JP2007053312A - Surface-mounting coil component, its manufacturing method and its mounting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce a manufacturing cost of a surface-mounting coil component. <P>SOLUTION: In the manufacturing method of a surface-mounting coil component having a drum core 2 whereon a winding 1 is wound; a metallic piece 3 is fixed to the drum core 2, an end 1a of the winding 1 is mounted on the metallic piece 3, a solder 5 is disposed to cover the metallic piece 3, and the end 1a of the winding 1 and the solder 5 is molten. That is, the metallic piece 3 and the end 1a of the winding 1 are joined by the molten solder 5 covering the metallic piece 3 and the end 1a of the winding 1; and an electrode is constituted of the metallic piece 3, the end 1a of the winding 1, and the solder 5 covering them. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a surface-mounted coil component including a wound member around which a winding is wound, a manufacturing method thereof, and a mounting method thereof, and in particular, the manufacturing cost of the surface-mounted coil component can be reduced. The present invention relates to a surface mount coil component, a manufacturing method thereof, and a mounting method thereof.

  More specifically, the present invention relates to a surface mount type coil component such as a wound inductor, a wound choke coil, a manufacturing method thereof, and a mounting method thereof.

  For example, in a conventional method for manufacturing a surface mount type coil component such as a wound inductor, an electrode is generally formed on a predetermined portion of a drum core as a member to be wound, fired, and plated on the electrode. Processing is performed. Next, the end of the winding wound around the drum core is brought into contact with the surface of the plated electrode, and the end of the winding and the surface of the plated electrode are joined by solder. .

  However, in this method of manufacturing a surface mount type coil component, since the plating process is performed as described above, the manufacturing cost of the surface mount type coil component is increased by the cost of the plating process. Specifically, when the surface-mounting coil component is a large product, the number of surface-mounting coil components to be plated in one plating process is reduced, so one surface-mounting coil component. The manufacturing cost per hit increases.

  In another conventional surface mount type coil component manufacturing method, a frame electrode is attached to a sleeve core constituting a part of a member to be wound by an adhesive, and a drum constituting a part of the member to be wound The mold core and the sleeve core are connected. Next, the winding is wound around the drum core, the end of the winding is entangled with the frame electrode, and the end of the winding and the frame electrode are connected.

  However, in this method of manufacturing a surface mount type coil component, the surface to be joined to the sleeve core out of the surface of the frame electrode does not need to be plated. The surface to be bonded to the substrate at the time of mounting needs to be plated. Therefore, also in this method for manufacturing a surface mount type coil component, the manufacturing cost of the surface mount type coil component increases by the cost of the plating process. In particular, in this method of manufacturing a surface mount type coil component, when the plating process is performed on only one side of the surface of the frame electrode, the cost of the plating process is higher than the case where both sides of the frame electrode are plated. .

  Specifically, in this method of manufacturing a surface mount type coil component, when the end of the winding is entangled with the frame electrode, a process such as soldering is required, and the amount of the processing cost is reduced. The manufacturing cost of mounting type coil components will increase. Further, since the winding is covered so as not to conduct, if the end of the winding is not sufficiently processed, an open defect may occur.

  Still another example of a conventional method for manufacturing a surface mount type coil component is disclosed in Japanese Patent Application Laid-Open No. 2004-6629. In the method for manufacturing a surface mount type coil component described in Japanese Patent Application Laid-Open No. 2004-6629, a winding is wound around a drum core, an exterior core is attached to the drum core, and an electrode is attached to the exterior core. . The end of the winding is connected to the electrode.

  However, even in the method of manufacturing a surface mount type coil component described in Japanese Patent Application Laid-Open No. 2004-6629, the surface of the electrode that is bonded to the printed wiring board when the surface mount type coil component is mounted is plated. Processing is performed. In detail, in order to avoid that the surface of the electrode exposed until mounting is deteriorated by the time of mounting, a part of the surface of the electrode is plated. Therefore, even in the method for manufacturing the surface mount type coil component described in Japanese Patent Application Laid-Open No. 2004-6629, the manufacturing cost of the surface mount type coil component is increased by the cost of the plating process.

JP 2004-6629 A

  In view of the above problems, an object of the present invention is to provide a surface-mounted coil component, a manufacturing method thereof, and a mounting method thereof that can reduce the manufacturing cost of the surface-mounted coil component.

  According to the first aspect of the present invention, in the surface mount type coil component including the wound member around which the winding is wound, the metal piece bonded to the wound member, and the metal piece mounted on the metal piece. There is provided a surface mount type coil component comprising: an end portion of the winding to be placed; and a solder layer covering the end portion of the winding.

  According to the second aspect of the present invention, the surface mount type coil component according to the first aspect, wherein the metal piece is formed with a recess for accommodating the end of the winding and the solder layer. Is provided.

  According to a third aspect of the present invention, there is provided the surface mount type coil component according to the first or second aspect, wherein a recess for attaching the metal piece is formed in the wound member. .

  According to a fourth aspect of the present invention, in the method of manufacturing a surface mount type coil component including a wound member around which a winding is wound, a metal piece is attached to the wound member, and the metal piece is placed on the metal piece. Provided is a method of manufacturing a surface mount type coil component, wherein an end of the winding is placed, solder is disposed so as to cover the metal piece and the end of the winding, and the solder is melted. Is done.

  According to the invention described in claim 5, the solder covering the metal piece and the end of the winding is melted at the time of mounting and used for mounting. A method for mounting the surface-mounted coil component according to any one of the above items is provided.

  In the surface mount type coil component according to the first aspect, the metal piece attached to the member to be wound and the end of the winding are covered with the solder layer. That is, in the surface mount type coil component according to claim 1, the metal piece and the end of the winding are joined by the solder layer covering the metal piece and the end of the winding, and the metal piece and the end of the winding The electrode is comprised by the part and the solder layer which covers them.

  Therefore, according to the surface mount type coil component of the first aspect, like the surface mount type coil component described in Japanese Patent Application Laid-Open No. 2004-6629, the metal as an electrode that is exposed until mounting is provided. In order to avoid the surface from deteriorating before mounting, the need to plate the surface of the metal can be eliminated. That is, according to the surface mount type coil component of the first aspect, the manufacturing cost can be reduced.

  In the surface mount type coil component according to the second aspect, the end portion of the winding and the concave portion for accommodating the solder layer are formed in the metal piece. Therefore, the surface of the electrode constituted by the metal piece, the end portion of the winding, and the solder layer covering them can be easily maintained in a flat shape rather than the case where the metal piece is formed in a flat shape. it can. As a result, the surface of the electrode and the substrate can be easily joined at the time of mounting.

  In the surface mount type coil component according to the third aspect, the recess for attaching the metal piece is formed in the member to be wound. Therefore, the metal piece can be easily positioned with respect to the member to be wound.

  In the method of manufacturing the surface mount type coil component according to the fourth aspect, the metal piece attached to the member to be wound and the end of the winding are covered with solder. That is, in the method of manufacturing the surface mount type coil component according to claim 4, the metal piece and the end of the winding are joined by the melted solder covering the end of the metal piece and the winding. An electrode is composed of the piece, the end of the winding, and the solder covering them.

  Therefore, according to the method for manufacturing a surface-mounted coil component according to claim 4, it is exposed until mounting as in the method for manufacturing a surface-mounted coil component described in Japanese Patent Application Laid-Open No. 2004-6629. In order to avoid that the surface of the metal as an electrode is deteriorated by the time of mounting, the necessity of plating the surface of the metal can be eliminated. That is, according to the method for manufacturing a surface-mounted coil component according to claim 4, the manufacturing cost of the surface-mounted coil component is reduced by eliminating the necessity of plating the electrodes of the surface-mounted coil component. be able to.

  6. The surface mounting type coil component mounting method according to claim 5, wherein the solder covering the metal piece and the end of the winding is melted and used for mounting at the time of mounting. No new solder for joining is supplied.

  Therefore, according to the mounting method of the surface mounting type coil component according to claim 5, the metal and the winding as the electrode are wound as in the mounting method of the surface mounting type coil component described in JP-A-2004-6629. Eliminates the need to supply solder to the bottom of the electrode during mounting, separately from the solder that joins the end of the chip, to the surface-mounted coil component and, for example, a printed wiring board Can do.

  Hereinafter, a first embodiment of a method for producing a surface-mounted coil component according to the present invention will be described. FIG. 1 is a front view of a drum core 2 as a member to be wound constituting a surface mount type coil component. As shown in FIG. 1, a recess 2 a is formed on the lower surface of the drum core 2. In the method for manufacturing the surface-mounted coil component according to the first embodiment, the metal piece 3 is positioned in the concave portion 2a of the drum-type core 2 and is attached by, for example, an adhesive. Specifically, as shown in FIG. 2, the metal piece 3 is positioned and attached to the concave portion 2 a of the drum core 2.

  FIG. 2 is a view showing a state where the metal piece 3 is attached to the drum core 2. As shown in FIG. 2, a concave portion 3a is formed on the lower surface of the metal piece 3, and the surface of the metal piece 3 is not plated (may be plated). The metal piece 3 is made of, for example, copper. In the manufacturing method of the surface mount type coil component according to the first embodiment, the winding 1 is wound around the drum core 2 after the adhesive between the drum core 2 and the metal piece 3 is cured. 1 end 1a is folded back in a U-shape and placed on the metal piece 3 (the end 1a of the winding 1 may be bound on the metal piece 3).

  FIG. 3 is a view showing a state where the winding 1 is wound around the drum core 2 and the end 1 a of the winding 1 is placed on the metal piece 3. In the method for manufacturing the surface mount type coil component according to the first embodiment, as shown in FIGS. 2 and 3, the end 1 a of the winding 1 placed on the metal piece 3 is formed into the recess 3 a of the metal piece 3. Housed inside. Next, the winding 1 wound around the drum core 2 is covered with the exterior member 4. In the method for manufacturing the surface mount type coil component according to the first embodiment, the winding 1 is constituted by one conductive wire. However, in the method for manufacturing the surface mount type coil component according to the second embodiment, the coil In order to reduce the overall electrical resistance, it is possible to form the winding with two or more conductors.

  FIG. 4 is a view showing a state in which the winding 1 wound around the drum core 2 is covered with the exterior member 4. In the manufacturing method of the surface mount type coil component of the first embodiment, after the exterior member 4 covering the winding 1 wound around the drum core 2 is cured, the metal piece 3 and the end of the winding 1 are used. A solder 5 to be described later is arranged so as to cover 1a. As the solder 5, for example, a solder paste containing flux capable of removing impurities on the surface of the metal piece 3 is used.

  FIG. 5 is a view showing a state in which the solder 5 is disposed so as to cover the metal piece 3 and the end 1 a of the winding 1. In the method of manufacturing the surface mount type coil component according to the first embodiment, as shown in FIG. 5, the solder 5 is disposed so as to cover the right metal piece 3 and the end 1a of the winding 1, and similarly, the left side Solder 5 is arranged so as to cover the metal piece 3 and the end 1a of the winding 1. In the manufacturing method of the surface mount type coil component of the first embodiment, the solder 5 is arranged by a known method. Next, the solder 5 is melted by a suitable heating means, and the melted solder 5 completely covers the metal piece 3 and the end portion 1a of the winding 1. In other words, the melted solder 5 is filled in the recess 3 a of the metal piece 3 that houses the end 1 a of the winding 1. As a result, the metal piece 3 and the end 1a of the winding 1 are joined. Further, when the melted solder 5 is cured, the manufacture of the surface mount type coil component is completed.

  FIG. 6 is a view showing the surface mount type coil component manufactured by the method of manufacturing the surface mount type coil component of the first embodiment. Specifically, FIG. 6A is a front view of the surface mount type coil component, FIG. 6B is a bottom view of the surface mount type coil component, and FIG. 6C is a perspective view of the surface mount type coil component. .

  As shown in FIG. 6, in the surface mount type coil component manufactured by the method of manufacturing the surface mount type coil component of the first embodiment, the metal piece 3 and the end 1a of the winding 1 (see FIG. 5) are soldered. 5 is covered. That is, in the surface mount type coil component manufactured by the manufacturing method of the surface mount type coil component of the first embodiment, the electrode is formed by the metal piece 3, the end portion 1a of the winding 1, and the solder 5 covering them. It is configured.

  When the surface-mounted coil component manufactured by the method for manufacturing the surface-mounted coil component of the first embodiment is mounted, it can be mounted by a normal mounting method.

  In the method for manufacturing the surface-mounted coil component according to the first embodiment, as described above, the surface of the metal piece 3 does not require a plating process. Instead, the surface-mounted coil component is manufactured from the time of manufacturing the surface-mounted coil component. The surface of the metal piece 3 is covered with the solder 5 until the component is mounted. Therefore, the surface of the metal piece 3 that is not plated does not deteriorate by the time of mounting the surface mount type coil component.

  As described above, the surface-mounted coil component of the first embodiment is mounted by a normal method. That is, when the surface mount type coil component of the first embodiment is mounted, a new one is formed with respect to the electrode constituted by the metal piece 3, the end 1a of the winding 1, and the solder 5 covering them. Solder (not shown) is supplied, and the surface mount coil component is joined to the substrate by the solder (not shown).

  On the other hand, in another mounting method of the surface mount type coil component of the first embodiment, the solder 5 constituting a part of the electrode is melted by, for example, heating means, and the surface mount type coil component is heated by the solder 5. Is bonded to the substrate. That is, when the surface-mounting coil component is mounted, no new solder is supplied to join the surface-mounting coil component and the substrate. Instead, the metal piece 3 and the end 1a of the winding 1 The solder 5 that joins is used.

  Specifically, when this mounting method is adopted, the soldering property of the solder 5 for joining the surface mount type coil component and the substrate, and the metal piece 3 and the end 1a of the winding 1 are joined. Therefore, the wetting property of the solder 5 is equal. Therefore, the surface mount type coil component and the substrate are joined by adjusting the wettability of the solder 5 for joining the metal piece 3 and the end 1a of the winding 1 during the manufacture of the surface mount type coil component. Therefore, the wetting property of the solder 5 can be easily set to the desired wetting property.

  In other words, when a new solder (not shown) is supplied at the time of mounting the surface mount type coil component, there is a possibility that the soldering property of the solder (not shown) may be insufficient. When the surface-mounted coil component is mounted by the above-described method, no new solder is supplied, and the solder 5 that joins the metal piece 3 and the end 1a of the winding 1 is used. Therefore, by confirming the wettability of the solder 5 in advance during the manufacture of the surface mount coil component, it is ensured that the wettability of the solder 5 used when mounting the surface mount coil component may be insufficient. Can be eliminated.

  In the surface mount type coil component of the first embodiment, as shown in FIG. 6A, the bottom surface of the electrode is formed in a convex shape by the solder 5, but the surface mount type coil component of the third embodiment is used. Instead, it is also possible to form the bottom surface of the electrode in a planar shape with solder.

  When the surface mounting type coil component of the third embodiment is joined to the substrate by the solder constituting the part of the electrode without supplying new solder as in the mounting method described above, the electrode Since the bottom surface is configured to be planar with solder, the surface-mounted coil component can be easily mounted on the substrate in the same manner as when the bottom surface of the electrode is configured to be planar with metal.

It is a front view of the drum type core 2 as a to-be-wound member which comprises surface mount type coil components. It is the figure which showed the state by which the metal piece 3 was affixed on the drum type core 2. FIG. FIG. 2 is a view showing a state in which a winding 1 is wound around a drum core 2 and an end 1 a of the winding 1 is placed on a metal piece 3. FIG. 3 is a view showing a state where a winding 1 wound around a drum core 2 is covered with an exterior member 4. It is the figure which showed the state by which the solder 5 was arrange | positioned so that the metal piece 3 and the edge part 1a of the coil | winding 1 might be covered. It is the figure which showed the surface mount type coil components manufactured by the manufacturing method of the surface mount type coil component of 1st Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Winding 1a End part 2 Drum-type core 2a Concave part 3 Metal piece 3a Concave part 4 Exterior member 5 Solder

Claims (5)

  In a surface mount type coil component including a member to be wound around which a winding is wound, a metal piece to be bonded to the member to be wound, an end of the winding placed on the metal piece, A surface-mounting coil component comprising: a solder layer covering an end of the winding.   2. The surface mount type coil component according to claim 1, wherein a concave portion for accommodating the end portion of the winding and the solder layer is formed in the metal piece.   The surface mount type coil component according to claim 1, wherein a concave portion for attaching the metal piece is formed in the member to be wound.   In a method of manufacturing a surface mount type coil component comprising a wound member around which a winding is wound, a metal piece is attached to the wound member, and an end of the winding is placed on the metal piece, A method of manufacturing a surface mount type coil component, wherein solder is disposed so as to cover the metal piece and an end of the winding, and the solder is melted.   The surface mount type coil according to any one of claims 1 to 3, wherein the solder covering the metal piece and the end of the winding is melted during mounting and used for mounting. Component mounting method.

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