion 16 on the side where the terminal 14 of the lead-out portion 13 is arranged at a distance from the locking piece 21 for solid phase diffusion bonding. The band-shaped locking piece 22 for melt bonding is integrally formed. In the example shown in FIG. 6, the melting joining locking piece 22 is formed in the direction orthogonal to the extending direction of the connecting wire portion 16.

この端子電極15は個片で形成してもよいが、図6のようにフープ材に形成すると連続生産が可能となり、生産性を向上させることができるので好ましい。 The terminal electrode 15 may be formed of individual pieces, but it is preferable to form the terminal electrode 15 in a hoop material as shown in FIG. 6 because continuous production is possible and productivity can be improved.

次に、図7、図8に示すように、コイル固定部18に接着剤27を塗布し、コイル固定部18にコイル部11を配置して、コイル固定部18にコイル部11を固定する。 Next, as shown in FIGS. 7 and 8, the adhesive 27 is applied to the coil fixing portion 18, the coil portion 11 is arranged on the coil fixing portion 18, and the coil portion 11 is fixed to the coil fixing portion 18.

このとき、上面視で引き出し部13と継線部16が重なるように接着固定する。
次に、図9に示すように、固相拡散接合用係止片21および溶融接合用係止片22を、引き出し部13に巻きつけるように加工する。
At this time, the lead-out portion 13 and the joint wire portion 16 are adhesively fixed so as to overlap each other when viewed from above.
Next, as shown in FIG. 9, the solid phase diffusion bonding locking piece 21 and the melt bonding locking piece 22 are processed so as to be wound around the drawer portion 13.

次に、引き出し部13の端末14とコイル部11との間の、固相拡散接合用係止片21、引き出し部13、継線部16を抵抗溶接により固相拡散接合した固相拡散接合部19を形成する。 Next, the solid-phase diffusion joining portion in which the locking piece 21, the drawing portion 13, and the connecting wire portion 16 for solid-phase diffusion bonding between the terminal 14 of the drawing portion 13 and the coil portion 11 are solid-phase diffusion bonded by resistance welding. 19 is formed.

固相拡散接合部19は、固相拡散接合用係止片21、引き出し部13、継線部16を上下方向から抵抗溶接機の溶接電極(図示せず)で挟んで溶接電流を通電し、固相拡散接合用係止片21と引き出し部13の接触部分、引き出し部13と継線部16の接触部分を溶融しない温度に発熱させながら、溶接電極で圧力を加えることにより固相拡散接合させて形成する。 The solid-phase diffusion bonding portion 19 sandwiches the locking piece 21, the lead-out portion 13, and the connecting wire portion 16 for solid-phase diffusion bonding from above and below between welding electrodes (not shown) of a resistance welder, and energizes a welding current. Solid-phase diffusion bonding is performed by applying pressure with a welding electrode while generating heat at a temperature at which the contact portion between the locking piece 21 for solid-phase diffusion bonding and the lead-out portion 13 and the contact portion between the lead-out portion 13 and the connecting wire portion 16 do not melt. To form.

このようにすることにより、コイル部11に近い側の、固相拡散接合用係止片21と引き出し部13の接触部分、および引き出し部13と継線部16の接触部分のみを、抵抗溶接の溶融しない温度での加熱と溶接電極の加圧力により固相拡散接合することができ、レーザー溶接による溶融接合よりも小さい熱量となるために、導線12の絶縁被膜絶縁被膜の劣化を抑制することができる。 By doing so, only the contact portion between the solid-phase diffusion bonding locking piece 21 and the lead-out portion 13 and the contact portion between the lead-out portion 13 and the joint wire portion 16 on the side close to the coil portion 11 are subjected to resistance welding. Solid-phase diffusion bonding can be performed by heating at a temperature that does not melt and pressing of the welding electrode, and the amount of heat is smaller than that of fusion bonding by laser welding. Therefore, deterioration of the insulating coating of the lead wire 12 can be suppressed. it can.

次に、図10に示すように、固相拡散接合部19を形成した後に、溶融接合用係止片22を含む継線部16と引き出し部13の端末14をレーザー溶接することにより、溶融玉23となった溶融接合部20を形成する。 Next, as shown in FIG. 10, after forming the solid-phase diffusion joint portion 19, the joint wire portion 16 including the lock piece 22 for melt joint and the terminal 14 of the lead-out portion 13 are laser-welded to form a molten ball. The molten joint portion 20 which has become 23 is formed.

溶融接合部20は、引き出し部13の端末14と、引き出し部13端末14側の溶融接合用係止片22を含む継線部16に、上方または下方からレーザー光を照射して、溶融接合用係止片22を含む継線部16と引き出し部13の端末14を溶融させて溶融接合させて形成する。 The melt-joining portion 20 irradiates the terminal 14 of the lead-out portion 13 and the joint wire portion 16 including the hot-dip joining locking piece 22 on the lead-out portion 13 terminal 14 side with laser light from above or below to perform melt-joining. The joint wire portion 16 including the locking piece 22 and the terminal 14 of the lead-out portion 13 are melted and melt-bonded to form.

このように固相拡散接合部19を形成した後に、溶融接合用係止片22を含む継線部1
6と引き出し部13の端末14をレーザー溶接により溶融接合した溶融接合部20を形成しているので、レーザー溶接したときの熱は、既に形成された固相拡散接合部19から継線部16を通じて外部端子部17に放熱されるために、より導線12の絶縁被膜絶縁被膜の劣化を抑制することができる。
After forming the solid phase diffusion joint portion 19 in this way, the joint wire portion 1 including the locking piece 22 for melt bonding
Since the melt-bonded portion 20 in which the terminal 14 of the lead-out portion 13 and the lead-out portion 13 is melt-bonded by laser welding is formed, the heat at the time of laser welding is transferred from the already formed solid-phase diffusion joint portion 19 through the joint wire portion 16. Since heat is dissipated to the external terminal portion 17, deterioration of the insulating coating of the lead wire 12 can be suppressed.

この場合、図9で説明した固相拡散接合部19を抵抗溶接するときに、溶融接合用係止片22を含む継線部16と引き出し部13の端末14もあわせて抵抗溶接しておくと、溶融接合用係止片22と引き出し部13との間、引き出し部と継線部16との間に間隔をなくすことができるので、レーザー溶接して溶融接合部20を形成することが容易となるので好ましい。 In this case, when the solid-phase diffusion bonding portion 19 described with reference to FIG. 9 is resistance-welded, the joint wire portion 16 including the locking piece 22 for fusion welding and the terminal 14 of the lead-out portion 13 are also resistance-welded. Since it is possible to eliminate the gap between the locking piece 22 for melt joining and the lead-out portion 13 and between the lead-out portion and the joint wire portion 16, it is easy to form the melt-joint portion 20 by laser welding. It is preferable because it becomes.

ここで、図9を用いて説明した、固相拡散接合用係止片21および溶融接合用係止片22を、引き出し部13に巻きつけるように加工するとは、引き出し部13の周面に面接触させることに限定されるものではなく、固相拡散接合用係止片21および溶融接合用係止片22が継線部16から折り返して、継線部16とは反対側の引き出し部13に被さるように加工するものも含むものであり、抵抗溶接するときに溶接電極で挟むことによって、固相拡散接合用係止片21や溶融接合用係止片22が引き出し部13に、面接触や線接触されていれば良いものである。 Here, processing the locking piece 21 for solid-phase diffusion bonding and the locking piece 22 for fusion welding described with reference to FIG. 9 so as to be wound around the drawing portion 13 means that the peripheral surface of the drawing portion 13 is surfaced. The locking piece 21 for solid-phase diffusion bonding and the locking piece 22 for fusion welding are folded back from the joint wire portion 16 to the lead-out portion 13 on the opposite side of the joint wire portion 16, without being limited to contacting. It also includes those that are processed so as to cover, and by sandwiching it between welding electrodes during resistance welding, the locking piece 21 for solid-phase diffusion bonding and the locking piece 22 for melt bonding come into surface contact with the lead-out portion 13. It suffices if they are in line contact.

次に、図11に示すように、端子電極15の外部端子部17の一部を除いて、コイル部11、引き出し部13、端子電極15の継線部16、および軟磁性体粉末と樹脂の混合物からなる磁性材料を成形金型のキャビティー(図示せず)内に配置して成形し、成形体24を形成する。 Next, as shown in FIG. 11, except for a part of the external terminal portion 17 of the terminal electrode 15, the coil portion 11, the lead-out portion 13, the connecting portion 16 of the terminal electrode 15, and the soft magnetic material powder and the resin. A magnetic material composed of a mixture is placed in a cavity (not shown) of a molding die and molded to form a molded body 24.

外部端子部17は成形体24の側面から突出するように成形し、成形体24の底面には外部端子部17を配置する収容凹部25を形成する。 The external terminal portion 17 is molded so as to protrude from the side surface of the molded body 24, and a housing recess 25 for arranging the external terminal portion 17 is formed on the bottom surface of the molded body 24.

このように本実施の形態では、前述したように軟磁性体粉末と樹脂からなる磁性材料にコイル部11と継線部16を埋め込んで成形するときの応力に対して、固相拡散接合部19と溶融接合部20の二箇所接合された接続部分よって、引き出し部13が継線部16から外れることを抑制することができるため、小型化したインダクター部品30であっても、コイル埋設型のインダクター部品を構成することができる。 As described above, in the present embodiment, as described above, the solid-phase diffusion joint portion 19 is subjected to the stress when the coil portion 11 and the joint wire portion 16 are embedded in the magnetic material composed of the soft magnetic material powder and the resin and formed. Since it is possible to prevent the lead-out portion 13 from coming off from the joint wire portion 16 by the connecting portion joined at two points of the melt-joined portion 20 and the melt-bonded portion 20, even if the inductor component 30 is miniaturized, the coil-embedded inductor is used. Parts can be constructed.

成形体24を形成する成形方法としては、例えば射出成形やトランスファー成形、軟磁性体粉末と樹脂の混合物を顆粒状に造粒した造粒粉の加圧成形などの成形方法が挙げられる。 Examples of the molding method for forming the molded body 24 include injection molding, transfer molding, and pressure molding of granulated powder obtained by granulating a mixture of soft magnetic powder and resin into granules.

次に、図12に示すように、外部端子部17を所定の長さで切断し、必要に応じて外部端子部17にはんだ等のめっきを施す。 Next, as shown in FIG. 12, the external terminal portion 17 is cut to a predetermined length, and the external terminal portion 17 is plated with solder or the like, if necessary.

最後に、外部端子部17を成形体24の側面から底面に向かって折り曲げ、成形体24の底面に形成した収容凹部25に外部端子部17を配置することにより、図1〜図4に示したコイル埋設型のインダクター部品を得ることができる。 Finally, the external terminal portion 17 is bent from the side surface of the molded body 24 toward the bottom surface, and the external terminal portion 17 is arranged in the accommodating recess 25 formed on the bottom surface of the molded body 24, as shown in FIGS. A coil-embedded inductor component can be obtained.

なお、上記した本実施の形態のインダクター部品の製造方法では、固相拡散接合用係止片21、溶融接合用係止片22を設けた例を説明したが、固相拡散接合用係止片21、溶融接合用係止片22を設けずに、抵抗溶接により固相拡散接合部19、レーザー溶接により溶融接合部20を形成してもよく、同様の作用効果を得ることができる。 In the method for manufacturing the inductor component of the present embodiment described above, an example in which the locking piece 21 for solid-phase diffusion bonding and the locking piece 22 for fusion welding are provided has been described, but the locking piece for solid-phase diffusion bonding has been described. 21. The solid-phase diffusion bonding portion 19 may be formed by resistance welding and the fusion bonding portion 20 may be formed by laser welding without providing the locking piece 22 for fusion welding, and the same effect can be obtained.

固相拡散接合用係止片21、溶融接合用係止片22を設けた場合、図9で説明した製造
工程において、引き出し部13に固相拡散接合用係止片21、溶融接合用係止片22を巻きつけることによって、的確に引き出し部13の位置決めができるという効果を得ることができる。
When the solid-phase diffusion bonding locking piece 21 and the fusion bonding locking piece 22 are provided, in the manufacturing process described with reference to FIG. 9, the solid-phase diffusion bonding locking piece 21 and the fusion bonding locking piece 21 are provided in the drawer portion 13. By winding the piece 22, it is possible to obtain the effect that the drawer portion 13 can be accurately positioned.

本発明に係るインダクター部品の構成およびその製造方法は、インダクター部品の小型化に起因した、コイルの引き出し部と端子電極の継線部との接続信頼性が低下することを抑制することができ、さらに引き出し部と継線部とを接続するときの導線の絶縁被膜の熱劣化を抑制することができ、産業上有用である。 The structure of the inductor component and the method for manufacturing the inductor component according to the present invention can suppress a decrease in connection reliability between the coil lead-out portion and the terminal electrode joint wire portion due to the miniaturization of the inductor component. Further, it is possible to suppress thermal deterioration of the insulating coating of the lead wire when connecting the lead-out portion and the joint wire portion, which is industrially useful.

11 コイル部
12 導線
13 引き出し部
14 端末
15 端子電極
16 継線部
17 外部端子部
18 コイル固定部
19 固相拡散接合部
20 溶融接合部
21 固相拡散接合用係止片
22 溶融接合用係止片
23 溶融玉
24 成形体
25 収容凹部
26 金属板
27 接着剤
30 インダクター部品
11 Coil part 12 Lead wire 13 Drawer part 14 Terminal 15 Terminal electrode 16 Joint wire part 17 External terminal part 18 Coil fixing part 19 Solid phase diffusion joint part 20 Melting joint part 21 Solid phase diffusion joining locking piece 22 Locking for melt joining Piece 23 Molten ball 24 Molded body 25 Accommodating recess 26 Metal plate 27 Adhesive 30 inductor parts

Claims (8)

導線が巻回されたコイル部と、前記導線の端部が前記コイル部の外方向に引き出された引き出し部と、金属板からなり、前記引き出し部が接続された継線部と、前記継線部と一体に形成され外部回路に接続される外部端子部を有する端子電極を備え、前記継線部が、前記引き出し部に沿って延伸された形状をしており、前記引き出し部の端末と前記コイル部との間に、前記引き出し部と前記継線部が固相拡散接合された固相拡散接合部を有し、前記引き出し部の端末に、前記引き出し部と前記継線部が溶融接合された溶融接合部を有することを特徴とするインダクター部品。 A coil portion around which a lead wire is wound, a lead-out portion in which the end portion of the lead wire is pulled out in the outward direction of the coil portion, a metal plate, and a joint wire portion to which the lead-out portion is connected, and the joint wire A terminal electrode having an external terminal portion formed integrally with the portion and connected to an external circuit is provided, and the joint wire portion has a shape extended along the lead-out portion, and the terminal of the lead-out portion and the said The lead-out portion and the joint wire portion are solid-phase diffusion-bonded to each other between the coil portion and the coil portion, and the lead-out portion and the joint wire portion are melt-bonded to the terminal of the lead-out portion. An inductor component characterized by having a molten junction. 前記継線部は、前記引き出し部の端末と前記コイル部との間に、前記引き出し部に巻きついた帯状の固相拡散接合用係止片を一体に有し、前記引き出し部の端末と前記継線部の接触部分ならびに前記引き出し部と前記固相拡散接合用係止片の接触部分に前記固相拡散接合部を有することを特徴とする請求項1記載のインダクター部品。 The joint wire portion integrally has a band-shaped solid phase diffusion bonding locking piece wound around the drawer portion between the terminal of the drawer portion and the coil portion, and the terminal of the drawer portion and the coil portion are described. The inductor component according to claim 1, wherein the solid phase diffusion joint portion is provided at the contact portion of the joint wire portion and the contact portion between the drawer portion and the locking piece for solid phase diffusion bonding. 前記継線部は、前記固相拡散接合用係止片と間隔を空けて前記引き出し部の端末側に、前記引き出し部に巻きついた帯状の溶融接合部用係止片を一体に有し、前記引き出し部の端末側の前記溶融接合部用係止片と前記引き出し部の端末および前記継線部とが溶融接合された前記溶融接合部を有することを特徴とする請求項2記載のインダクター部品。 The joint wire portion integrally has a strip-shaped fusion junction locking piece wound around the drawer on the terminal side of the drawer at a distance from the solid phase diffusion bonding locking piece. The inductor component according to claim 2, further comprising the melt-joint portion in which the locking piece for the melt-joint portion on the terminal side of the lead-out portion, the terminal of the drawer portion, and the joint wire portion are melt-bonded. .. 前記コイル部、前記引き出し部および前記継線部が軟磁性体粉末と樹脂とからなる成形体に埋設され、前記外部端子部が前記成形体から露出していることを特徴とする請求項1〜3のいずれかに記載のインダクター部品。 Claims 1 to 1, wherein the coil portion, the lead-out portion, and the joint wire portion are embedded in a molded body made of a soft magnetic powder and a resin, and the external terminal portion is exposed from the molded body. The inductor component according to any one of 3. 導線を巻回してコイル部を形成し、前記導線の端部を前記コイル部の外方向に引き出した引き出し部を形成する工程と、金属板を打ち抜き加工することにより、前記引き出し部を接続する継線部と、前記継線部と一体に外部回路に接続される外部端子部を有する端子電極を形成する工程と、前記引き出し部と前記継線部を接続する工程を備え、前記継線部は、前記引き出し部に沿って延伸された形状に形成するものであり、前記引き出し部と前記継線部を接続する工程は、前記引き出し部の端末と前記コイル部との間に、前記引き出し部と前記継線部を抵抗溶接により固相拡散接合した固相拡散接合部を形成し、前記固相拡散接合部を形成した後に、前記引き出し部の端末と前記継線部をレーザー溶接により溶融接合した溶融接合部を形成するものであるインダクター部品の製造方法。 A step of winding a lead wire to form a coil portion and forming a lead-out portion in which the end portion of the lead wire is pulled out in the outward direction of the coil portion, and a joint for connecting the lead-out portion by punching a metal plate. The joint portion comprises a step of forming a terminal electrode having a wire portion and an external terminal portion connected to an external circuit integrally with the joint wire portion, and a step of connecting the lead-out portion and the joint wire portion. , It is formed in a shape extended along the lead-out portion, and the step of connecting the lead-out portion and the joint wire portion is a step of connecting the lead-out portion and the coil portion between the end of the lead-out portion and the coil portion. A solid-phase diffusion joint was formed by solid-phase diffusion bonding of the joints by resistance welding, and after the solid-phase diffusion joint was formed, the end of the lead-out portion and the joint were melt-bonded by laser welding. A method for manufacturing an inductor component that forms a welded joint. 前記継線部には、前記引き出し部の端末と前記コイル部との間に、前記継線部の延伸方向と交差する方向に延びる帯状の固相拡散接合用係止片を一体に形成し、前記固相拡散接合用係止片を前記引き出し部に巻きつけた後に、前記引き出し部の端末と前記継線部の接触部分ならびに前記引き出し部と前記固相拡散接合用係止片の接触部分を抵抗溶接により前記固相拡散接合部を形成することを特徴とする請求項5記載のインダクター部品の製造方法。 In the joint wire portion, a band-shaped solid phase diffusion welding locking piece extending in a direction intersecting the extension direction of the joint wire portion is integrally formed between the end of the lead-out portion and the coil portion. After the locking piece for solid-phase diffusion bonding is wound around the drawer portion, the contact portion between the terminal of the drawer portion and the joint wire portion and the contact portion between the drawer portion and the locking piece for solid-phase diffusion bonding are formed. The method for manufacturing an inductor component according to claim 5, wherein the solid-phase diffusion junction is formed by resistance welding. 前記継線部には、前記固相拡散接合用係止片と間隔を空けて前記引き出し部の端末側に、前記継線部の延伸方向と交差する方向に延びる帯状の溶融接合用係止片を一体に形成し、前記溶融接合用係止片を前記引き出し部に巻きつけた後に、前記溶融接合用係止片を含む前記継線部と前記引き出し部の端末をレーザー溶接して前記溶融接合部を形成することを特徴とする請求項6記載のインダクター部品。 In the joint wire portion, a strip-shaped fusion welding locking piece extending in a direction intersecting the extending direction of the joint wire portion on the terminal side of the drawer portion at a distance from the solid phase diffusion bonding locking piece. Is integrally formed, and after the melt-joining locking piece is wound around the lead-out portion, the joint wire portion including the melt-joining locking piece and the end of the lead-out portion are laser-welded to perform the melt-joining. The inductor component according to claim 6, wherein a portion is formed. 前記端子電極の前記外部端子部の一部を除いて、前記コイル部、前記引き出し部、前記端子電極の前記継線部、および軟磁性体粉末と樹脂の混合物からなる磁性材料を成形金型のキャビティー内に配置して成形し、成形体を形成することを特徴とする請求項5〜7いず
れかに記載のインダクター部品の製造方法。
Except for a part of the external terminal portion of the terminal electrode, a magnetic material composed of the coil portion, the lead-out portion, the joint wire portion of the terminal electrode, and a mixture of soft magnetic powder and resin is formed into a molding die. The method for manufacturing an inductor component according to any one of claims 5 to 7, wherein the molded body is formed by arranging and molding in a cavity.
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