JPS6167592A - Welding method of low melting point metal - Google Patents
Welding method of low melting point metalInfo
- Publication number
- JPS6167592A JPS6167592A JP59190118A JP19011884A JPS6167592A JP S6167592 A JPS6167592 A JP S6167592A JP 59190118 A JP59190118 A JP 59190118A JP 19011884 A JP19011884 A JP 19011884A JP S6167592 A JPS6167592 A JP S6167592A
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- low melting
- welding
- transparent plate
- metallic body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は低融点金属をレーザー光線によって溶接する方
法の改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an improvement in the method of welding low melting point metals by means of laser beams.
先行技術と問題点
レーザー溶接においては、集光による高いエネルギー密
度を利用できる。而るに、温度ヒユーズや電流ヒユーズ
においては、ヒユーズ主体である低融点合金体と電極と
を溶接する必要があり、この溶接にレーザー溶接の利用
が考えられる。しかしながら、低融点合金をレーザー光
線によって溶接すると、レーザ一対照点において低融点
合金が飛散し易く、上記ヒユーズ主体である低融点合金
体の場合、本発明者等の実験結果によれば、低融点合金
の飛散のために溶接箇所の低融点合金体が著しく薄くな
り、該合金体と電極との間の電気抵抗が異常に増大する
。Prior Art and Problems In laser welding, high energy densities due to focused light can be utilized. However, in the case of temperature fuses and current fuses, it is necessary to weld the low melting point alloy body, which is the main body of the fuse, to the electrode, and it is possible to use laser welding for this welding. However, when welding a low melting point alloy with a laser beam, the low melting point alloy tends to scatter at the point where the laser beam is focused. Because of the scattering, the low melting point alloy body at the welding location becomes extremely thin, and the electrical resistance between the alloy body and the electrode increases abnormally.
而して、ヒユーズ主体と電極との溶接にレーザー光線を
使用することには問題がある。Therefore, there are problems in using a laser beam to weld the fuse body and the electrode.
発明の目的
本発明の目的は、レーザー溶接であっても上記ヒユーズ
主体を電極に秀れた導電度で溶接できる方法を提供する
ことKある。OBJECTS OF THE INVENTION An object of the present invention is to provide a method of welding the fuse main body to an electrode with excellent conductivity even when laser welding is used.
発明の構成
本発明に係る低融点金属の溶接方法は、低融点金属体を
透明板で覆い、該透明板を通して上記の低融、金属体を
レーザーにより溶接することを特徴とする方法である。Structure of the Invention The method for welding low-melting point metals according to the present invention is a method characterized by covering a low-melting point metal body with a transparent plate and welding the low-melting metal body through the transparent plate using a laser.
実施例の説明 以下、図面により本発明を説明する。Description of examples The present invention will be explained below with reference to the drawings.
図はセラミック基板1上に一対の電極2.2を設け、こ
れら電極間に低融点合金箔を連結する基板型温度ヒユー
ズの製作例を示し、本発明を適用するために、低融点合
金箔3は、透明板(例えばガラス板)4の裏面に層状に
設けである。この層状形成には、ディピング(他面はマ
スクする)、溶射等を用いることができる。低融点合金
には鉛、錫、ビスマス、カドミウム、インジウム、銀等
の金属やそれらの合金を用いることができる。The figure shows an example of manufacturing a substrate type temperature fuse in which a pair of electrodes 2.2 are provided on a ceramic substrate 1 and a low melting point alloy foil is connected between these electrodes. is provided in a layered manner on the back surface of a transparent plate (for example, a glass plate) 4. For this layered formation, dipping (the other side is masked), thermal spraying, etc. can be used. Metals such as lead, tin, bismuth, cadmium, indium, silver, and alloys thereof can be used as the low melting point alloy.
本発明によって、レーザー溶接機Aにより低融点合金層
3を電極2に溶接するには、集光レンズ5により焦点を
レーザー射照点にあわせ、レーザー光線を透明ガラス板
を通して照射する。According to the present invention, in order to weld the low melting point alloy layer 3 to the electrode 2 using the laser welding machine A, the focus is set on the laser irradiation point using the condenser lens 5, and the laser beam is irradiated through the transparent glass plate.
而して、照射点における高いエネルギー密度のために一
瞬にして溶接ができ、この場合、透明板のために照射点
での低融点合金の飛散を確実に防止できる。The high energy density at the irradiation point allows instant welding, and in this case, the transparent plate can reliably prevent the low melting point alloy from scattering at the irradiation point.
上記実施例においては、透明板と低融点合金層とを一体
化しているが、電極間に低融点合金箔を置き、このうえ
に小ギャップ(0−0,511)を隔てて透明板を配設
し、この透明板を介して溶接点にレーザー光線を照射す
るようにしてもよい。In the above embodiment, the transparent plate and the low melting point alloy layer are integrated, but a low melting point alloy foil is placed between the electrodes, and a transparent plate is placed on top of this with a small gap (0-0,511). The welding point may be irradiated with a laser beam through this transparent plate.
発明の効果
本発明に係る低融点金属の溶接方法は、上述した通りの
方法であり、低融点合金体を透明板で覆い、この透明板
を通してレーザー溶接しているから、レーザー光線によ
る低融点合金の飛散を透明板によって確実に防止できる
。従って、ヒユーズ主体を電極に秀れた導電度で溶接で
き、温度ヒユーズ、電流ヒユーズの製造にレーザー溶接
を使用して製造能率を向上できる。Effects of the Invention The method for welding low melting point metals according to the present invention is as described above, and since the low melting point alloy body is covered with a transparent plate and laser welding is performed through this transparent plate, the low melting point alloy can be welded by the laser beam. Splashing can be reliably prevented by the transparent plate. Therefore, the main body of the fuse can be welded to the electrode with excellent conductivity, and laser welding can be used to manufacture temperature fuses and current fuses to improve manufacturing efficiency.
図面は本発明に係る低融点金属の溶接方法を示す説明図
である。
図において、2,2は電極、3は低融点合金体、4は透
明板、Aはレーザー溶接機である。
:魁叫
手続補正書(自発)
昭和59年10月 5日
1、 事件の表示
昭和59年特許願第190118号
2、発明の名称
低融点金属の溶接方法
3、補正をする者
事件との関係 特許出願人
4、代理人 〒662
住所 兵庫県西宮市門戸荘15番11号5、 補正の対
象 1どll(1)明細書
の発明の詳細な説明の欄
6、 補正の内容
(1)明細)lの第2頁、第13行目に「低融、金属体
」とあるのを「低融点金属体」と補正します。The drawings are explanatory diagrams showing a method for welding low melting point metals according to the present invention. In the figure, 2 and 2 are electrodes, 3 is a low melting point alloy body, 4 is a transparent plate, and A is a laser welding machine. : Writ of amendment to the shouting procedure (spontaneous) October 5, 1980 1, Indication of the case 1989 Patent Application No. 190118 2, Name of the invention Method for welding low melting point metals 3, Person making the amendment Relationship to the case Patent applicant 4, agent Address: 15-11-5 Kadosho, Nishinomiya City, Hyogo Prefecture 662 Subject of amendment 1. (1) Column 6 for detailed explanation of the invention in the specification Contents of amendment (1) Specification )l, page 2, line 13, the phrase "low melting metal body" will be corrected to "low melting point metal body."
Claims (1)
低融点合金体をレーザーにより溶接することを特徴とす
る低融点金属の溶接方法。1. A method for welding low melting point metals, which comprises covering a low melting point metal body with a transparent plate, and welding the low melting point alloy body through the transparent plate using a laser.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59190118A JPS6167592A (en) | 1984-09-10 | 1984-09-10 | Welding method of low melting point metal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59190118A JPS6167592A (en) | 1984-09-10 | 1984-09-10 | Welding method of low melting point metal |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6167592A true JPS6167592A (en) | 1986-04-07 |
Family
ID=16252682
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59190118A Pending JPS6167592A (en) | 1984-09-10 | 1984-09-10 | Welding method of low melting point metal |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6167592A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100370330B1 (en) * | 1998-06-04 | 2003-01-29 | 가부시키가이샤 히타치세이사쿠쇼 | A method of manufacturing the electronic circuit board and an apparatus of manufacturing the same |
-
1984
- 1984-09-10 JP JP59190118A patent/JPS6167592A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100370330B1 (en) * | 1998-06-04 | 2003-01-29 | 가부시키가이샤 히타치세이사쿠쇼 | A method of manufacturing the electronic circuit board and an apparatus of manufacturing the same |
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