JPS5848954A - テ−プキヤリア型ｉｃ用基板 - Google Patents

テ−プキヤリア型ｉｃ用基板

Info

Publication number
JPS5848954A
JPS5848954A JP56148334A JP14833481A JPS5848954A JP S5848954 A JPS5848954 A JP S5848954A JP 56148334 A JP56148334 A JP 56148334A JP 14833481 A JP14833481 A JP 14833481A JP S5848954 A JPS5848954 A JP S5848954A
Authority
JP
Japan
Prior art keywords
copper
thickness
alloy
clad
foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56148334A
Other languages
English (en)
Japanese (ja)
Other versions
JPH029457B2 (OSRAM
Inventor
Hiroshi Ishibe
石部　浩
Nobuo Ogasa
小笠　伸夫
Akira Otsuka
昭 大塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP56148334A priority Critical patent/JPS5848954A/ja
Publication of JPS5848954A publication Critical patent/JPS5848954A/ja
Publication of JPH029457B2 publication Critical patent/JPH029457B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Laminated Bodies (AREA)
JP56148334A 1981-09-18 1981-09-18 テ−プキヤリア型ｉｃ用基板 Granted JPS5848954A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56148334A JPS5848954A (ja) 1981-09-18 1981-09-18 テ−プキヤリア型ｉｃ用基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56148334A JPS5848954A (ja) 1981-09-18 1981-09-18 テ−プキヤリア型ｉｃ用基板

Publications (2)

Publication Number Publication Date
JPS5848954A true JPS5848954A (ja) 1983-03-23
JPH029457B2 JPH029457B2 (OSRAM) 1990-03-02

Family

ID=15450442

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56148334A Granted JPS5848954A (ja) 1981-09-18 1981-09-18 テ−プキヤリア型ｉｃ用基板

Country Status (1)

Country Link
JP (1) JPS5848954A (OSRAM)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0260137A (ja) * 1988-08-26 1990-02-28 Mitsui Toatsu Chem Inc 半導体素子の実装用基板
JPH0260138A (ja) * 1988-08-26 1990-02-28 Mitsui Toatsu Chem Inc 半導体素子の実装用の基板
JP2007092985A (ja) * 2005-08-30 2007-04-12 Nissan Motor Co Ltd ピストンリング構造体
JP2008306102A (ja) * 2007-06-11 2008-12-18 Hitachi Cable Ltd 半導体装置用テープキャリア及びその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0260137A (ja) * 1988-08-26 1990-02-28 Mitsui Toatsu Chem Inc 半導体素子の実装用基板
JPH0260138A (ja) * 1988-08-26 1990-02-28 Mitsui Toatsu Chem Inc 半導体素子の実装用の基板
JP2007092985A (ja) * 2005-08-30 2007-04-12 Nissan Motor Co Ltd ピストンリング構造体
JP2008306102A (ja) * 2007-06-11 2008-12-18 Hitachi Cable Ltd 半導体装置用テープキャリア及びその製造方法

Also Published As

Publication number Publication date
JPH029457B2 (OSRAM) 1990-03-02

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