JPS5848951A - Applying method for flux to terminal of electronic part - Google Patents
Applying method for flux to terminal of electronic partInfo
- Publication number
- JPS5848951A JPS5848951A JP14735781A JP14735781A JPS5848951A JP S5848951 A JPS5848951 A JP S5848951A JP 14735781 A JP14735781 A JP 14735781A JP 14735781 A JP14735781 A JP 14735781A JP S5848951 A JPS5848951 A JP S5848951A
- Authority
- JP
- Japan
- Prior art keywords
- flux
- terminal
- jig
- holes
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/082—Flux dispensers; Apparatus for applying flux
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は電子部品端子への７ラツクス塗布方法に関し、
特にプリント配線板ユニット組立に係る′−電子部品に
組立後の選択的に７ラツクス洗浄を避けたい電子部品の
半田付は時、部品端子に塗着するスラックスの液面制御
法に関する。[Detailed Description of the Invention] The present invention relates to a method of applying 7 lux to electronic component terminals,
Particularly, when soldering electronic components in connection with the assembly of printed wiring board units, where it is desired to selectively avoid 7-lux cleaning after assembly, the present invention relates to a method of controlling the liquid level of the slack applied to the component terminals.
プリント配−された絶縁基板に各種電子部品を半田付実
装するユニット組立にさ−し、時とじて実装後の洗浄例
えばトリクロルエチレン等有機性溶剤によるじ中ぶ洗い
を避けたい例えば水晶発振子等の部品を組込むことがあ
る。この種部品のユニットへの半田付実装は通常の組立
工程とは別個の７ラツクスを使用しない半田付組立工程
をとって半田付実装をするのが一般的である。しかし、
前記実装前の部品端子（以下リード端子と呼ぶ）に対し
ては所謂予備半田処理、即ち半田ぬれ性をよくするため
の半田処理をなすが、このさいロジン系フ２ツクスを併
用して半田付は性を向上しておくことが望ましい。When assembling a unit in which various electronic components are soldered and mounted on a printed insulating board, it is sometimes desirable to avoid cleaning after mounting, e.g. by directly washing with organic solvents such as trichlorethylene, for example, crystal oscillators, etc. parts may be incorporated. This type of component is generally soldered into a unit using a soldering assembly process that does not use 7 lux, which is separate from the normal assembly process. but,
The component terminals (hereinafter referred to as lead terminals) before mounting are subjected to so-called preliminary soldering, that is, soldering to improve solder wettability. It is desirable to improve your sexuality.
従来、かかる部品のリード端子への７２ツクス塗布は手
作業によシ、シかも適切な治工具とてなく、このため塗
布量が一定とならず不必要な部子面まで塗着され、又リ
ード端子以外の部分に７、ラックスが付着し九シして甚
だ不都合である。Conventionally, the application of 72x to the lead terminals of such parts was done manually, or without proper jigs and tools, and as a result, the amount of application was not constant, and unnecessary component surfaces were coated. 7. Lux adheres to parts other than the lead terminals, which is extremely inconvenient.
本発明の目的は前記の不都合を解消すべくなされたもの
て、本発明によれテ、部品リード端子浸漬の７２ツクス
槽と部品筐体との間にリード端子嵌通孔を有する対組の
平板治具を介在せしめて、前記リード端子に対する前記
ンラックス塗布を一足レベルとすることを％徴とする電
子部品端子への７シツクス塗布方法が提供される。An object of the present invention has been made to solve the above-mentioned disadvantages.According to the present invention, a pair of flat plates having lead terminal fitting holes between a 72x tank for immersing component lead terminals and a component housing are provided. There is provided a 7-six coating method for electronic component terminals, which is characterized by interposing a jig and applying the lax coating to the lead terminals to a one-sixth level.
以下、本発明の一実施例について添付図を参照して説明
する。図は本発明の平板治具を用いて部品リード端子を
浸漬してなす７−）ツクス塗布状態を示す側断面図であ
る。Hereinafter, one embodiment of the present invention will be described with reference to the accompanying drawings. The figure is a sectional side view showing a state in which 7-) Tux is applied by dipping component lead terminals using the flat plate jig of the present invention.
図において、ｌｆｉ部品又は部品の筐体、２は該部品１
のリード端子で、リード端子数は一例に過ぎず又端子形
状は丸形あるいは角形側れでも構わない。３は広巾の７
２ツクス槽、４と５は本発明の７２ｙクス液面制御をな
す対組の平板治具であって夫々部品１のリード端子数並
びに端子形状に対応する端子嵌通孔６を具備する。上方
治Ａ４はリード端子２を上方から嵌通しやすいガイド７
を設は部品リード端子の７ラツクス浸漬を袢易とさせ、
他方の下方治＾５は常時その底面８がスラックス液面９
よ）低くなる様前記槽３の上方側に定置されると共に、
これによりリード端子嵌通孔６には毛細管現象によるス
ラックス液面が上昇する構成とされる。これは例えば治
具両端に位置する空き端子孔６′とＣにおける７ラツク
ス液面を見れば明らかである。然るにリード端子が嵌通
された図示中央部の端子嵌通孔６では端子孔内空隙が微
小となり”７ラツクス液面は更に上昇し、下方治Ａ５と
上方治具４との間に設ける空ｌ！ｉ！１０の下端、ａ−
ａ線で示す水平レベルまで上昇する。そしてかかる空隙
ｌＯの存在によって毛細管現象によるンラックスの上昇
はかかる水平レベルで終了する。In the figure, the lfi part or the housing of the part, 2 is the part 1.
The number of lead terminals is merely an example, and the terminal shape may be round or square with side edges. 3 is a wide 7
The 2x tanks 4 and 5 are a pair of flat plate jigs for controlling the 72x liquid level of the present invention, and are each provided with terminal fitting through holes 6 corresponding to the number and terminal shape of the lead terminals of the component 1. The upper jig A4 is a guide 7 that allows the lead terminal 2 to be easily inserted from above.
The setting makes it easier to immerse the component lead terminals in 7 lux.
The bottom surface 8 of the other lower part 5 is always the slack liquid level 9.
y) is placed on the upper side of the tank 3 so as to be lower,
As a result, the slack liquid level rises in the lead terminal fitting through hole 6 due to capillary action. This is clear, for example, by looking at the 7 lux liquid level at the empty terminal holes 6' and C located at both ends of the jig. However, in the terminal fitting through hole 6 in the center of the figure into which the lead terminal is inserted, the gap inside the terminal hole becomes minute, and the liquid level of 7 lux rises further, causing the gap formed between the lower jig A5 and the upper jig 4 to increase. !i! Lower end of 10, a-
It rises to the horizontal level shown by line a. Due to the existence of such a void lO, the rise in flux due to capillary action ends at this horizontal level.
即ち、フラックス液面と接触している下方治具５の高さ
相当分のリード端子長がンラックス塗布されることにな
多部品筐体に近い端子部分は塗布されない。要するに本
発明の７２ツクス塗布は前記対組の平板治具４と５の中
、下方治Ｊ４ｅ５の端子嵌通孔６の軸方向高さで塗布レ
ベルが管理されること、しかも塗布レベルは治具５の高
きｔ−変えるのみで自由に調整可能となることである。That is, the length of the lead terminal corresponding to the height of the lower jig 5 that is in contact with the flux liquid level is coated with Nlux, but the terminal portion near the multi-component housing is not coated. In short, in the 72x coating of the present invention, the coating level is controlled by the axial height of the terminal fitting through hole 6 of the lower jig J4e5 in the pair of flat plate jigs 4 and 5, and the coating level is controlled by the jig. It can be freely adjusted by simply changing the high t of 5.
かかる治具は図示の様にフラックス槽を上方から完全に
覆う様に取付けられている九め関連りて７２ツクス飛沫
が生じて部品筐体等に付層するとともなく安定とする作
業が出来る効果も期待出来る。As shown in the figure, this jig is installed so as to completely cover the flux tank from above.As a result, 72 Tx droplets are generated and deposited on the parts casing, etc., making the work more stable. You can also expect it.
かかる峨点から本発明によるフラックス槽制御法は実用
性は大きい。From this point of view, the flux tank control method according to the present invention has great practicality.
図は本発明の実施例を示す対組の平板治具を介在して部
品リード端子の７ラククス塗布レベルを一足とする浸漬
状態を示す側断面図である。
図中、１は部品筐体、２は物品電子又はリード端子、３
はフラックス槽、４と５は対組の平板治具、６は端子２
の嵌通孔、及びａ−ａｍはスラックス塗布レベルである
。The figure is a side cross-sectional view showing an embodiment of the present invention in which a component lead terminal is immersed at a coating level of 7 lac using a pair of flat plate jigs. In the figure, 1 is the component housing, 2 is the electronic product or lead terminal, and 3 is the component housing.
is a flux tank, 4 and 5 are paired flat plate jigs, and 6 is terminal 2.
The fitting hole and a-am are at the slack coating level.
Claims (1)
貫通孔の所望の位置に前記貫通孔の一部が拡大されてな
る空間を有する板状治具の一方の主面を、フラックス浴
の表面に接して配置し、前記板状治具の他方の主面から
前記貫通孔に挿入された被処理電子部品の端子の表面に
選択的に７２ツクスを塗布することを特徴とする電子部
品端子への７２ツクス塗布方法０One main surface of a plate-shaped jig having a through hole corresponding to a terminal of an electronic component to be processed and a space formed by enlarging a portion of the through hole at a desired position of the through hole is heated in a flux bath. 72x is selectively applied to the surface of the terminal of the electronic component to be processed which is placed in contact with the surface of the electronic component and which is inserted into the through hole from the other main surface of the plate-shaped jig. How to apply 72x to the terminal0
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14735781A JPS5848951A (en) | 1981-09-18 | 1981-09-18 | Applying method for flux to terminal of electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14735781A JPS5848951A (en) | 1981-09-18 | 1981-09-18 | Applying method for flux to terminal of electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5848951A true JPS5848951A (en) | 1983-03-23 |
Family
ID=15428362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14735781A Pending JPS5848951A (en) | 1981-09-18 | 1981-09-18 | Applying method for flux to terminal of electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5848951A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0576053U (en) * | 1992-03-16 | 1993-10-15 | アイワ株式会社 | Surface mount electronic components |
-
1981
- 1981-09-18 JP JP14735781A patent/JPS5848951A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0576053U (en) * | 1992-03-16 | 1993-10-15 | アイワ株式会社 | Surface mount electronic components |
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