JPH0431200B2 - - Google Patents
Info
- Publication number
- JPH0431200B2 JPH0431200B2 JP61055699A JP5569986A JPH0431200B2 JP H0431200 B2 JPH0431200 B2 JP H0431200B2 JP 61055699 A JP61055699 A JP 61055699A JP 5569986 A JP5569986 A JP 5569986A JP H0431200 B2 JPH0431200 B2 JP H0431200B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- connector
- coating material
- insulating coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011248 coating agent Substances 0.000 claims description 45
- 238000000576 coating method Methods 0.000 claims description 45
- 239000000463 material Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 7
- 125000006850 spacer group Chemical group 0.000 claims description 5
- 239000003973 paint Substances 0.000 description 17
- 230000017525 heat dissipation Effects 0.000 description 14
- 239000002184 metal Substances 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000003618 dip coating Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子機器に係わり、特に外部回路に接
続されるコネクタを備えた電子機器の改良に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to electronic equipment, and particularly to improvement of electronic equipment equipped with a connector connected to an external circuit.
従来、この種の電子機器においては、例えば、本
出願人による公開技法（発行日：1982年10月20
日、整理番号：28−080）に開示されているよう
に、四角環状の筒体の一側壁にはコネクタを嵌着
し、プリント基板の表面には複数の電気素子を立
設し、然る後、プリント基板を筐体内にその低部
側から嵌装しつつ、コネクタの複数のコネクタピ
ンの各下端を、プリント基板の各適所に予め穿設
した各貫通孔内にそれぞれ挿入半田付けするよう
にしたものがある。
Conventionally, in this type of electronic equipment, for example, the technique published by the present applicant (Publication date: October 20, 1982)
28-080), a connector is fitted on one side wall of a square ring-shaped cylinder, and a plurality of electric elements are erected on the surface of a printed circuit board. After that, while fitting the printed circuit board into the housing from the bottom side, insert and solder the lower ends of the plurality of connector pins of the connector into the respective through holes previously drilled at appropriate locations on the printed circuit board. There is something I did.
ところで、このような構成においては、コネク
タが筐体に嵌着されているため、プリント基板の
表裏面双方全体に防湿剤等の絶縁被膜塗料を塗布
するにあたつては、適宜な容器内に収容した絶縁
被膜塗料内にプリント基板の表裏面双方全体を浸
漬するのみで簡単に行える。しかしながら、プリ
ント基板の筐体への組付時にコネクタの各コネク
タピンの下端をプリント基板の各貫通孔にそれぞ
れ挿入半田付けしなければならず、各コネクタピ
ンの下端とプリント基板の貫通孔との間に位置ず
れがあると、上述のような挿入半田付け作業が困
難になるという不具合が生じる。特に、このよう
なことは、コネクタのコネクタピンの数が多い程
著しい。また、上述のような挿入半田付け作業に
よる半田付けの電気的効果を確保するには、この
挿入半田作業に先立つて、プリント基板の各貫通
孔周辺に位置する表裏面部分に予め塗料付着防止
用マスキングテープを貼り、かつこのマスキング
テープを、上述のような浸漬塗布作業後に剥離す
るという余分な作業も必要となる。
By the way, in such a configuration, since the connector is fitted into the housing, when applying an insulating coating paint such as a moisture-proofing agent to both the front and back surfaces of the printed circuit board, place it in an appropriate container. This can be easily done by simply immersing both the front and back surfaces of the printed circuit board in the contained insulating coating paint. However, when assembling the printed circuit board into the housing, the lower end of each connector pin of the connector must be inserted and soldered into each through hole of the printed circuit board, and the lower end of each connector pin and the through hole of the printed circuit board must be inserted and soldered. If there is a positional shift between them, a problem arises in that the insertion soldering work as described above becomes difficult. In particular, this problem becomes more pronounced as the number of connector pins of the connector increases. In addition, in order to ensure the electrical effect of the soldering through the insertion soldering work as described above, prior to the insertion soldering work, the front and back surfaces of the printed circuit board located around each through-hole must be coated with paint to prevent paint from adhering. It also requires the extra work of applying masking tape and peeling off the masking tape after the dip coating operation as described above.
これに対しては、コネクタをプリント基板の表
面に組み付けるとともにコネクタの各コネクタピ
ンの下端をプリント基板の各貫通孔に挿入半田付
けした後に上述のような浸漬塗布作業を行うこと
も考えられる。然るに、かかる場合には、プリン
ト基板の絶縁被膜塗料内への浸漬時にコネクタの
外部回路からのコネクタとの接続部分まで絶縁被
膜塗料内に浸漬されてしまうという不具合が生じ
る。また、コネクタの外部回路との接続部分を絶
縁被膜塗料内に浸漬させないようにしてプリント
基板に対する絶縁被膜塗料浸漬塗布作業を行おう
とすると、単一の浸漬工程では済まないという不
具合もある。 To solve this problem, it is conceivable to assemble the connector on the surface of the printed circuit board and insert and solder the lower ends of each connector pin of the connector into each through hole of the printed circuit board, and then perform the above-described dip coating operation. However, in such a case, when the printed circuit board is dipped into the insulating coating paint, a problem arises in that the connecting portion of the connector from the external circuit to the connector is also immersed in the insulating coating paint. Furthermore, if an attempt is made to dip-coat a printed circuit board with an insulating coating without immersing the connecting portion of the connector with an external circuit in the insulating coating, a single dipping step is not enough.
一方、特開昭60−158693号公報に示されている
ように、プリント基板上に防御棚を採用して、こ
の防御棚により、上述のようなコネクタの外部回
路との接続部分を包囲することも考えられる。し
かし、このような防御棚の採用によつて、コネク
タの外部回路との接続部分に絶縁被膜材料が付着
することは防止し得るとしても、防御棚という余
分な部材が必要となり、この種電子機器のコスト
上昇を招く。また、プリント基板の表面の防御棚
内に臨む部分は、絶縁被膜材料による塗布を施せ
ないという不具合を招く。 On the other hand, as shown in Japanese Patent Application Laid-Open No. 60-158693, a protection shelf is adopted on the printed circuit board, and the connection part of the connector with the external circuit as described above is surrounded by this protection shelf. can also be considered. However, even if the adoption of such a protection shelf can prevent the insulating coating material from adhering to the connection part of the connector with the external circuit, an extra member called the protection shelf is required, and this kind of electronic equipment This will lead to an increase in costs. Further, the portion of the surface of the printed circuit board facing the inside of the protective shelf may not be coated with an insulating coating material.
また、特開昭57−20494号公報に示されている
ように、プリント基板を傾斜させて絶縁被膜材料
内に浸漬させることにより、上述のようなコネク
タの外部回路との接続部分を絶縁被膜材料内に浸
漬させないようにすることも考えられる。しか
し、かかる場合には、プリント基板上にてコネク
タから離れた位置に接続された絶縁被膜材料を塗
布すべべきでない部品までも、上述のようなプリ
ント基板の絶縁被膜材料内への傾斜状の浸漬時に
同絶縁被膜材料内に浸漬されてしまうという不具
合を招く。 In addition, as shown in Japanese Patent Application Laid-open No. 57-20494, by tilting the printed circuit board and immersing it in the insulating coating material, the connection part of the connector with the external circuit as described above can be made of the insulating coating material. It is also conceivable to prevent it from being immersed in the water. However, in such a case, even components connected at a position remote from the connector on the printed circuit board that should not be coated with the insulating coating material are subjected to the inclined immersion of the printed circuit board into the insulating coating material as described above. This sometimes causes problems such as being immersed in the same insulating coating material.
さらにまた、特開昭58−186990号公報には、プ
リント基板を角度θだけ傾斜させて保持し、コー
テイング材料の噴射ノズルをこまめに動かし、コ
ーテイング材料の付着が禁止された部品の位置し
ない方向にコーテイング材料を流し落とす方式が
示されている。しかしこの方式であると、個々の
部品の配列が異なる基板にし、それぞれ専用の複
雑な噴射ノズル移動工程をもつ必要があり、ま
た、コーテイング材料の流れ落ちる位置にコーテ
イング材料の付着が禁止された部品を配設するこ
とができないという制約もある。また、コーテイ
ング材料の噴霧がコーテイング不可部品にかかる
恐れもあつた。 Furthermore, JP-A-58-186990 discloses that a printed circuit board is held tilted by an angle θ, and a coating material injection nozzle is moved frequently in a direction where no parts prohibited from adhering to the coating material are located. A method for pouring off the coating material is shown. However, with this method, it is necessary to use substrates with different arrangements of individual parts, each with its own complicated injection nozzle movement process, and also to place parts where the coating material is prohibited from adhering to the position where the coating material will fall. There is also a restriction that it cannot be installed. There was also a risk that the spray of the coating material would fall on parts that cannot be coated.
本発明は上述した不具合を一挙に解決すべくな
されたものであり、プリント基板の表裏面を水平
状態のまま一度にコーテイング材料内に浸漬させ
て、コーテイング材料を塗布する方式としても、
電気的素子及びコネクタの位置に関係なくコーテ
イング材料がコネクタ本体の嵌合穴に流入するの
を防止することを可能にしたものである。 The present invention has been made in order to solve the above-mentioned problems all at once, and it can also be used as a method in which the front and back surfaces of the printed circuit board are immersed in the coating material at once in a horizontal state to apply the coating material.
This makes it possible to prevent the coating material from flowing into the fitting hole of the connector body regardless of the position of the electrical element and the connector.
このため本発明では、コーテイング材料を塗布
すべきリード端子を有する電気的素子の配設され
たプリント基板と、このプリント基板の表面に接
続されたコネクタピンを嵌挿するとともに、この
コネクタピンを外部回路に接続する嵌合穴を有
し、前記プリント基板の表面に組み付けられたコ
ネクタ本体とを備えた電子機器において、前記コ
ネクタ本体と前記プリント基板との間に、前記プ
リント基板をほぼ水平状に前記コーテイング材料
内に浸漬させた際にコーテイング材料が前記コネ
クタ本体の嵌合穴に流入するのを防止するのに必
要な所定高さを有する脚部材を形成し、前記所定
高さは少なくとも、前記プリント基板の表面より
突出した部分の前記リード端子の長さに相当する
高さを有する電子機器とした。
Therefore, in the present invention, a printed circuit board on which an electrical element having lead terminals to which a coating material is to be applied is fitted and a connector pin connected to the surface of this printed circuit board is inserted, and this connector pin is externally In an electronic device comprising a connector body having a fitting hole connected to a circuit and assembled on a surface of the printed circuit board, the printed circuit board is placed approximately horizontally between the connector body and the printed circuit board. forming a leg member having a predetermined height necessary to prevent coating material from flowing into the mating hole of the connector body when immersed in the coating material; The electronic device had a height corresponding to the length of the lead terminal of the portion protruding from the surface of the printed circuit board.
この構成では、コネクタ本体とプリント基板と
の間に、プリント基板の表面より突出した電気的
素子のリード端子の長さに少なくとも相当する高
さの脚部材が形成されている。従つて、プリント
基板をコーテイングする際、プリント基板をほぼ
水平状態のまま垂下させてコーテイング材料内に
浸漬するという簡単な単一の作業工程のみで、コ
ーテイングすべきリード端子を確実にコーテイン
グでき、またコーテイングすべきでないコネクタ
ピンの嵌合穴を、コーテイング材料から隔離する
ことができる。また、コネクタ本体や電気的素子
の基板上の位置に関係なく、適正なコーテイング
を簡単に実施できるという優れた効果がある。
In this configuration, leg members are formed between the connector body and the printed circuit board, and the leg members have a height at least equivalent to the length of the lead terminal of the electrical element protruding from the surface of the printed circuit board. Therefore, when coating a printed circuit board, the lead terminals to be coated can be reliably coated by a simple single process of hanging the printed circuit board in a substantially horizontal state and immersing it in the coating material. The mating holes of the connector pins that should not be coated can be isolated from the coating material. Further, there is an excellent effect that appropriate coating can be easily performed regardless of the position of the connector body or the electrical element on the board.
以下、本発明の一実施例を図面により説明する
と、第１図は本発明に係る電子機器を示してお
り、この電子機器は、箱状金属筐体１０と、この
金属筐体１０内にてその底壁上に複数のプリント
基板保持部１１〜１１（第１図にては単一のスペ
ーサのみを示す）を介し複数のネジ１２〜１２の
締着により組み付けたプリント基板２０と、この
プリント基板２０の表面に組み付けた半導体チツ
プ３０ａ、抵抗３０ｂ、パワトランジスタ３０
ｃ、放熱フイン４０及びコネクタ５０とにより構
成されている。
Hereinafter, one embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows an electronic device according to the present invention, and this electronic device includes a box-shaped metal casing 10 and a structure inside the metal casing 10. A printed circuit board 20 is assembled onto the bottom wall by tightening a plurality of screws 12 to 12 via a plurality of printed circuit board holders 11 to 11 (only a single spacer is shown in FIG. 1), and this printed circuit board A semiconductor chip 30a, a resistor 30b, and a power transistor 30 assembled on the surface of the substrate 20
c, a heat radiation fin 40, and a connector 50.
半導体チツプ３０ａは、第１図及び第２図に示
すごとく、その複数のリード端子を、プリント基
板２０の適所に穿設した各貫通孔内にそれぞれ挿
通半田付けしてプリント基板２０の表面に立設さ
れている。抵抗３０ｂは、その両リード端子を、
プリント基板２０の適所に穿設した両貫通孔内に
それぞれ挿通半田付けしてプリント基板２０の表
面に立設されている。また、パワトランジスタ３
０ｃは、プリント基板２０の表面一側中央部分上
に立設した放熱フイン４０の内壁にネジ４１の締
着により立設して組み付けられており、このパワ
トランジスタ３０ｃの各リード端子は、プリント
基板２０の適所に穿設した各貫通孔内に挿通半田
付けされている。 As shown in FIGS. 1 and 2, the semiconductor chip 30a is mounted on the surface of the printed circuit board 20 by inserting and soldering its plurality of lead terminals into through holes drilled at appropriate positions on the printed circuit board 20. It is set up. The resistor 30b has both lead terminals connected to
They are inserted and soldered into both through-holes drilled at appropriate locations on the printed circuit board 20, and erected on the surface of the printed circuit board 20. Also, power transistor 3
0c is installed by tightening screws 41 on the inner wall of a heat dissipation fin 40 erected on the central part of one side of the surface of the printed circuit board 20, and each lead terminal of this power transistor 30c is connected to the printed circuit board 20. It is inserted into each through hole drilled at the appropriate position of 20 and soldered.
放熱フイン４０は、その外面に、金属筐体１０
の一側壁内面中央にネジ４２ａ，４２ａの締着に
より組み付けられて、パワトランジスタ３０ｃの
熱エネルギーを金属筐体１０の一側壁内面中央に
放出する。また、放熱フイン４０の外壁下部に
は、横方向に切欠４２が断面逆Ｌ字状に形成され
ており、この切欠４２の上壁のプリント基板２０
の表面からの高さは、約３mmであつて、半導体チ
ツプ３０ａ、抵抗３０ｂ及びパワトランジスタ３
０ｃの各リード端子の上端の高さにほぼ等しい。 The heat dissipation fin 40 has a metal housing 10 on its outer surface.
It is assembled to the center of the inner surface of one side wall by tightening screws 42a, 42a, and releases the thermal energy of the power transistor 30c to the center of the inner surface of one side wall of the metal casing 10. Further, a notch 42 is formed in the lower part of the outer wall of the heat dissipation fin 40 in the horizontal direction, and the cross section is inverted L-shaped.
The height from the surface of the semiconductor chip 30a, the resistor 30b, and the power transistor 3 is approximately 3 mm.
The height is approximately equal to the height of the upper end of each lead terminal of 0c.
コネクタ５０は、第１図及び第２図に示すごと
く、金属筐体１０の前壁中央に形成した開口部１
３内に位置してプリント基板２０の表面前端中央
部に立設して組み付けられている。このコネクタ
５０は、直方体形状のコネクタ本体５１と、この
コネクタ本体５１の下面後部から下方へ一体的に
延出する脚５２とを有しており、脚５２はその各
取付端部５２ａ，５２ａにて各ネジ５２ｂ，５２
ｂの締着によりプリント基板２０の表面前端中央
部に組み付けられている。 As shown in FIGS. 1 and 2, the connector 50 has an opening 1 formed in the center of the front wall of the metal housing 10.
3 and is assembled in an upright position at the center of the front end of the printed circuit board 20. This connector 50 has a rectangular parallelepiped-shaped connector body 51, and legs 52 that integrally extend downward from the rear portion of the lower surface of the connector body 51, and the legs 52 have respective mounting ends 52a, 52a. each screw 52b, 52
It is assembled at the center of the front end of the printed circuit board 20 by fastening b.
コネクタ本体５１は複数のコネクタピン５１ａ
〜５１ａを有しており、これら各コネクタピン５
１ａ〜５１ａは前後方向に互いに平行かつプリン
ト基板２０の表面に平行にその各中間部位にてコ
ネクタ本体５１にそれぞれ挿通されている。各コ
ネクタピン５１ａ〜５１ａの外端部は、コネクタ
本体５１の外端部側に形成した嵌合穴５１ｂ内に
延出し、外部回路から延出するコネクタの嵌合部
を嵌合穴５１ｂ内に嵌合させたとき前記外部回路
に接続されるようになつている。一方、各コネク
タピン５１ａ〜５１ａの内端部はコネクタ本体５
１の後面からＬ字状にそれぞれ垂下し、プリント
基板２０の前端部に穿設した各貫通孔内にそれぞ
れ挿入半田付けされている。かかる場合は、コネ
クタ本体５１の嵌合穴５１ｂの底壁は、放熱フイ
ン４０の切欠４２の上壁と同様に、プリント基板
２０の表面から約３mmの高さに位置している。 The connector body 51 has a plurality of connector pins 51a.
~51a, and each of these connector pins 5
1a to 51a are inserted into the connector main body 51 at respective intermediate portions parallel to each other in the front-back direction and parallel to the surface of the printed circuit board 20. The outer end of each connector pin 51a to 51a extends into a fitting hole 51b formed on the outer end side of the connector main body 51, and the fitting portion of the connector extending from the external circuit is inserted into the fitting hole 51b. When fitted, they are connected to the external circuit. On the other hand, the inner end of each connector pin 51a to 51a is connected to the connector body 5.
1, respectively, and are inserted and soldered into through-holes formed in the front end of the printed circuit board 20. In this case, the bottom wall of the fitting hole 51b of the connector body 51 is located at a height of about 3 mm from the surface of the printed circuit board 20, similar to the upper wall of the notch 42 of the heat dissipation fin 40.
このように構成した本実施例において、プリン
ト基板２０の表裏面双方全体に防湿剤等の絶縁被
膜塗料を塗布するにあたつては、まず、上述のよ
うに半導体チツプ３０ａ、抵抗３０ｂ、パワトラ
ンジスタ３０ｃ、放熱フイン４０及びコネクタ５
１を組み付けてなるプリント基板２０を第２図に
示すごとく準備する。しかして、このように準備
したプリント基板２０を、コネクタ５０のコネク
タ本体５１及び放熱フイン４０を把持しながら、
絶縁被膜塗料６０（第３図に示すごとく容器７０
内に収容されている）の液面６１の直上に同液面
６１に平行に支持し、然る後、プリント基板２０
をそのまま垂下させて絶縁被膜塗６０内に浸漬す
る。 In this embodiment configured as described above, when applying an insulating coating paint such as a moisture proofing agent to both the front and back surfaces of the printed circuit board 20, first, as described above, the semiconductor chip 30a, the resistor 30b, and the power transistor are coated. 30c, heat dissipation fin 40 and connector 5
2. A printed circuit board 20 assembled with 1 is prepared as shown in FIG. While holding the thus prepared printed circuit board 20 by the connector body 51 and the heat radiation fins 40 of the connector 50,
Insulating coating paint 60 (container 70 as shown in Figure 3)
The printed circuit board 20 is supported directly above and parallel to the liquid surface 61 of the
is allowed to hang down as it is and immersed in the insulating coating 60.
かかる場合、上述たように、放熱フイン４０及
びコネクタ５０においては、切欠４２の上壁及び
コネクタ本体５１の嵌合穴５１ｂの底壁がプリン
ト基板２０の表面の上方約３mmの位置にあるた
め、第３図に示すごとく、コネクタ本体５１の嵌
合穴５１ｂ全体及び放熱フイン４０の切欠４２の
上方に位置する部分を絶縁被膜塗料６０内に浸漬
させることなくその液面６１の直上に支持した状
態にて、プリント基板２０全体を半導体チツプ３
０、抵抗３０ｂ、パワトランジスタ３０ｃの下部
及びコネクタ５０の脚５２と共に絶縁被膜塗料６
０内に完全に浸漬させることができる。これによ
り、プリント基板２０の表裏面全体が、上述のよ
うなプリント基板２０の絶縁被膜塗料６０内への
一度の浸漬作業のみでもつて、コネクタ５０及び
放熱フイン４０の塗布禁止部分を塗布してしまう
ことなく、絶縁被膜塗料６０によつて容易にしか
も完全に塗布され得る。 In such a case, as described above, in the heat dissipation fin 40 and the connector 50, the upper wall of the notch 42 and the bottom wall of the fitting hole 51b of the connector body 51 are located at a position approximately 3 mm above the surface of the printed circuit board 20. As shown in FIG. 3, the entire fitting hole 51b of the connector main body 51 and the portion located above the notch 42 of the heat radiation fin 40 are supported directly above the liquid level 61 of the insulating coating paint 60 without being immersed in it. , the entire printed circuit board 20 is attached to the semiconductor chip 3.
0, the resistor 30b, the lower part of the power transistor 30c, and the legs 52 of the connector 50 as well as the insulating coating paint 6
can be completely immersed in 0. As a result, the entire front and back surfaces of the printed circuit board 20 are coated with the prohibited portions of the connector 50 and the heat dissipation fin 40 even when the printed circuit board 20 is dipped into the insulation coating paint 60 only once as described above. The insulating coating paint 60 can be easily and completely coated without any problems.
このような塗布完了後、プリント基板２０を絶
縁被膜塗料６０から取り出して乾燥させる。然る
後、第１図を示すごとくプリント基板２０を金属
筐体１０内に組み付けるとともに放熱フイン４０
をその外面にて金属筐体１０の一側壁内面中央に
ネジ４２ａ，４２ａの締着により密着させる。か
かる場合、放熱フイン４０の外面（切欠４２を除
く）には上述のごとく絶縁被膜塗料６０が塗布さ
れていないので、上述のような放熱フイン４０の
金属筐体１０の一側壁に対する密着作業が余分な
作業を伴うことなく直接なされ得るとともに、パ
ワトランジスタ３０ｃの放熱フイン４０を介する
金属筐体１０の一側壁への放熱効果が放熱フイン
４０のコンパクトな形状のもとに良好に確保され
得る。また、上述のごとく、コネクタ本体５１の
嵌合穴５１ｂ全体が絶縁被膜塗料６０により塗布
されていないので、コネクタ本体５１の嵌合穴５
１ｂに対する外部回路からのコネクタの嵌合が余
分な作業を伴うことなく直接なされ得る。 After such coating is completed, the printed circuit board 20 is taken out from the insulating coating paint 60 and dried. Thereafter, as shown in FIG.
Its outer surface is brought into close contact with the center of the inner surface of one side wall of the metal housing 10 by tightening screws 42a, 42a. In such a case, since the insulation coating paint 60 is not applied to the outer surface of the heat dissipation fin 40 (excluding the notch 42) as described above, the work of adhering the heat dissipation fin 40 to one side wall of the metal casing 10 as described above is redundant. This can be done directly without any additional work, and the heat dissipation effect to one side wall of the metal casing 10 via the heat dissipation fins 40 of the power transistor 30c can be satisfactorily ensured due to the compact shape of the heat dissipation fins 40. Further, as described above, since the entire fitting hole 51b of the connector body 51 is not coated with the insulating coating paint 60, the fitting hole 51b of the connector body 51 is not coated with the insulation coating paint 60.
Fitting of a connector from an external circuit to 1b can be done directly without extra work.
なお、前記実施例においては、脚５２を有する
コネクタ５０を採用した例について説明したが、
これに代えて、第４図に示すごとく、市販のコネ
クタ８０にスペーサ８０ａ（コネクタ５０の脚５
２と同様の高さを有する）を介してプリント基板
２０の表面に組み付けるようにしてもよく、ある
いは、同コネクタ８０をワツシヤその他の適宜な
部材（スペーサ８０ａと同様の高さを有する）を
介してプリント基板２０の表面に組み付けるよう
にしてもよい。 Note that in the above embodiment, an example was described in which the connector 50 having the legs 52 was adopted.
Instead, as shown in FIG. 4, spacers 80a (legs 50 of connector 50
Alternatively, the connector 80 may be assembled to the surface of the printed circuit board 20 via a washer or other appropriate member (having a height similar to that of the spacer 80a). Alternatively, it may be assembled onto the surface of the printed circuit board 20.
また、前記実施例においては、コネクタ５０の
嵌合穴５１ｂの底壁及び放熱フイン４０の切欠４
２の上壁の各高さをプリント基板２０の表面から
約３mmとしたが、これに限ることなく、コネクタ
ピン５０及び放熱フイン４０の各塗布禁止部分が
プリント基板２０の絶縁被膜塗料６０内への浸漬
時に付随して浸漬されない程度に嵌合部５１ｂの
底壁及び切欠４２の上壁の各高さを適宜変更して
もよい。 Further, in the embodiment, the bottom wall of the fitting hole 51b of the connector 50 and the notch 4 of the heat dissipation fin 40 are
Although the height of each upper wall of 2 is approximately 3 mm from the surface of the printed circuit board 20, the present invention is not limited to this, and the prohibited portions of the connector pins 50 and the heat dissipation fins 40 may enter the insulating coating paint 60 of the printed circuit board 20. The heights of the bottom wall of the fitting portion 51b and the top wall of the notch 42 may be changed as appropriate to the extent that they will not be immersed in the water during immersion.
また、本発明の実施例にあたつては、コネクタ
５０のコネクタ本体５１がプリント基板２０の表
面に対して前後方向に傾斜していても、これに対
応して、コネクタ本体５１の塗布禁止部分のプリ
ント基板２０の表面からの高さを選定すれば、前
記実施例と同様の効果を達成し得る。 Furthermore, in the embodiment of the present invention, even if the connector main body 51 of the connector 50 is inclined in the front-rear direction with respect to the surface of the printed circuit board 20, the coating-prohibited portion of the connector main body 51 is adjusted accordingly. By selecting the height from the surface of the printed circuit board 20, the same effect as in the previous embodiment can be achieved.
第１図は本発明に係る電子機器の一実施例を示
す斜視図、第２図は第１図におけるプリント基板
への各種素子の組付斜視図、第３図はプリント基
板の絶縁被膜塗料内への浸漬作業説明図、及び第
４図は前記実施例の部分的変形例を示す要部拡大
斜視図である。
２０……プリント基板、３０ａ……半導体チツ
プ、３０ｂ……抵抗、３０ｃ……パワトランジス
タ、５０，８０……コネクタ、５１……コネクタ
本体、５１ａ……コネクタピン、５１ｂ……嵌合
穴、５２……脚、８０ａ……スペーサ。
FIG. 1 is a perspective view showing an embodiment of an electronic device according to the present invention, FIG. 2 is a perspective view of the assembly of various elements to the printed circuit board in FIG. 1, and FIG. FIG. 4 is an enlarged perspective view of a main part showing a partial modification of the above embodiment. 20... Printed circuit board, 30a... Semiconductor chip, 30b... Resistor, 30c... Power transistor, 50, 80... Connector, 51... Connector body, 51a... Connector pin, 51b... Fitting hole, 52 ...Leg, 80a...Spacer.
Claims (1)
有する電気的素子の配設されたプリント基板と、
このプリント基板の表面に接続されたコネクタピ
ンを嵌挿するとともに、このコネクタピンを外部
回路に接続する嵌合穴を有し、前記プリント基板
の表面に組み付けられたコネクタ本体とを備えた
電子機器において、前記コネクタ本体と前記プリ
ント基板との間に、前記プリント基板をほぼ水平
状に前記コーテイング材料内に浸漬させた際にコ
ーテイング材料が前記コネクタ本体の嵌合穴に流
入するのを防止するのに必要な所定高さを有する
脚部材を形成し、前記所定高さは少なくとも、前
記プリント基板の表面より突出した部分の前記リ
ード端子の長さに相当する高さを有することを特
徴とする電子機器。 ２ 前記脚部材がスペーサであることを特徴とす
る請求項１に記載の電子機器。[Claims] 1. A printed circuit board on which an electrical element having lead terminals to which a coating material is to be applied is arranged;
An electronic device having a connector body assembled on the surface of the printed circuit board, having a fitting hole for fitting a connector pin connected to the surface of the printed circuit board and connecting the connector pin to an external circuit. In this method, a device is provided between the connector body and the printed circuit board to prevent the coating material from flowing into the fitting hole of the connector body when the printed circuit board is immersed in the coating material in a substantially horizontal manner. The electronic device is characterized in that a leg member is formed with a predetermined height necessary for device. 2. The electronic device according to claim 1, wherein the leg member is a spacer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5569986A JPS62213197A (en) | 1986-03-13 | 1986-03-13 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5569986A JPS62213197A (en) | 1986-03-13 | 1986-03-13 | Electronic equipment |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5076862A Division JP2814046B2 (en) | 1993-04-02 | 1993-04-02 | Electronics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62213197A JPS62213197A (en) | 1987-09-19 |
| JPH0431200B2 true JPH0431200B2 (en) | 1992-05-25 |
Family
ID=13006141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5569986A Granted JPS62213197A (en) | 1986-03-13 | 1986-03-13 | Electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62213197A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4095307B2 (en) | 2002-02-06 | 2008-06-04 | 株式会社ケーヒン | Electronic circuit unit and manufacturing method thereof |
| JP6313657B2 (en) * | 2014-05-26 | 2018-04-18 | 日立アプライアンス株式会社 | Moisture-proof circuit board and washing machine equipped with the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5720494A (en) * | 1980-07-14 | 1982-02-02 | Tokyo Shibaura Electric Co | Method of coating circuit board |
| JPS60158693A (en) * | 1984-01-27 | 1985-08-20 | 三洋電機株式会社 | Printed board |
-
1986
- 1986-03-13 JP JP5569986A patent/JPS62213197A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5720494A (en) * | 1980-07-14 | 1982-02-02 | Tokyo Shibaura Electric Co | Method of coating circuit board |
| JPS60158693A (en) * | 1984-01-27 | 1985-08-20 | 三洋電機株式会社 | Printed board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62213197A (en) | 1987-09-19 |
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