JP4651135B2 - Coil parts - Google Patents

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Publication number
JP4651135B2
JP4651135B2 JP25306998A JP25306998A JP4651135B2 JP 4651135 B2 JP4651135 B2 JP 4651135B2 JP 25306998 A JP25306998 A JP 25306998A JP 25306998 A JP25306998 A JP 25306998A JP 4651135 B2 JP4651135 B2 JP 4651135B2
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Japan
Prior art keywords
terminal
coil
portions
lead
terminal receiving
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JP2000091147A (en
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一三 小林
勉 小谷
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TDK Corp
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TDK Corp
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Description

【0001】
【発明の属する技術分野】
本発明は、チップインダクタ等のようなコイル部品に関するものである。
【0002】
【従来の技術】
従来のコイル部品50について図18乃至図21を参照して説明する。
【0003】
まず、図18に示すように、ドラム形に形成され、鍔部両側端面から突出する端子部54a、54bを設けた磁芯53にウレタン等の被覆付ワイヤからなるコイル部55を巻線するとともにコイル端末55a、55bを端子部54a、54bに各々絡げる。
【0004】
次に、リードフレームを打ち抜き、上部中央に前記端子部54a、54bを支持するための凹部52a、52bを設けたリード部51a、51bを用意し、図19に示すように前記磁芯53の端子部54a、54bを前記凹部52a,52bに嵌め込んで組み付ける。
【0005】
次に、端子部54a、54bの前記コイル端末絡げ部に半田ペースト57を塗布した後半田付け処理(例えば、温度条件としては、絶縁被覆剥離が必要なため半田溶融温度よりも高い400°C、半田付け時間 2秒程度)を行い、次に塩化メチレン等の洗浄材を使用した洗浄処理を施して不要部分に付着した半田及びフラックス等を除去する。
【0006】
次にリード部51a、51bの外部接続電極となる部分を残して樹脂モールド56にてモールド成形し、さらにリード部51a、51bのカットフォーミングを行い、図20に示すようにリード部51a、51bの外部電極となる露出部分が樹脂モールド56の壁面に当接する状態に折曲してコイル部品50とする(実開平5−29107号公報)。
【0007】
この後、コイル部品50は検査工程に送られる。これらの一連の工程を図21に示す。
【0008】
【発明が解決しようとする課題】
しかしながら、上述した従来のコイル部品50の場合、半田材として例えば共晶半田(液相線温度183°C)や、錫(Sn)リッチ半田(液相線温度220°C)を使用すると、コイル端末55a、55bの所謂銅くわれが生じて、コイル端末55a、55bが細くなってしまい、引っ張り強度の低下を招き接続の信頼性が十分でないとともに、径の細いワイヤを使用すると断線の事態に至るという課題があった。
【0009】
また、従来のコイル部品50の場合、半田フラックスも必要となり、洗浄工程が必須となって工程数の増加を招くという課題もあった。
【0010】
さらに、この種のコイル部品を電子装置のプリント基板に実装する場合、近年高まっている環境問題に対応するため、鉛フリー高温タイプの半田材でリフロー半田を行うケースが増えており、コイル部品内部の接続には、より高温の半田材を用いる必要がある。かかる高温半田(液相線温度250°C以上)としては、鉛を含有する半田材を使用するため、今度は作業環境の悪化を招くという課題が生じた。
【0011】
本発明は、上記事情に鑑みてなされたものであり、信頼性の高い接続状態を得ることができ、また、工程数の削減による製造コストの低廉化が可能であり、さらに、作業環境の改善をも図ることができるコイル部品を提供することを目的とする。
【0012】
【課題を解決するための手段】
請求項1記載の発明に係るコイル部品は、両側鍔部端面に端子部が突出形成され、コイルが巻装され、該コイルのコイル端末が引き出されて前記端子部に絡げられた磁芯と、前記コイル端末が絡げられた前記端子部が嵌合可能な凹溝とこの凹溝の外方に突出する突片とを備えた端子受部を有する外部接続用のリード部とからなり、前記リード部が前記磁芯の鍔部端面との間に隙間が形成されるように配置され、前記コイル端末が絡げられた前記端子部における、前記コイル端末の引き出し終端部分が前記隙間に位置し前記コイル端末絡げ部分が前記端子受部の突片に沿う位置となるように嵌合載置され、前記端子受部に載置された前記コイル端末が絡げられた端子部のうち前記端子受部における前記突片上に載置された部分を局部加熱することによって、前記端子部が前記端子受部の前記突片によって被われるように溶融接続されていることを特徴とするものである。
【0017】
【発明の実施の形態】
以下に、図1乃至図6を参照して、本発明の第1の実施の形態を説明する。
【0018】
(第1の実施の形態)本実施の形態のコイル部品1は、図1、図2に示すように、両側鍔部端面中央部から鉄又は銅からなる金属製の棒状に形成した端子部2a、2bを各々外方へ突設したドラム形の磁芯3に、ウレタン被覆等の被覆付ワイヤを用いたコイル部4を巻装するとともに、前記コイル部4のコイル端末4a、4bを引き出して前記端子部2a、2bに絡げ、この端子部2a、2bをリードフレーム10を成形加工して立脚形成した外部接続用のリード部5a、5bに設けた端子受部6a、6bに支持又は装着させる構造となっている。
この結果、図2及び図3に示すように、前記磁芯3の両側鍔部端面と前記リード部5a,5bとの間にはそれぞれ隙間が形成されている。そして、同じく図2及び図3に明示されるように前記コイル端末の引き出し終端部分が前記隙間に位置し、前記コイル端末絡げ部分が前記端子受部に配置される状態となっている。
【0019】
前記端子受部6a、6bは、その上部側に端子部2a、2bが嵌合可能な略U字状の凹溝7a、7bと、この凹溝7a、7bの底壁部分から各々外方に突出させた細長い突片8a、8bとを具備している。
【0020】
前記端子受部6a、6bに前記端子部2a、2bを装着した後、図示しないレーザ光源を用いて図3に示すようにレーザ光を端子部2a、2b、それに絡げられているコイル端末4a,4bあるいは、リードの端子受部6a,6bの少なくとも一部に照射して、局部的に加熱を行い、突片8a、8bを溶融させて端子部2a、2bとコイル端末4a,4bとに被せるようにし、あるいはコイル端末4a,4bと端子部2a,2bを溶融して、前記コイル端末と端子部とを前記端子受部の突片に溶け合せることによって、それぞれを電気的、機械的に接続する。
【0021】
この後、樹脂モールド11にてモールド成形し、さらにリード部5a、5bのカットフォーミングを行い、図5に示すようにリード部5a、5bの外部接続電極となる部分が樹脂モールド11の壁面に当接するように折曲された状態のコイル部品1を得る。
【0022】
このようにして得られたコイル部品1は、検査工程に送られる。これらの一連の工程を図6に示す。
【0023】
レーザ光源により端子部等に局部的に照射するレーザ光としては、例えば、直径0.4mm程度のスポット光を用い、端子部等の照射対象部に例えば5msec程度照射して当該照射部を1000°C程度の高温となるように照射して部分的に溶融する。この溶融処理はレーザ光源の他、アークによる溶融処理、プラズマによる溶融処理、高周波加熱による溶融処理などの局部加熱手段を用いることもできる。かかる局部加熱手段を用いれば、コイル端末,端子部,突片等を部分的選択的に加熱することができ、その加熱程度の制御も可能である。
【0024】
上述のようにして溶融処理した端子部2a,2bのリード部5a,5bに対する剥離試験の引張り強度(端子部2aの突出方向に沿った引張り強度)Pは、リード部5a,5bの厚さ0.1mm、端子部2aの直径0.35mmとした場合、P=2.5kgfであった。この値は、従来の半田による接続の場合の強度(P=0.9kgf)の2倍以上である。
【0025】
本実施の形態によれば、鍔部端面から端子部2a、2bを突設した磁芯3にコイル部4を巻装し、コイル部4のコイル端末4a、4bを端子部2a、2bに各々絡げ、この端子部2a、2bを外部接続用のリード部5a、5bに設けた端子受部6a、6bに各々装着し、端子部2a、2bを溶融処理して、前記コイル端末4a、4bと端子部2a、2bとを端子受部6a、6bに各々電気的、機械的に接続したものであるから、従来例のような半田付け処理がなくなり、銅くわれによるワイヤの断線のおそれがなく、また、端子部2a、2bの溶融部分の引張りに対する機械的強度も従来例よりも2倍以上も大きく、これにより、信頼性の高い接続状態を得ることができるコイル部品1を提供できる。
【0026】
また、従来例のようなフラックス等の洗浄処理が不要となって工程数の削減による製造コストの低廉化が可能となる。さらに、鉛を含有する半田材を使用しないため、作業環境の改善を図れ、さらには周囲環境に対する鉛による悪影響を防止することができる。
【0027】
また、端子部2a、2bをレーザ光により摂氏1000度程度もしくはそれ以上の高温で溶融処理するため、ポリイミド被覆ワイヤ等の高融点の被覆材を使用しているコイル端末4a、4bの場合でも、このコイル端末4a、4bの被覆が同時に溶融されることになり、これにより、コイル端末4a、4bの被覆の剥離工程が不要となる。さらに、レーザ光を用いた局部加熱方法を採用するため、端子部,コイル端末,端子受部の少なくとも一部を選択して局部的に加熱することができるので、コイル部への熱の影響が少なく、信頼性の向上が図れる。さらに、従来の半田による接続に比べ、溶融温度が非常に高いので、本コイル部品をプリント基板へ実装するためリフロー等で半田処理する場合、本コイル部品内部の接続部の熱的信頼性が高い。
【0028】
図7、図8、図9は、前記実施の形態におけるリード部5aの端子受部6a(リード部5bの端子受部6bも同様)の変形例を示すものである。
【0029】
即ち、前記端子受部6aとしては、図7に示すように、端子部2aが嵌合可能な凹溝7aとこの凹溝7aの側壁から外方に突出させた突片12とを具備する構造、図8に示すように、凹溝7aの側壁部に例えば鋸刃状の凹凸部13が形成された構造、さらには、図9に示すように、前記端子部2aの嵌入側先端を包持するように袋状凹部14が形成された袋状部15を設けた構造を採用することができる。
【0030】
このような図7〜図9に各々示す構造の端子受部6aを採用することによっても、端子部2aを簡略に装着し、かつ、作業性よく各々の端子受部6aを溶融処理して、コイル端末4aと端子部2aとリード部5aとに被せて電気的、機械的に良好な接続状態を得ることができる。また、図7においては、突片12をほとんど溶融させず、コイル端末と端子部とを主として溶融させて突片12を包被させることにより接続強度を高めることもできる。図8はコイル端末と端子部を主として溶融させて端子受部で挾持させることもできる。さらに、図9では端子部を袋状部で包み込ませるように溶融接続することもできる。
【0031】
(第2の実施の形態)
図10、図11は本発明の第2の実施の形態を示すものである。
【0032】
図10は、鉄又は銅製等からなる円板の一部を切欠するとともに中央部から外方に端子部23a、23bを突設した端面部材24a、24bを、磁芯3の両側の端面に各々接着剤を用いて貼り付ける構造を示すものである。
【0033】
また、図11は鉄又は銅製等からなり上下両側に前記磁芯3の鍔部に設けた各一対の係合受溝3a、3bに係合可能な各一対の係合爪片35a、35b、35a´、35b´を各々設けるとともに中央部から外方に端子部32a、32bを突設した端面部材34a、34bにより端子部材33a、33bを各々構成し、前記端子部材33aを磁芯3の一方の端面に係合受溝3aを介して係合(嵌め付け)し、また前記端子部材33bを磁芯3の他方の端面に係合受溝3bを介して係合(嵌め付け)する構造としたものである。
【0034】
このような端子部23a、23b(図10)や端子部32a、32b(図11)を採用しても、前述した端子部2a、2bの場合と同様、端子部23a、23b、32a、32bの引張りに対する機械的強度を十分確保でき、これにより、信頼性の高い接続状態を得ることができるコイル部品を提供できる。
【0035】
(第3の実施の形態)
次に図12〜図16を参照して本発明のコイル部品の第3の実施の形態を説明する。
【0036】
このコイル部品は、図12に示すように両端鍔部を有する磁芯43の胴部にコイル44を巻回し、上端鍔部端面に間隔を置いて一対の半円形状の金属端子板42A,42Bを接着し、この端子板42A,42Bからそれぞれ対立方向に端子片を突出させた端子部42a,42bを形成し、この突出端子部42a,42bにそれぞれ前記コイル44の端末44a,44bを絡げたコイル部40を用意し、一方リードフレーム47をプレス成形して、一対の連結片47b,47bの間に対向配置する一対のリード部45A,45Bを形成し、このリード部45A,45Bの各先端を上方にコ字状に折曲して上端を端子受部46a,46bとしたリードフレーム部材を用意し、このリード部45A,45B間に前記コイル部40を挿置するようにしたものである。47aはリードフレームのスプロケットホールである。
【0037】
かかるコイル部品は、図13〜図16に示す工程順で組立てられる。
【0038】
図13に示すように、一対のリード部45A,45Bの端子受部46a,46b上に前記コイル部40の前記コイル端末44a,44bが絡げられた端子部42a,42bが載置されることによってコイル部40がリード部45A,45B間に挿置され、次に図14に示すように、前記実施の形態で説明したようなレーザ光源を用いた局部加熱により、コイル端末44a,44b、端子部42a,42b、端子受部46a,46bの少なくとも一部を加熱処理して溶融させて、上記各部が電気的,機械的に接続された接続部48a,48bを形成する。
【0039】
次に図15に示すように前記接続部48a,48b及びコイル部も含めてモールド材49によってモールドする。このとき、リード部45A,45Bの外部接続部を露出させた状態としておく。
【0040】
最後に図16に示すように、リードフレーム47から前記リード部45A,45Bを切り離し、切り離されたリード部45A,45Bの外部露出端を上方に折り曲げて、モールド材49の上端面に沿わせるようにして完成品とする。
【0041】
上記完成品は上下を逆にして、底部にリード部45A,45Bが位置する姿勢で例えば電子部品のプリント基板等に表面実装されて使用される。
【0042】
(第4の実施の形態)
図12では、コイル端末44a,44bをそれぞれ端子部42a,42bに絡げる場合を示したが、これに代えて図17に示すように、コイル端末44a,44bにセメントワイヤを使用するか、あるいは治具を用いる等して絡げずに端子部42a,42b上に沿わせる配置としてもよい。かかる形態を採用すれば、リードフレームへの組付け時にコイル端末が邪魔にならず、組付けがきわめて容易になるという効果が得られる。
【0043】
上記のようなコイル部品にあっても、前記各実施の形態で述べたような作用効果を発揮する。
【0044】
【発明の効果】
以上詳述した本発明によれば、以下のような効果が得られる。
【0045】
請求項1記載の発明によれば、コイル端末,端子部,端子受部の少なくとも一部を溶融処理して各部の電気的,機械的接続を行うものであるから、従来の半田付処理に比べて接続部分の引っ張り強度が高く、信頼性の向上が図れる。また、部分的(局部的)加熱により溶融させるので、コイル部への熱の影響が少なく、更に信頼性の高いものとなる。さらに、従来の半田処理と比べ溶融温度が非常に高いので、後工程でプリント基板等に取付ける場合の半田処理時にあっても接続部の熱的信頼性も高くなる。
【0046】
また、従来のようにフラックスや不要半田部分等の洗浄工程を必要としないので工程数の削減が図れ、低コスト化が図れる。さらに、鉛を含む半田材を使用しなくて済むので作業環境の改善を図ることもできる。
【0047】
さらに、リードに設けた端子受部を凹溝と、その側壁から突出する突片とによって形成したので、端子部の支持や位置決めが容易となると共に、突片が溶融されて端子部及びコイル端末絡げ部に被るようになるため接続強度が更に高まる。
【0050】
また、このレーザ加熱のような局部加熱手段を用いるので、加熱位置や加熱温度の制御が可能となり、更に作業性の改善が図れる。
【図面の簡単な説明】
【図1】本発明の第1の実施の形態のコイル部品の構造を示す分解斜視図である。
【図2】本発明の第1の実施の形態のコイル部品の製造工程を示す概略断面図である。
【図3】本発明の第1の実施の形態のコイル部品の製造工程を示す概略断面図である。
【図4】本発明の第1の実施の形態のコイル部品の製造工程を示す概略断面図である。
【図5】本発明の第1の実施の形態のコイル部品を示す概略断面図である。
【図6】本発明の第1の実施の形態のコイル部品の製造工程順を示すフロー図である。
【図7】本発明の第1の実施の形態における端子受部の一例を示す拡大斜視図である。
【図8】本発明の第1の実施の形態における端子受部の他例を示す拡大斜視図である。
【図9】本発明の第1の実施の形態における端子受部のさらに別の例を示す拡大斜視図である。
【図10】本発明の第2の実施の形態のコイル部品の磁芯及び変形例の端子部を示す拡大斜視図である。
【図11】本発明の第2の実施の形態のコイル部品の磁芯及び別の変形例の端子部受部を示す拡大斜視図である。
【図12】本発明の第3の実施の形態のコイル部品を示す分解斜視図である。
【図13】本発明の第3の実施の形態のコイル部品の工程側面図である。
【図14】本発明の第3の実施の形態のコイル部品の工程側面図である。
【図15】本発明の第3の実施の形態のコイル部品の工程側面図である。
【図16】本発明の第3の実施の形態のコイル部品の工程側面図である。
【図17】本発明の第4の実施の形態のコイル部品の要部斜視図である。
【図18】従来のコイル部品の製造工程を示す分解斜視図である。
【図19】従来のコイル部品を示す斜視図である。
【図20】従来のコイル部品を示す斜視図である。
【図21】従来のコイル部品の製造工程順を示す説明図である。
【符号の説明】
1 コイル部品
2a 端子部
2b 端子部
3 磁芯
3a 係合受溝
4 コイル部
4a コイル端末
4b コイル端末
5a リード部
5b リード部
6a 端子受部
6b 端子受部
7a 凹溝
7b 凹溝
8a 突片
8b 突片
10 リードフレーム
11 樹脂モールド
12 突片
13 凹凸部
14 嵌入領域
15 嵌入受片
22a 端子部
23a 端子部
24a 端面部材
24b 端面部材
32a 端子部
32b 端子部
33a、33b 端子部材
34a、34b 端面部材
35a、35b、35a´、35b´ 係合爪片
42A、42B 端子板
42a、42b 端子部
44 コイル
44a、44b コイル端末
45A、45B リード部
47 リードフレーム
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a coil component such as a chip inductor.
[0002]
[Prior art]
A conventional coil component 50 will be described with reference to FIGS.
[0003]
First, as shown in FIG. 18, a coil portion 55 made of a wire with a covering such as urethane is wound around a magnetic core 53 formed in a drum shape and provided with terminal portions 54a and 54b protruding from both end faces of the flange portion. The coil terminals 55a and 55b are respectively wound around the terminal portions 54a and 54b.
[0004]
Next, lead frames 51a and 51b are prepared by punching out the lead frame and providing recesses 52a and 52b for supporting the terminal portions 54a and 54b in the upper center. As shown in FIG. 19, the terminals of the magnetic core 53 are prepared. The parts 54a and 54b are fitted into the recesses 52a and 52b and assembled.
[0005]
Next, after solder paste 57 is applied to the coil end tie portions of the terminal portions 54a and 54b, a soldering process (for example, the temperature condition is 400 ° C. higher than the solder melting temperature because the insulation coating must be peeled off). The soldering time is about 2 seconds), and then a cleaning process using a cleaning material such as methylene chloride is performed to remove solder and flux adhering to unnecessary portions.
[0006]
Next, the lead portions 51a and 51b are molded by the resin mold 56 while leaving the portions to be the external connection electrodes, and the lead portions 51a and 51b are cut and formed. As shown in FIG. A coil component 50 is formed by bending the exposed portion to be an external electrode into contact with the wall surface of the resin mold 56 (Japanese Utility Model Laid-Open No. 5-29107).
[0007]
Thereafter, the coil component 50 is sent to the inspection process. A series of these steps is shown in FIG.
[0008]
[Problems to be solved by the invention]
However, in the case of the conventional coil component 50 described above, if eutectic solder (liquidus temperature 183 ° C) or tin (Sn) rich solder (liquidus temperature 220 ° C) is used as the solder material, the coil The so-called copper cracks of the terminals 55a and 55b are generated, and the coil terminals 55a and 55b are thinned, resulting in a decrease in tensile strength and insufficient connection reliability. There was a problem of reaching.
[0009]
Further, in the case of the conventional coil component 50, a solder flux is also required, and there is a problem that a cleaning process is essential and the number of processes is increased.
[0010]
Furthermore, when mounting this type of coil component on a printed circuit board of an electronic device, in order to cope with environmental problems that have been increasing in recent years, there are an increasing number of cases where reflow soldering is performed with a lead-free high-temperature type solder material. For this connection, it is necessary to use a higher-temperature solder material. As such high-temperature solder (liquidus temperature of 250 ° C. or higher), since a solder material containing lead is used, there arises a problem that the working environment is deteriorated.
[0011]
The present invention has been made in view of the above circumstances, can obtain a highly reliable connection state, can reduce the manufacturing cost by reducing the number of steps, and further improves the working environment. It aims at providing the coil components which can also aim at.
[0012]
[Means for Solving the Problems]
The coil component according to the first aspect of the present invention includes a magnetic core in which a terminal portion protrudes from both side flange end faces, a coil is wound, and a coil terminal of the coil is drawn out and entangled with the terminal portion. And a lead part for external connection having a terminal receiving part provided with a concave groove in which the terminal part entangled with the coil terminal can be fitted and a protruding piece protruding outward of the concave groove, The lead portion is disposed so that a gap is formed between the end portion of the magnetic core and the end portion of the coil terminal at the terminal portion where the coil terminal is entangled. and the coil end tied portion the position along the projecting pieces of the terminal receiving portion and is fitted placed so that a, the coil terminals mounted on the terminal receiving portion is a terminal portion is tied Among them, the part placed on the protruding piece in the terminal receiving part is locally heated. And by, and it is characterized in that the terminal portion is melted connected as covered by the protrusion of the terminal receiving portion.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.
[0018]
(First Embodiment) As shown in FIGS. 1 and 2, the coil component 1 according to the present embodiment has a terminal portion 2a formed in the shape of a metal rod made of iron or copper from the center portion of both side flange end faces. 2b is wound around a drum-shaped magnetic core 3 projecting outward, and a coil portion 4 using a wire with a coating such as urethane coating is wound, and the coil terminals 4a and 4b of the coil portion 4 are pulled out. The terminal portions 2a and 2b are connected to the terminal receiving portions 6a and 6b provided on the lead portions 5a and 5b for external connection formed by forming the lead frame 10 and forming the standing legs. It has a structure to let you.
As a result, as shown in FIG. 2 and FIG. 3, gaps are formed between the both side flange end surfaces of the magnetic core 3 and the lead portions 5 a and 5 b, respectively. Similarly, as clearly shown in FIGS. 2 and 3, the drawing terminal end portion of the coil terminal is located in the gap, and the coil terminal binding portion is disposed in the terminal receiving portion.
[0019]
The terminal receiving portions 6a and 6b are formed outwardly from the substantially U-shaped concave grooves 7a and 7b into which the terminal portions 2a and 2b can be fitted, and the bottom wall portions of the concave grooves 7a and 7b. Protruding elongated projecting pieces 8a and 8b are provided.
[0020]
After the terminal portions 2a and 2b are attached to the terminal receiving portions 6a and 6b, a laser light source (not shown) is used to send laser light to the terminal portions 2a and 2b and the coil terminal 4a entangled with the terminal portions 2a and 2b as shown in FIG. 4b or at least a part of the terminal receiving portions 6a and 6b of the lead to locally heat and melt the projecting pieces 8a and 8b to form the terminal portions 2a and 2b and the coil terminals 4a and 4b. Or by melting the coil terminals 4a and 4b and the terminal portions 2a and 2b and melting the coil terminals and the terminal portions into the projecting pieces of the terminal receiving portions, respectively, electrically and mechanically. Connecting.
[0021]
After that, the resin mold 11 is molded, and the lead portions 5a and 5b are cut and formed. As shown in FIG. The coil component 1 in a state of being bent so as to contact is obtained.
[0022]
The coil component 1 obtained in this way is sent to the inspection process. A series of these steps is shown in FIG.
[0023]
As the laser light locally irradiated to the terminal portion or the like by the laser light source, for example, spot light having a diameter of about 0.4 mm is used, and the irradiation target portion such as the terminal portion is irradiated for about 5 msec, for example, and the irradiation portion is 1000 °. Irradiate to a high temperature of about C and partially melt. In addition to the laser light source, local melting means such as an arc melting process, a plasma melting process, and a high frequency heating melting process can be used for the melting process. If such local heating means is used, the coil terminal, the terminal portion, the projecting piece, etc. can be partially and selectively heated, and the degree of heating can be controlled.
[0024]
The tensile strength (tensile strength along the protruding direction of the terminal portion 2a) P of the peeling test for the lead portions 5a and 5b of the terminal portions 2a and 2b melted as described above is the thickness 0 of the lead portions 5a and 5b. When the diameter of the terminal portion 2a is 0.35 mm, P = 2.5 kgf. This value is at least twice the strength (P = 0.9 kgf) in the case of connection by conventional solder.
[0025]
According to the present embodiment, the coil part 4 is wound around the magnetic core 3 provided with the terminal parts 2a, 2b protruding from the end face of the flange part, and the coil terminals 4a, 4b of the coil part 4 are respectively connected to the terminal parts 2a, 2b. The terminal portions 2a and 2b are respectively attached to terminal receiving portions 6a and 6b provided on the external connection lead portions 5a and 5b, and the terminal portions 2a and 2b are melt-processed. And the terminal portions 2a and 2b are electrically and mechanically connected to the terminal receiving portions 6a and 6b, respectively, so that the soldering process as in the conventional example is eliminated, and there is a risk of wire breakage due to copper cracking. In addition, the mechanical strength against pulling of the melted portions of the terminal portions 2a and 2b is twice or more larger than that of the conventional example, thereby providing the coil component 1 capable of obtaining a highly reliable connection state.
[0026]
Further, the cleaning process such as flux as in the conventional example is unnecessary, and the manufacturing cost can be reduced by reducing the number of processes. Furthermore, since a solder material containing lead is not used, the work environment can be improved, and further, adverse effects of lead on the surrounding environment can be prevented.
[0027]
In addition, since the terminal portions 2a and 2b are melted at a high temperature of about 1000 degrees Celsius or higher by laser light, even in the case of the coil terminals 4a and 4b using a high melting point coating material such as a polyimide coated wire, The coating of the coil terminals 4a and 4b is melted at the same time, thereby eliminating the coating peeling process of the coil terminals 4a and 4b. Furthermore, since the local heating method using laser light is adopted, at least a part of the terminal part, the coil terminal, and the terminal receiving part can be selected and heated locally, so that the influence of heat on the coil part is affected. The reliability can be improved. Furthermore, since the melting temperature is very high compared to the conventional solder connection, when soldering is performed by reflow or the like to mount this coil component on a printed circuit board, the thermal reliability of the connection part inside this coil component is high. .
[0028]
7, 8, and 9 show a modification of the terminal receiving portion 6a of the lead portion 5a in the above embodiment (the same applies to the terminal receiving portion 6b of the lead portion 5b).
[0029]
That is, as the terminal receiving portion 6a, as shown in FIG. 7, a structure including a recessed groove 7a into which the terminal portion 2a can be fitted and a protruding piece 12 protruding outward from the side wall of the recessed groove 7a. As shown in FIG. 8, a structure in which, for example, a saw-toothed uneven portion 13 is formed on the side wall of the concave groove 7a, and further, the insertion side end of the terminal portion 2a is held as shown in FIG. Thus, a structure in which a bag-like portion 15 in which a bag-like recess 14 is formed can be employed.
[0030]
By adopting the terminal receiving portions 6a having the structures shown in FIGS. 7 to 9 as described above, the terminal portions 2a are simply mounted, and each terminal receiving portion 6a is melt-processed with good workability. A good electrical and mechanical connection state can be obtained by covering the coil terminal 4a, the terminal portion 2a, and the lead portion 5a. In FIG. 7, the connection strength can be increased by covering the protrusion 12 by mainly melting the coil terminal and the terminal portion without causing the protrusion 12 to melt almost. In FIG. 8, the coil terminal and the terminal part can be mainly melted and held by the terminal receiving part. Furthermore, in FIG. 9, it can also be fusion-connected so that a terminal part may be wrapped in a bag-shaped part.
[0031]
(Second Embodiment)
10 and 11 show a second embodiment of the present invention.
[0032]
FIG. 10 shows that end members 24a and 24b in which a part of a disk made of iron or copper is cut out and terminal portions 23a and 23b project outward from the central portion are provided on both end surfaces of the magnetic core 3, respectively. It shows a structure to be attached using an adhesive.
[0033]
Further, FIG. 11 is made of iron or copper or the like, and a pair of engagement claw pieces 35a, 35b that can be engaged with a pair of engagement receiving grooves 3a, 3b provided on the flange portion of the magnetic core 3 on both upper and lower sides. Terminal members 33a and 33b are respectively constituted by end surface members 34a and 34b provided with 35a 'and 35b' and projecting terminal portions 32a and 32b outward from the central portion, respectively. And engaging (fitting) the terminal member 33b to the other end surface of the magnetic core 3 via the engagement receiving groove 3b. It is a thing.
[0034]
Even if such terminal portions 23a and 23b (FIG. 10) and terminal portions 32a and 32b (FIG. 11) are adopted, the terminal portions 23a, 23b, 32a, and 32b have the same structure as in the case of the terminal portions 2a and 2b described above. A sufficient mechanical strength against tension can be ensured, thereby providing a coil component capable of obtaining a highly reliable connection state.
[0035]
(Third embodiment)
Next, a third embodiment of the coil component of the present invention will be described with reference to FIGS.
[0036]
In this coil component, as shown in FIG. 12, a coil 44 is wound around a body portion of a magnetic core 43 having both end flanges, and a pair of semicircular metal terminal plates 42A and 42B are spaced from the end surfaces of the upper end flanges. The terminal portions 42a and 42b are formed by projecting terminal pieces in opposite directions from the terminal plates 42A and 42B, respectively, and the terminals 44a and 44b of the coil 44 are entangled with the projecting terminal portions 42a and 42b, respectively. A coil portion 40 is prepared, and one lead frame 47 is press-molded to form a pair of lead portions 45A and 45B that are disposed to face each other between the pair of connecting pieces 47b and 47b, and the tips of the lead portions 45A and 45B. A lead frame member is prepared with the upper end bent into a U-shape and the upper ends thereof as terminal receiving portions 46a and 46b, and the coil portion 40 is inserted between the lead portions 45A and 45B. It is intended. 47a is a sprocket hole of the lead frame.
[0037]
Such coil components are assembled in the order of steps shown in FIGS.
[0038]
As shown in FIG. 13, the terminal portions 42a and 42b in which the coil terminals 44a and 44b of the coil portion 40 are entangled are placed on the terminal receiving portions 46a and 46b of the pair of lead portions 45A and 45B. The coil portion 40 is inserted between the lead portions 45A and 45B by the above, and then, as shown in FIG. 14, the coil terminals 44a and 44b, terminals are connected by local heating using the laser light source as described in the above embodiment. At least a part of the parts 42a and 42b and the terminal receiving parts 46a and 46b are heated and melted to form connection parts 48a and 48b in which the above parts are electrically and mechanically connected.
[0039]
Next, as shown in FIG. 15, the connecting parts 48a and 48b and the coil part are molded with a molding material 49. At this time, the external connection portions of the lead portions 45A and 45B are exposed.
[0040]
Finally, as shown in FIG. 16, the lead portions 45A and 45B are separated from the lead frame 47, and the externally exposed ends of the separated lead portions 45A and 45B are bent upward so as to follow the upper end surface of the molding material 49. And finished product.
[0041]
The finished product is used by being mounted on the surface of, for example, a printed circuit board of an electronic component in an attitude in which the lead portions 45A and 45B are positioned at the bottom with the top and bottom reversed.
[0042]
(Fourth embodiment)
In FIG. 12, although the case where the coil terminals 44a and 44b are respectively entangled with the terminal portions 42a and 42b is shown, instead of this, as shown in FIG. 17, a cement wire is used for the coil terminals 44a and 44b, Or it is good also as arrangement | positioning along the terminal parts 42a and 42b, without using a jig | tool etc. If this form is adopted, the effect that the coil terminal does not get in the way when assembled to the lead frame and the assembly becomes extremely easy can be obtained.
[0043]
Even in the coil parts as described above, the effects as described in the above embodiments are exhibited.
[0044]
【The invention's effect】
According to the present invention described in detail above, the following effects can be obtained.
[0045]
According to the first aspect of the present invention, since at least a part of the coil terminal, the terminal part, and the terminal receiving part is melt-processed to electrically and mechanically connect the respective parts, compared with the conventional soldering process. Therefore, the tensile strength of the connection part is high, and the reliability can be improved. In addition, since melting is performed by partial (local) heating, the influence of heat on the coil portion is small and the reliability is further improved. Further, since the melting temperature is very high compared to the conventional soldering process, the thermal reliability of the connection portion is also increased even during the soldering process when mounting on a printed circuit board or the like in a subsequent process.
[0046]
In addition, since a cleaning process for flux, unnecessary solder, etc. is not required as in the prior art, the number of processes can be reduced and the cost can be reduced. Furthermore, since it is not necessary to use a solder material containing lead, the working environment can be improved.
[0047]
Further , since the terminal receiving portion provided on the lead is formed by the concave groove and the protruding piece protruding from the side wall, the terminal portion can be easily supported and positioned, and the protruding piece is melted so that the terminal portion and the coil terminal are melted. The connection strength is further increased because the binding portion is covered.
[0050]
Further, since the use of local heating means such as laser heating, it is possible to control the heating position, heating temperature, thereby further improving the workability.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing a structure of a coil component according to a first embodiment of the present invention.
FIG. 2 is a schematic cross-sectional view showing the manufacturing process of the coil component according to the first embodiment of the present invention.
FIG. 3 is a schematic cross-sectional view showing a manufacturing process of the coil component according to the first embodiment of the present invention.
FIG. 4 is a schematic cross-sectional view showing a manufacturing process of the coil component according to the first embodiment of the present invention.
FIG. 5 is a schematic sectional view showing the coil component according to the first embodiment of the present invention.
FIG. 6 is a flowchart showing the sequence of manufacturing steps of the coil component according to the first embodiment of the present invention.
FIG. 7 is an enlarged perspective view showing an example of a terminal receiving portion in the first embodiment of the present invention.
FIG. 8 is an enlarged perspective view showing another example of the terminal receiving portion in the first embodiment of the present invention.
FIG. 9 is an enlarged perspective view showing still another example of the terminal receiving portion in the first embodiment of the present invention.
FIG. 10 is an enlarged perspective view showing a magnetic core of a coil component according to a second embodiment of the present invention and a terminal portion of a modification.
FIG. 11 is an enlarged perspective view showing a magnetic core of a coil component according to a second embodiment of the present invention and a terminal portion receiving portion of another modification.
FIG. 12 is an exploded perspective view showing a coil component according to a third embodiment of the present invention.
FIG. 13 is a process side view of a coil component according to a third embodiment of the present invention.
FIG. 14 is a process side view of a coil component according to a third embodiment of the present invention.
FIG. 15 is a process side view of the coil component according to the third embodiment of the present invention.
FIG. 16 is a process side view of the coil component according to the third embodiment of the present invention.
FIG. 17 is a perspective view of main parts of a coil component according to a fourth embodiment of the present invention.
FIG. 18 is an exploded perspective view showing a manufacturing process of a conventional coil component.
FIG. 19 is a perspective view showing a conventional coil component.
FIG. 20 is a perspective view showing a conventional coil component.
FIG. 21 is an explanatory view showing the order of manufacturing steps of a conventional coil component.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Coil component 2a Terminal part 2b Terminal part 3 Magnetic core 3a Engagement receiving groove 4 Coil part 4a Coil terminal 4b Coil terminal 5a Lead part 5b Lead part 6a Terminal receiving part 6b Terminal receiving part 7a Concave groove 7b Concave groove 8a Protruding piece 8b Projection piece 10 Lead frame 11 Resin mold 12 Projection piece 13 Concavity and convexity portion 14 Insertion region 15 Insertion receiving piece 22a Terminal portion 23a Terminal portion 24a End surface member 24b End surface member 32a Terminal portion 32b Terminal portions 33a and 33b Terminal members 34a and 34b End surface member 35a , 35b, 35a ′, 35b ′ engaging claw pieces 42A, 42B terminal plate 42a, 42b terminal portion 44 coil 44a, 44b coil terminal 45A, 45B lead portion 47 lead frame

Claims (1)

両側鍔部端面に端子部が突出形成され、コイルが巻装され、該コイルのコイル端末が引き出されて前記端子部に絡げられた磁芯と、前記コイル端末が絡げられた前記端子部が嵌合可能な凹溝とこの凹溝の外方に突出する突片とを備えた端子受部を有する外部接続用のリード部とからなり、前記リード部が前記磁芯の鍔部端面との間に隙間が形成されるように配置され、前記コイル端末が絡げられた前記端子部における、前記コイル端末の引き出し終端部分が前記隙間に位置し前記コイル端末絡げ部分が前記端子受部の突片に沿う位置となるように嵌合載置され、前記端子受部に載置された前記コイル端末が絡げられた端子部のうち前記端子受部における前記突片上に載置された部分を局部加熱することによって、前記端子部が前記端子受部の前記突片によって被われるように溶融接続されていることを特徴とするコイル部品。A terminal portion is formed to protrude from both side flange end faces, a coil is wound, a coil end of the coil is drawn out, and a magnetic core entangled with the terminal portion, and the terminal portion entangled with the coil end And a lead part for external connection having a terminal receiving part provided with a concave groove that can be fitted and a protruding piece protruding outward of the concave groove, and the lead part is formed with a flange end surface of the magnetic core. It is arranged so that a gap is formed between the in the terminal portion coil ends has been tied, the drawer end portion of the coil terminal is located in the gap, the coil terminal tying portion the terminal receiving parts are fitted placed so that such a position along the projecting piece, placed on the protrusion in the terminal receiving portion of the terminal receiving portion is mounted the said coil terminal tying was the terminal portion The terminal portion is the terminal receiving portion by locally heating the portion Coil component, characterized in that it is melted connected as covered by the projecting piece.
JP25306998A 1998-09-07 1998-09-07 Coil parts Expired - Lifetime JP4651135B2 (en)

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JP2009099689A (en) * 2007-10-15 2009-05-07 Denso Corp Method of manufacturing coil body
JP2010010730A (en) * 2008-06-24 2010-01-14 Hitachi Ferrite Electronics Ltd Low-frequency three-axis reception antenna
JP2011135560A (en) * 2009-11-27 2011-07-07 Toko Inc Antenna coil and manufacturing method thereof

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JPH0529107U (en) * 1991-09-27 1993-04-16 太陽誘電株式会社 Chip inductor
JPH05121238A (en) * 1991-10-25 1993-05-18 Koa Corp Chip inductor
JPH05190330A (en) * 1992-01-17 1993-07-30 Taiyo Yuden Co Ltd Chip-shaped inductor and manufacture thereof
JPH05198438A (en) * 1992-01-21 1993-08-06 Taiyo Yuden Co Ltd Chip-shaped inductor and manufacture thereof
JPH06163300A (en) * 1992-11-18 1994-06-10 Sony Corp Structure of connecting terminals of electrical component
JPH06181118A (en) * 1992-12-11 1994-06-28 Koa Corp Electric parts, their manufacture, and substrate therefor

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