JPS6220669B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in connectors in which the legs of contacts are soldered to a substrate.

Conventionally, this type of connector has a sealed structure in which the contact leg and the insulator mounting part to which the leg is fixed are sealed, and an open structure in which the insulator mounting part to which the contact leg is fixed is open. There is.

With a hermetically sealed structure, for example, when the contact leg is immersed in a molten solder tank and soldered, it is thought that the flux applied to the contact leg will not rise inside the insulator, but in reality, the flux applied to the contact leg does not rise inside the insulator. Flux rises into the insulator due to capillary action between the contact insertion hole and the contact insertion hole. This flux causes poor contact at the contact portion of the contact, and countermeasures against flux are required. As a countermeasure to this problem, it would be possible to clean the flux inside the insulator with, for example, an organic solvent, but this is difficult because the insulator has a closed structure. For this reason, conventionally, in the case of a contact having a sealed structure, a wafer for preventing flux is fitted at the base of the contact leg, but even this is not sufficient as a countermeasure against flux.

Further, in the case of the above-mentioned open structure, cleaning work of flux is easy, but there is a drawback that not only a large amount of solder and flux rises inside the insulator, but also that the contacts tend to fall out downward.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a connector that can eliminate the drawbacks of both closed and open connectors.

The present invention will be explained below with reference to the drawings. FIG. 1 shows an IC that is the first embodiment of this invention.
This shows a socket and is composed of a housing 10 and contacts 20. housing 10
A rectangular through hole 12 is formed in the center of the rectangular parallelepiped insulator 11 in the thickness direction, and a plurality of contact insertion holes are formed in both side walls 13 of the through hole 12 in the thickness direction. 14 are drilled.
Further, in the partition wall 15 between the through hole 11 and the contact insertion hole 14 of the housing 10, a plurality of internal cleaning openings 16 are formed at positions corresponding to the contact insertion holes 14, respectively. A contact 20 as described below is inserted and fixed into each contact insertion hole 14 of the housing 10 having such a structure.

As shown in FIG. 2, the contact 20 is bent at the middle part of the strip conductor in the longitudinal direction to form a U-shaped part 2.
1, and furthermore, one end side of this U-shaped part 21 is formed into a U
Bend inside the shaped part 21 to form the arc part 22 and the L-shaped part 2.
3 are sequentially formed, and a substantially U-shaped cut is made between the bottom surface of the U-shaped portion 21, that is, the connecting portion connecting the opposing pieces, and the surface portion where the circular arc portion 22 is formed. The enclosed portion is raised in the opposite direction to the other end side of the U-shaped portion 21 to form a leg portion (terminal portion).
24 is formed. One piece of the U-shaped portion 21 and the bent portion of the L-shaped portion 23 contact each other with a predetermined spring pressure, and the first and second contact portions 2
5 and 26 are formed. This first and second
The structure is such that a lead of an IC (integrated circuit), not shown, can be inserted between the contact parts 25 and 26.

The contacts 20 having such a configuration are respectively inserted into the contact insertion holes 17 (only shown in FIG. 2) of the housing 10. In this case, the legs of the contacts 20 are inserted into the internal cleaning openings 16 of the housing 10. The contact 20 is inserted and fixed into the housing 10 so that the cleaning opening 27 formed by raising the portion 24 corresponds to the cleaning opening 27.

In the IC socket configured in this manner, the leg portion 24 is inserted into a through hole provided in a printed wiring board (not shown), and flux is applied to the base portion of the leg protruding from the through hole, and the leg portion 24 is inserted into a through hole in a printed wiring board (not shown). The legs 24 of the contacts 20 of the IC socket are immersed, for example, in a bath of molten solder.
is soldered to the printed wiring board. In this case, the flux rises to the inner bottom of the U-shaped portion 21 of the contact 20 due to capillary action occurring between the leg 24 of the contact 20 and the through hole.
This increased flux can be easily washed away with organic solvents. That is, since the internal cleaning opening 16 is formed in the housing in correspondence with the cleaning opening 27 of the contact 20, flux can be easily cleaned from both openings 27,16. On the other hand, since the legs 24 of the contacts 20 are inserted into and supported by the leg insertion holes 17 of the housing 10, the drawbacks of both the conventional sealed structure connector and the open structure connector can be eliminated.

FIG. 3 shows an IC socket according to a second embodiment of the present invention, and the difference from the first embodiment described above is that the leg portion 24 side of the contact 20 is attached as shown in FIG. This is because an internal cleaning opening 16 is formed at the bottom of the housing 10 corresponding to the cleaning opening 27 formed therein. Other points are the same as those of the previous embodiment, and therefore the same effects as those of the previous embodiment can be obtained.

FIG. 5 shows a card edge type connector which is a third embodiment of the present invention.
A plurality of internal cleaning openings 31 corresponding to the contacts 40 are formed in the side wall of the housing 30, and as shown in FIG. 41 and the connection part of the spring contact part 42) 4
A cleaning opening 44 in the form of a long hole is formed in each of the holes 3 and 3. Therefore, in this case as well, the flux that rises inside the housing 30 during soldering can be easily cleaned, and the leg portions 41 of the contacts 40 can be easily cleaned.
is firmly supported by the leg insertion hole 32 on the bottom surface of the housing 30.

According to the invention described above, it is possible to provide a connector in which flux rising to the contacts inside the housing can be easily cleaned and the contacts can be strongly supported.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an IC socket according to a first embodiment of the present invention, FIG. 2 is an exploded perspective view showing a part of the main parts of FIG. 1 on an enlarged scale, and FIG. 2 is a perspective view of an IC socket according to the second embodiment, FIG. 4 is an exploded perspective view showing a part of the main part of FIG. FIG. 6 is an exploded perspective view showing a part of the main part of FIG. 5 on an enlarged scale. 10, 30... Housing, 20, 40... Contact, 16, 31... Internal cleaning opening, 2
7, 44... Cleaning opening, 17, 32... Leg insertion holes for contacts 10, 30.

Claims (1)

[Claims] 1. A connector in which a contact is inserted into a contact insertion hole provided in an insulator, an end thereof protrudes to the outside, and the externally protruding end of the contact is penetrated into a board and soldered. The connector has a cleaning opening formed closer to the externally protruding end side, and an internal cleaning opening formed at a position corresponding to the cleaning opening of the contact of the insulator.