JPS5845824B2 - 導電パタ−ン−障壁構造体 - Google Patents

導電パタ−ン−障壁構造体

Info

Publication number
JPS5845824B2
JPS5845824B2 JP50132215A JP13221575A JPS5845824B2 JP S5845824 B2 JPS5845824 B2 JP S5845824B2 JP 50132215 A JP50132215 A JP 50132215A JP 13221575 A JP13221575 A JP 13221575A JP S5845824 B2 JPS5845824 B2 JP S5845824B2
Authority
JP
Japan
Prior art keywords
solder
gold
silver
barrier
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP50132215A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5177862A (OSRAM
Inventor
エフ ミラー ルイス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS5177862A publication Critical patent/JPS5177862A/ja
Publication of JPS5845824B2 publication Critical patent/JPS5845824B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
    • H05K3/248—Finish coating of conductors by using conductive pastes, inks or powders fired compositions for inorganic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H10W20/43—
    • H10W90/701—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/017—Glass ceramic coating, e.g. formed on inorganic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2081—Compound repelling a metal, e.g. solder
    • H10W72/07236—
    • H10W72/07251—
    • H10W72/20—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Glass Compositions (AREA)
JP50132215A 1974-12-23 1975-11-05 導電パタ−ン−障壁構造体 Expired JPS5845824B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/535,261 US4017889A (en) 1974-12-23 1974-12-23 Ternary barrier structure for conductive electrodes

Publications (2)

Publication Number Publication Date
JPS5177862A JPS5177862A (OSRAM) 1976-07-06
JPS5845824B2 true JPS5845824B2 (ja) 1983-10-12

Family

ID=24133484

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50132215A Expired JPS5845824B2 (ja) 1974-12-23 1975-11-05 導電パタ−ン−障壁構造体

Country Status (5)

Country Link
US (1) US4017889A (OSRAM)
JP (1) JPS5845824B2 (OSRAM)
DE (1) DE2550275C2 (OSRAM)
FR (1) FR2296348A1 (OSRAM)
GB (1) GB1484435A (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62141820U (OSRAM) * 1986-02-28 1987-09-07
JPS62151326U (OSRAM) * 1986-03-17 1987-09-25

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54159964U (OSRAM) * 1978-04-28 1979-11-08
US4611746A (en) * 1984-06-28 1986-09-16 International Business Machines Corporation Process for forming improved solder connections for semiconductor devices with enhanced fatigue life
US5532612A (en) * 1994-07-19 1996-07-02 Liang; Louis H. Methods and apparatus for test and burn-in of integrated circuit devices
FR2734983B1 (fr) * 1995-05-29 1997-07-04 Sgs Thomson Microelectronics Utilisation d'un micromodule comme boitier de montage en surface et procede correspondant
US5926731A (en) * 1997-07-02 1999-07-20 Delco Electronics Corp. Method for controlling solder bump shape and stand-off height
US6531663B1 (en) * 1998-01-30 2003-03-11 Delphi Technologies, Inc. Solder stop for an electrical connection and method therefor
JP3756691B2 (ja) * 1999-03-18 2006-03-15 株式会社日立製作所 内燃機関用の樹脂封止形電子装置
US7592202B2 (en) * 2006-03-31 2009-09-22 Intel Corporation Embedding device in substrate cavity
FR2914490B1 (fr) * 2007-03-26 2009-05-29 Commissariat Energie Atomique Procede de soudure de deux elements entre eux au moyen d'un materiau de brasure.

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3361592A (en) * 1964-03-16 1968-01-02 Hughes Aircraft Co Semiconductor device manufacture
US3374110A (en) * 1964-05-27 1968-03-19 Ibm Conductive element, composition and method
GB1143815A (OSRAM) * 1965-06-18 1900-01-01
US3429040A (en) * 1965-06-18 1969-02-25 Ibm Method of joining a component to a substrate
US3495133A (en) * 1965-06-18 1970-02-10 Ibm Circuit structure including semiconductive chip devices joined to a substrate by solder contacts
US3809625A (en) * 1972-08-15 1974-05-07 Gen Motors Corp Method of making contact bumps on flip-chips

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62141820U (OSRAM) * 1986-02-28 1987-09-07
JPS62151326U (OSRAM) * 1986-03-17 1987-09-25

Also Published As

Publication number Publication date
US4017889A (en) 1977-04-12
DE2550275C2 (de) 1983-06-01
GB1484435A (en) 1977-09-01
DE2550275A1 (de) 1976-07-01
JPS5177862A (OSRAM) 1976-07-06
FR2296348B1 (OSRAM) 1978-05-12
FR2296348A1 (fr) 1976-07-23

Similar Documents

Publication Publication Date Title
KR0124924B1 (ko) 회로기판의 패드로의 납땜층 형성방법 및 회로기판으로의 전자부품 실장방법
JP2746840B2 (ja) 集積回路パッケージとリードフレーム
KR0129118B1 (ko) 부식이 감소된 리드 프레임 및 이의 제조 방법
US6444562B1 (en) Nickel alloy films for reduced intermetallic formation in solder
JPH0528000B2 (OSRAM)
US6664175B2 (en) Method of forming ruthenium interconnect for an integrated circuit
US4081901A (en) Method of making a ternary barrier structure for conductive electrodes
KR900008274B1 (ko) 저항회로 형성방법
JPS5845824B2 (ja) 導電パタ−ン−障壁構造体
JPS59155950A (ja) 半導体装置用セラミックパッケージ
TWI419294B (zh) 用於半導體裝置之引線框
US4084314A (en) Producing thick film circuits having terminal elements
JP3369665B2 (ja) 半導体パッケージ用のセラミック製リッド基板およびセラミック製リッド
US3669734A (en) Method of making electrical connections to a glass-encapsulated semiconductor device
JPH08306816A (ja) 電極パッド
US5962151A (en) Method for controlling solderability of a conductor and conductor formed thereby
US6391678B1 (en) Method for controlling solderability of a conductor and conductor formed thereby
JPH04307944A (ja) 半導体素子の接続材料および半導体装置
US20060266446A1 (en) Whisker-free electronic structures
Hall et al. Recent advances in solder bond technology for microelectronic packaging
JPS6227733B2 (OSRAM)
JPS58107656A (ja) 金の層を有する電子部品
JP2614147B2 (ja) 有機金属導体組成物
JPS58161351A (ja) ガラス封止半導体装置
JPS58130590A (ja) セラミツク配線基板および該セラミツク配線基板を用いた厚膜ハイブリツドｉｃ