JPS5852689Y2 - 半導体装置用金属支持体 - Google Patents

半導体装置用金属支持体

Info

Publication number
JPS5852689Y2
JPS5852689Y2 JP1977049208U JP4920877U JPS5852689Y2 JP S5852689 Y2 JPS5852689 Y2 JP S5852689Y2 JP 1977049208 U JP1977049208 U JP 1977049208U JP 4920877 U JP4920877 U JP 4920877U JP S5852689 Y2 JPS5852689 Y2 JP S5852689Y2
Authority
JP
Japan
Prior art keywords
lead
element fixing
metal body
mounting hole
fixing part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1977049208U
Other languages
English (en)
Japanese (ja)
Other versions
JPS53143563U (enExample
Inventor
武則 横田
洋輔 岡本
正勝 武谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1977049208U priority Critical patent/JPS5852689Y2/ja
Publication of JPS53143563U publication Critical patent/JPS53143563U/ja
Application granted granted Critical
Publication of JPS5852689Y2 publication Critical patent/JPS5852689Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1977049208U 1977-04-18 1977-04-18 半導体装置用金属支持体 Expired JPS5852689Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977049208U JPS5852689Y2 (ja) 1977-04-18 1977-04-18 半導体装置用金属支持体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977049208U JPS5852689Y2 (ja) 1977-04-18 1977-04-18 半導体装置用金属支持体

Publications (2)

Publication Number Publication Date
JPS53143563U JPS53143563U (enExample) 1978-11-13
JPS5852689Y2 true JPS5852689Y2 (ja) 1983-12-01

Family

ID=28934369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977049208U Expired JPS5852689Y2 (ja) 1977-04-18 1977-04-18 半導体装置用金属支持体

Country Status (1)

Country Link
JP (1) JPS5852689Y2 (enExample)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS513739U (enExample) * 1974-06-25 1976-01-12
US3934214A (en) * 1975-03-31 1976-01-20 Bell Telephone Laboratories, Incorporated Sealed contact having tapered reed tips

Also Published As

Publication number Publication date
JPS53143563U (enExample) 1978-11-13

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