JPH06181118A - Electric parts, their manufacture, and substrate therefor - Google Patents

Abstract

PURPOSE:To provide a chip inductor, etc., using no lead frame. CONSTITUTION:Inductance elements 21 are put in the recessed sections 11b of a substrate 11 and the leads 21b of the elements 21 are soldered to electrodes l2a electrically connected to electrodes 12b via through holes 13. After soldering, the substrate 11 is split along the holes 13.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric component and a substrate for an electric component, and more particularly to a structure of a chip component and a method for manufacturing the same, and a substrate constituting the chip component.

[0002]

2. Description of the Related Art A conventional surface mounting chip inductor has a structure as shown in FIG. Note that FIG.
(A) is a front view of a conventional chip inductor, (b) of the same figure.
Is a side view of a conventional chip inductor, and FIG. 7C is a sectional view taken along line AA of FIG. In the figure, reference numeral 1 is an inductance element, which is composed of a coil 1a, a lead 1b, and a magnetic core 1c. The coil 1a is formed by winding a magnet wire around the magnetic core 1c, and both ends of the magnet wire are electrically connected to the leads 1b.

Reference numeral 2 denotes an electrode, which is electrically connected to the lead 1b and used for electrical connection with an external circuit. A package 3 covers the inductance element 1 with a resin. Next, a method for manufacturing the above-described conventional chip inductor will be described. FIG. 21 is a diagram showing a conventional method for manufacturing a chip inductor.

In FIG. 1A, a lead frame 4 is provided with an electrode portion 4a which extends inwardly of the lead frame 4 at a right angle to the carrying direction of the lead frame 4 shown by an arrow C. In addition, a U-shaped cut into which the lead 1b of the inductance element 1 is loosely fitted is formed at the tip of the electrode portion 4a. After forming the inductance element 1, at the bending position 4c, the opposing electrode portions 4a are bent at right angles in the same direction, and the leads 1b are loosely fitted in the U-shaped notches to form an inductance between the opposing electrode portions 4a. Mount the element 1.

Then, after the electrode portion 4a and the lead 1b are soldered, the lead 1b is cut into a predetermined length, and the electrode portion 4a and the tie bar 4d are cut off at the cutting position 4b. Subsequently, as shown in FIG. 2B, after the inductance element 1 and a part of the electrode portion 4a are molded with resin, the electrode portion 4b is bent to form the electrode 2.

[0006]

However, the above conventional example has the following problems. That is, the conventional method for manufacturing a chip inductor has a drawback that the performance inspection of the chip inductor cannot be performed until the inductance element 1 is mounted on the lead frame 4 and the tie bar 4d is cut off.

In addition, the lead 1b of the inductance element 1
Is difficult to fit into the U-shaped cut of the electrode portion 4b, and if the width of the U-shaped cut is increased to facilitate the same work, the mounting posture of the inductance element 1 becomes unstable. Atsuta Further, it is difficult to solder the lead 1b of the inductance element 1 to the electrode portion 4b, and if the amount of solder supplied is small, sufficient solder joint reliability cannot be obtained. There is a drawback that the solder flows out along the electrode portion 4a.

Further, the conventional chip inductor manufacturing method is suitable for producing a large number of small products in combination with an automated production facility. The size of the available chip inductor is
Since there is a limitation due to the shape and size of the lead frame 4, it may be necessary to reset the automated production equipment when the production type changes, which has a drawback of lowering productivity.

[0009]

SUMMARY OF THE INVENTION The present invention is intended to solve the above problems, and has the following structure as one means for solving the above problems. That is, a concave portion is provided in a substantially central portion of one surface of an insulating substrate of a predetermined size and on which an electric element is mounted, and at least two first concave portions formed near the end portion of the concave portion and near the end portion of the insulating substrate. The electrode portion, at least two second electrode portions formed in the vicinity of the end portion of the other surface of the insulating substrate, and the first electrode formed on the end surface of the insulating substrate substantially orthogonal to the surface in which the recess is provided. And the third electrode portion electrically connecting the second electrode to the second electrode, and the first electrode portion is an electric component electrically connected to the electrode of the electric element.

Further, the holes are formed in an insulating substrate having a predetermined size, which has a plurality of holes penetrating in the thickness direction and a plurality of concave portions arranged at a position sandwiched by at least two holes on one surface thereof. A first electrode forming step of forming at least two first electrodes for each of the recesses from the vicinity of the open end of the recess to the vicinity of the open end of the hole on the other surface of the insulating substrate. A second electrode forming step of forming at least one second electrode, a third electrode forming step of forming a third electrode in the inner surface portion of the hole, and an electric element placed in the recess. A method of manufacturing an electric component includes an element mounting step of electrically connecting an electrode of an electric element and the first electrode, and a substrate dividing step of dividing the insulating substrate along the hole.

In addition, a first electrode forming step of forming at least two first electrodes for each of the recesses in the vicinity of the open ends of the recesses provided on one surface of the insulating substrate of a predetermined size. A second electrode forming step of forming at least one second electrode at a position substantially opposite to the first electrode on the other surface of the insulating substrate; and An element mounting step of electrically connecting the electrode of the element and the first electrode, and an end surface of the first electrode, an end surface of the second electrode, and the insulating substrate at a substantially intermediate position between the adjacent recesses. A substrate dividing step of dividing the insulating substrate so that the end face thereof substantially coincides with the third electrode, and a third electrode electrically connecting the first electrode and the second electrode at the divided end face of the insulating substrate. And a third electrode forming step for forming an electric component To.

Further, an electric component substrate on which at least one electric element is mounted, wherein a plurality of holes are provided in an insulating substrate of a predetermined size and penetrate the insulating substrate in the thickness direction.
A plurality of recesses arranged at positions sandwiched by at least two holes on one surface of the insulating substrate, and the electric element is a substrate for electric parts mounted in the recesses.

[0013]

With the above-described structure, the electric element is mounted in the recess provided in substantially the center of one surface of the insulating substrate, and the electrode of the electric element and the electrode formed on the insulating substrate are electrically connected. It is possible to provide the electric component and the manufacturing method thereof. Further, according to the above configuration, the plurality of holes penetrating in the thickness direction and one surface of the insulating substrate are arranged at a position sandwiched by at least two holes to mount the electric element. It is possible to provide a substrate for electric component that includes a plurality of recesses.

For example, with the above configuration, it is possible to provide an electric component and a method of manufacturing the same that can perform performance inspection during manufacturing. Further, for example, with the above configuration, it is possible to provide an electric component in which the mounting posture of the electric element is stable during the manufacturing process, a manufacturing method thereof, and an electric component substrate. Further, for example, with the above configuration, it is possible to provide an electric component capable of joining the electrode of the electric element and the electrode of the insulating substrate with a small amount of solder, a method for manufacturing the electric component, and a substrate for the electric component.

Further, for example, with the above configuration, it is possible to provide an electric component and its manufacturing method which can maintain high productivity without being affected by the production amount or the product type.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A chip inductor according to an embodiment of the present invention will be described in detail below with reference to the drawings.

[0017]

[First Embodiment] FIGS. 1 to 9 are views for explaining a chip inductor of the present embodiment. FIG. 1 is a perspective view showing an example of a board on which an inductance element is mounted, and FIG. 2 is a partial sectional view of the board. An example of the drawing, FIG. 3 is a partial sectional view showing an example of a state where electrodes are formed on the substrate, FIG. 4 is a view showing an example of a state where through holes are formed on the substrate, and FIGS. FIG. 7 is a diagram showing an example of a state in which an inductance element is mounted, FIG. 7 is a diagram showing an example of a state after exterior molding, FIG. 8 is a diagram showing an example of a state after capping, and FIG. 9 is an example of a completed state of a chip inductor. FIG.

In the drawing, reference numeral 11 denotes a substrate, which is an electrically insulating substrate having a substantially rectangular shape and having a predetermined thickness, which is formed of a material such as ceramics, resin, or ferrite. As shown in FIGS. 1 and 2, the substrate 11 has a plurality of substantially elliptic cone-shaped holes 11a arranged at predetermined intervals.
The hole 11a penetrates the substrate 11 in the thickness direction.

Between the holes 11a, a recess 11 having a substantially rectangular parallelepiped shape is formed.
b is provided. The recess 11b is for mounting the inductance element 21 and the like, and its size and shape depend on the size and shape of the mounted element. Furthermore, on the side of the recess 11b facing the hole 11a,
A substantially U-shaped groove 11c is provided, and the groove 11c is formed to have a predetermined length from the side toward the hole 11a.

In the following description, the surface of the substrate 11 on which the recess 11b is formed is referred to as "front surface", and the other surface of the substrate 11 is referred to as "rear surface". In FIG. 3, 12a, 12
Reference numeral b denotes electrodes, which are formed in a predetermined size and shape on the front surface and the back surface of the substrate 11, respectively. The electrode is, for example, a thick film conductor formed by a known thick film process or a thin film conductor formed by a known thin film process.

In FIG. 4, reference numeral 13 is a through hole, and the electrode 12a and the electrode 12 are formed by the through hole conductor 13a.
b is electrically connected. The method of forming the through hole 13 is substantially the same as the method of forming the through hole of a general printed wiring board, so a detailed description thereof will be omitted.
It is formed by plating the inner surface of the hole 11a, injecting a thick film paste into the hole 11a and baking it, or by vacuum evaporation.

After the through hole 13 is formed, an antioxidant film such as a solder film is formed on the electrodes 12a and 12b by plating or the like. In FIG. 5, reference numeral 21 is an inductance element. Note that the structure of the inductance element 21 is substantially the same as that of the inductance element 1 described in "Prior Art", and thus detailed description thereof is omitted.

Inductance elements 21 are mounted in the recesses 11b of the substrate 11, respectively. The inductance element 21 is loosely fitted in the recess 11b so that its lead 21b is placed in the groove 11c. After mounting the inductance element 21, the lead 21b and the electrode 12b are mounted.
Are respectively soldered, and the inductance element 21
And the electrode 12b on the back surface are electrically connected.

Further, in the present embodiment, the shape of the inductance element is not limited to that shown in FIG.
It may have a shape as shown in FIG. The inductance element 22 has a substantially disk-shaped flat electrode 22b. In FIG. 7, after the filler 13b is injected into the through hole 13 to close the through hole 13,
The inductance element 21 is molded by an exterior material 31 such as resin.

Before molding, the through hole 13 is closed to prevent the exterior material 31 from adhering to the through hole 13 and the lower surface of the substrate 11, and the filling material 13b is removed after the molding is completed. . As the filling material 13b, a resin, solder, or the like, which can be easily removed, is used. Further, the exterior method of this embodiment is not limited to that shown in FIG. 7, and may be the method shown in FIG. 8, for example.

In FIG. 8, numeral 32 is a cap for the substrate 1.
The inductance element 21 projecting from the surface of the substrate 1 is placed so as to cover the inductance element 21, and the bonding portion 32b provided around the cap 32 is bonded to the surface of the substrate 11. As the material of the cap 32, for example, ceramics, resin, ferrite or the like is used, but if a magnetic material such as ferrite is used, a magnetic shield effect can be obtained. Further, the substrate 11 may be divided and used as the cap 32.

After this, the chip inductor goes through a process such as marking and division, which will be described later, to be in a completed state, an example of which is shown in FIG. 9A is an example of a side view of the chip inductor, FIG. 9B is an example of a side view of the chip inductor as seen from the electrode side, and FIG. 9C is an example of a bottom view of the chip inductor. . FIG. 10 is a process drawing showing an example of the manufacturing process of the chip inductor.

First, in step P11 shown in FIG.
A substrate manufacturing process for forming 1 into a predetermined size is performed to manufacture a substantially rectangular substrate 11 having a predetermined manufacturing unit size. The manufacturing unit is arbitrary, and one substrate 11
Can produce any number of chip inductors. Subsequently, in step P12, the electrodes 12a and 12b are formed by a known thick film forming method or thin film forming method.

Subsequently, in step P13, the through hole 13 is formed by a known through hole forming method. After the through hole 13 is formed, an antioxidant film such as a solder film is formed on the electrodes 12a and 12b by plating or the like. Subsequently, in step P14, separately from the substrate step, step P
The inductance element 21 manufactured in 31 is mounted in the recess 11 a of the substrate 11.

Then, in step P15, the lead portion 21b of the inductance element 21 and the groove portion 11b of the substrate 11 are soldered. In addition, in the same process, in order to prevent heat from being directly applied to the inductance element 21, a mask is applied to the elements other than the leads 21b of the element, and soldering is performed using, for example, a reflow furnace or a light beam. next,
When molding is performed as an exterior method, the through hole 13 is closed with the filler 13b in step P16, the inductance element 21 is molded with the exterior material 31 in step P17, and the filler 13b in the through hole 13 is removed in step P18. .

When the cap 32 is used as the packaging method, resin is filled in the recess 11b of the substrate 11 in step P35 to bond the inductance element 21 and the substrate 11 together, and then the inductance element 21 is processed in step P36. Is covered with a cap 32, and the bonding portion 32b provided around the cap 32 and the surface of the substrate 11 are bonded to each other. Subsequently, in step P19, the rated resistance value, the product number, etc. are marked by, for example, imprinting on the exterior material 31 or the cap 32.

Then, in step P20, the substrate 11 is diced so as to be substantially orthogonal to the through holes 13 at the positions indicated by → as shown in FIG.
Divide into 1 and shape. Finally, in step P21, an inspection is performed to complete the chip inductor.

Although not described above and in FIG. 10, in this embodiment, the inductance element 21 is mounted on the substrate 11 in the process P14, and the process P1 is performed.
Even after soldering in step 5, each inductance element 21 can be individually inspected, so that an intermediate inspection can be performed at an arbitrary position in the step shown in FIG. This is because, in the conventional manufacturing method using a lead frame, both leads 21b of each inductance element 21 are short-circuited or a plurality of the same elements 21 are connected in parallel, so that the same elements 21 are individually inspected. It was difficult. However, in the manufacturing method of the present embodiment, since the inductance element 21 is simply connected in series, it is possible to individually inspect the element even during manufacturing.

As described above, according to this embodiment,
The mounting of the inductance element 21 is very easy because the inductance element 21 is loosely fitted into the recess 11b of the substrate 11 so that the lead 21b is placed in the groove 11c. Since the mounting position is determined by 11c, the posture after mounting is also stable.

Further, according to this embodiment, the lead 21b of the inductance element 21 and the groove portion 11b of the substrate 11 can be easily soldered, and a reliable solder joint can be obtained with a small amount of solder. Further, according to the present embodiment, in combination with the automated production equipment, it is possible to produce a large number of small varieties, and also in the case of producing a small amount of many varieties,
The recess 11a and the groove 11b may be formed according to the shape and size of the mounted inductance element.
Since it is not necessary to change the external dimensions of the product, even if the product type changes, the reconfiguration of the automated production equipment can be kept to the minimum necessary, and the productivity is less reduced compared to the conventional chip inductor manufacturing method. .

Further, according to the present embodiment, the electrode shape of the inductance element to be mounted may be arbitrary, for example, a substantially rod-shaped or substantially square electrode, a substantially circular or substantially square flat electrode, and the substrate 11 are used. The groove portion 11b may be soldered, or the wound magnet wire may be directly connected to the groove portion 11b.
May be soldered to.

[0037]

[Second Embodiment] A second embodiment of the present invention will be described below. In the second embodiment, the same components and steps as those in the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted. 12 to 16 are views for explaining the chip inductor of the present embodiment, FIG. 12 is a perspective view showing an example of a substrate on which an inductance element is mounted, FIG. 13 is an example of a partial sectional view of the substrate, and FIG. Is a diagram showing an example of a state in which electrodes are formed on the substrate, FIG. 15 is a diagram showing an example of dividing the substrate into strips after exterior molding, and FIG. 16 is a diagram showing an example of a completed state of the chip inductor. is there.

As shown in FIGS. 12 and 13, the substrate 11 of this embodiment is provided with a recess 11b and a groove 11c. As shown in FIG. 14, electrodes 12 a and 12 b having a predetermined size and shape are formed on the front and back surfaces of the substrate 11. An antioxidant film such as a solder film is formed on the electrodes 12a and 12b by, for example, plating.

The recess 1 of the substrate 11 is substantially the same as in the first embodiment.
1b, the inductance element 21 is mounted respectively, the lead 21b and the electrode 12a are connected by soldering,
After the inductance element 21 is molded with the exterior material 31 such as resin, as shown in FIG.
The substrate 11 is divided into strips so that the substantially central portion of 12b is the substrate end. In this example, the electrode 1
A part of the electrode 12a is exposed between the exterior material 31 and the substrate edge for electrical connection between the electrode 2a and the electrode 12b.

In addition, the cap 32 may be used in the exterior packaging method of this embodiment, as in the first embodiment. After that, the chip inductor is in a completed state, an example of which is shown in FIG. 16, through steps such as side surface electrode formation, marking, and division described later. 16A is an example of a side view of the chip inductor, FIG. 16B is an example of a side view of the chip inductor as seen from the electrode side, and FIG. 16C is an example of a bottom view of the chip inductor. .

FIG. 17 is a process drawing showing an example of the manufacturing process of the chip inductor. First, step P41 shown in FIG.
Then, a substrate manufacturing process for forming the substrate 11 into a predetermined size is performed to manufacture a substantially rectangular substrate 11 having a predetermined manufacturing unit size. The manufacturing unit is arbitrary, and one chip 11 can be used to manufacture any number of chip inductors.

Then, in step P42, the electrodes 12a and 12b are formed by a well-known thick film forming method or thin film forming method, and a solder film or the like is oxidized on the electrodes 12a and 12b by plating or the like. Forming a barrier film. Subsequently, in process P43, separately from the substrate process, the inductance element 21 manufactured in process P61 is mounted in the recess 11a of the substrate 11.

Then, in step P44, the lead portion 21b of the inductance element 21 and the groove portion 11b of the substrate 11 are soldered. In addition, in the same process, in order to prevent heat from being directly applied to the inductance element 21, a mask is applied to the elements other than the leads 21b of the element, and soldering is performed using, for example, a reflow furnace or a light beam. next,
When molding is performed as the packaging method, the inductance element 21 is molded with the packaging material 31 in step P45, and when the cap 32 is used as the packaging method, the recess 11b of the substrate 11 is filled with resin in step P65. After adhering the inductance element 21 and the substrate 11 to each other, in step P66, the inductance element 21 is covered with the cap 32, and a bonding portion 32b provided around the cap 32 is provided.
And the surface of the substrate 11 are bonded.

Subsequently, in step P46, the substrate 11 is divided into strips, and in step P47, side surface electrodes are formed on the end faces of the substrate 11 to electrically connect the electrodes 12a and 12b.
Then, in step P48, for example, the exterior material 31 and the cap 3
Mark the rated resistance value, product number, etc. by stamping on 2. Then, in process P49, process P
Substrate 11 divided into strips at 46 is further divided into individual chip inductors and shaped.

Finally, in step P50, an inspection is performed to complete the chip inductor. As described above, according to this embodiment, the same effect as that of the first embodiment is obtained, and since the through hole 13 is not formed in the substrate 11, the process can be simplified as compared with the first embodiment.

[0046]

[Third Embodiment] A third embodiment of the present invention will be described below. Note that, in the second embodiment, substantially the same configurations and steps as those in the first and second embodiments are designated by the same reference numerals, and detailed description thereof will be omitted. FIG. 18 is a diagram for explaining the chip inductor of the present embodiment, and is a diagram showing an example of a state in which the substrate is divided into strips after exterior molding.

That is, in this embodiment, the substrate is divided into strips and the side electrodes are formed before the packaging. Other configurations and steps are substantially the same as those of the first and second embodiments, and the completed state thereof is substantially the same as the drawing showing the completed state of the first embodiment shown in FIG. FIG. 19 is a process drawing showing an example of the manufacturing process of the chip inductor. First, FIG.
Since steps P71 to P74 and P91 shown in FIG. 16 are substantially the same as the corresponding steps of the second embodiment shown in FIG. 17, detailed description thereof will be omitted.

Subsequently, in step P75, the substrate 11 is divided into strips, and in step P76, side electrodes are formed on the end faces of the substrate 11 to electrically connect the electrodes 12a and 12b.
In this embodiment, the side surface electrode may be formed by using a lead frame or the like. In this case, the electrode 12a
Attach the lead frame so that it is electrically connected to
After the electrode 12a and the lead frame are electrically connected by soldering or the like, the excess portion of the lead frame is removed and the lead frame is formed. In this case, it is not necessary to form the electrode 12b on the back surface in the process P72.

Next, when molding is performed as an exterior method, the inductance element 21 is attached to the exterior material 31 in step P77.
When the cap 32 is used for molding and the cap 32 is used as the exterior method, in step P95, the recess 11b of the substrate 11 is filled with resin to bond the inductance element 21 and the substrate 11, and then in step P96, the inductance element 21 is covered with a cap 32, and a bonding portion 32b provided around the cap 32 and the surface of the substrate 11 are bonded.

Since the following steps P78 to P80 are substantially the same as the corresponding steps of the second embodiment shown in FIG. 17, detailed description thereof will be omitted. As described above, according to this embodiment,
In addition to the effects substantially similar to those of the first and second embodiments, the exposure of the electrode 12a, which is required in the second embodiment, becomes unnecessary, so that the reliability of the electrode portion can be improved.

[0051]

As described above, according to the present invention, an electric element is mounted in a concave portion provided at a substantially central portion of one surface of an insulating substrate,
It is possible to provide an electric component in which an electrode of an electric element and an electrode formed on an insulating substrate are electrically connected, and a manufacturing method thereof.
Further, according to the present invention, a plurality of holes penetrating in the thickness direction and a plurality of holes arranged on one surface of the insulating substrate and sandwiched by at least two holes to mount an electric element thereon. It is possible to provide a substrate for electric parts, which is provided with

For example, according to the present invention, it is possible to provide an electric component and a manufacturing method thereof which can perform performance inspection during the manufacturing process and can maintain high productivity without being affected by the production amount or the product type. Further, according to the present invention, an electric component in which the mounting posture of the electric element is stable during manufacturing, and the electrode of the electric element and the electrode of the insulating substrate can be joined with a small amount of solder, a manufacturing method thereof, and an electric component substrate. Can be provided.

[Brief description of drawings]

FIG. 1 is a perspective view showing an example of a substrate on which an inductance element according to an embodiment of the present invention is mounted.

FIG. 2 is an example of a partial cross-sectional view of the substrate of FIG.

FIG. 3 is a partial cross-sectional view showing an example of a state where electrodes are formed on the substrate of FIG.

FIG. 4 is a diagram showing an example of a state in which through holes are formed in the substrate of FIG.

5 is a diagram showing an example of a state in which an inductance element is mounted on the substrate of FIG.

6 is a diagram showing an example of a state in which inductance elements having different shapes are mounted on the substrate of FIG.

FIG. 7 is a diagram showing an example of a state after the outer mold of the present embodiment.

FIG. 8 is a diagram showing an example of a state after capping of the present embodiment.

FIG. 9 is a diagram showing an example of a completed state of the chip inductor of the present embodiment.

FIG. 10 is a process drawing showing an example of a manufacturing process of the chip inductor of the present embodiment.

FIG. 11 is a diagram showing an example of a substrate dicing position of an example.

FIG. 12 is a perspective view showing an example of a substrate on which the inductance element of the second embodiment according to the present invention is mounted.

13 is an example of a partial cross-sectional view of the substrate of FIG.

14 is a diagram showing an example of a state in which electrodes are formed on the substrate of FIG.

FIG. 15 is a diagram showing an example of a state in which the substrate is divided into strips after the outer mold of the second embodiment.

FIG. 16 is a diagram showing an example of a completed state of the chip inductor of the second embodiment.

FIG. 17 is a process drawing showing an example of the manufacturing process of the chip inductor of the second embodiment.

FIG. 18 is a diagram for explaining a chip inductor according to a third embodiment of the present invention.

FIG. 19 is a process drawing showing an example of a manufacturing process of the chip inductor of the third embodiment.

FIG. 20 is a diagram showing a structure of a conventional chip inductor.

FIG. 21 is a diagram showing a conventional method for manufacturing a chip inductor.

[Explanation of symbols]

 11 substrate 12 electrode 13 through hole 21, 22 inductance element 31 exterior material 32 cap

Claims (5)

[Claims] 1. A concave portion provided in a substantially central portion of one surface of an insulating substrate of a predetermined size for mounting an electric element, and at least two concave portions formed near the end portion of the concave portion and near the end portion of the insulating substrate. A first electrode portion, at least two second electrode portions formed in the vicinity of the end portion of the other surface of the insulating substrate; and an end surface of the insulating substrate that is substantially orthogonal to the surface in which the recess is provided. A third electrode portion electrically connecting the first electrode and the second electrode, wherein the first electrode portion is electrically connected to an electrode of the electric element. Electrical parts to do. 2. The electric component according to claim 1, further comprising a cap made of a magnetic material that substantially covers the electric element placed in the recess. 3. A hole of an insulating substrate having a predetermined size, which has a plurality of holes penetrating in the thickness direction and a plurality of recesses arranged at a position sandwiched by at least two holes on one surface thereof. A first electrode forming step of forming at least two first electrodes for each of the recesses from the vicinity of the opening end of the recess to the vicinity of the opening end of the hole on the other surface of the insulating substrate. A second electrode forming step of forming at least one second electrode, a third electrode forming step of forming a third electrode in an inner surface portion of the hole, and an electric element placed in the recess. A method of manufacturing an electric component, comprising: an element mounting step of electrically connecting an electrode of an electric element and the first electrode; and a substrate dividing step of dividing the insulating substrate along the hole. 4. A first electrode forming step of forming at least two first electrodes per recess in the vicinity of open ends of a plurality of recesses disposed on one surface of an insulating substrate of a predetermined size. A second electrode forming step of forming at least one second electrode at a position substantially opposite to the first electrode on the other surface of the insulating substrate; and An element mounting step of electrically connecting the electrode of the element and the first electrode, and an end surface of the first electrode, an end surface of the second electrode, and the insulating substrate at a substantially intermediate position between the adjacent recesses. A substrate dividing step of dividing the insulating substrate so that the end faces thereof are substantially coincident with each other; and a third electrode for electrically connecting the first electrode and the second electrode at the end face of the divided insulating substrate. And a third electrode forming step of forming Method of manufacturing the goods. 5. An electric component substrate having at least one electric element mounted thereon, comprising: a plurality of holes arranged in an insulating substrate of a predetermined size and penetrating the insulating substrate in a thickness direction; A plurality of recesses arranged at a position sandwiched by at least two holes on one surface, wherein the electric element is placed in the recesses.