JPS5843763B2 - クリカエシウンドウキコウト サ−ボキコウニヨル フクゴウウンドウキコウ - Google Patents

クリカエシウンドウキコウト サ−ボキコウニヨル フクゴウウンドウキコウ

Info

Publication number
JPS5843763B2
JPS5843763B2 JP49086996A JP8699674A JPS5843763B2 JP S5843763 B2 JPS5843763 B2 JP S5843763B2 JP 49086996 A JP49086996 A JP 49086996A JP 8699674 A JP8699674 A JP 8699674A JP S5843763 B2 JPS5843763 B2 JP S5843763B2
Authority
JP
Japan
Prior art keywords
movement mechanism
movement
cam
servo
undoukikou
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP49086996A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5115791A (mo
Inventor
雄三郎 坂本
純男 山口
脩 森田
将弘 堀井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP49086996A priority Critical patent/JPS5843763B2/ja
Publication of JPS5115791A publication Critical patent/JPS5115791A/ja
Publication of JPS5843763B2 publication Critical patent/JPS5843763B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Control Of Position Or Direction (AREA)
JP49086996A 1974-07-31 1974-07-31 クリカエシウンドウキコウト サ−ボキコウニヨル フクゴウウンドウキコウ Expired JPS5843763B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49086996A JPS5843763B2 (ja) 1974-07-31 1974-07-31 クリカエシウンドウキコウト サ−ボキコウニヨル フクゴウウンドウキコウ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49086996A JPS5843763B2 (ja) 1974-07-31 1974-07-31 クリカエシウンドウキコウト サ−ボキコウニヨル フクゴウウンドウキコウ

Publications (2)

Publication Number Publication Date
JPS5115791A JPS5115791A (mo) 1976-02-07
JPS5843763B2 true JPS5843763B2 (ja) 1983-09-29

Family

ID=13902474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49086996A Expired JPS5843763B2 (ja) 1974-07-31 1974-07-31 クリカエシウンドウキコウト サ−ボキコウニヨル フクゴウウンドウキコウ

Country Status (1)

Country Link
JP (1) JPS5843763B2 (mo)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04107922U (ja) * 1991-02-28 1992-09-17 日本特殊陶業株式会社 梯子型電気濾波器
JPH04110025U (ja) * 1991-03-12 1992-09-24 日本特殊陶業株式会社 梯子型電気濾波器ケース
JPH0528122U (ja) * 1991-09-18 1993-04-09 日本特殊陶業株式会社 圧電フイルタ

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6092560U (ja) * 1983-11-30 1985-06-24 株式会社ダイキンゴルフ ウツドクラブのヘツド

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04107922U (ja) * 1991-02-28 1992-09-17 日本特殊陶業株式会社 梯子型電気濾波器
JPH04110025U (ja) * 1991-03-12 1992-09-24 日本特殊陶業株式会社 梯子型電気濾波器ケース
JPH0528122U (ja) * 1991-09-18 1993-04-09 日本特殊陶業株式会社 圧電フイルタ

Also Published As

Publication number Publication date
JPS5115791A (mo) 1976-02-07

Similar Documents

Publication Publication Date Title
US4784071A (en) Automatic sewing machine with scanning camera system
GB1405651A (en) Manipulator arrangement
CN113035719B (zh) 一种芯片贴装方法及装置
KR100452782B1 (ko) 부품 인식 방법 및 장치와, 부품 실장 방법 및 장치
JPS5843763B2 (ja) クリカエシウンドウキコウト サ−ボキコウニヨル フクゴウウンドウキコウ
JP3022613B2 (ja) ワイヤボンディング装置
US3941985A (en) Apparatus for carrying out bonding at programmed positions of a circuit element and at corrected positions of leads therefor
US4610387A (en) Device for bonding wire leads in electronic components
US4754392A (en) Uniform velocity control method
JP4653550B2 (ja) 半導体装置の製造装置および製造方法
JP2625786B2 (ja) 電子部品マウント装置
JPH08197480A (ja) 産業用ロボットの手首機構
CN113619270B (zh) 一种车辆识别码的自动拓印装置
JP2547999B2 (ja) プログラムデ−タの教示装置
JPS56103429A (en) Die bonder
US3664567A (en) Arm assembly for bonding apparatus
JP2530948Y2 (ja) 樹脂封止用半導体製造装置
JP3029239B2 (ja) チップ及び基板の画像認識装置
JPS6031028Y2 (ja) スポツト溶接ガンの姿勢制御装置
JPS58180036A (ja) 半導体ワイヤ−ボンディング装置
JPS62236692A (ja) 工業用ロボツトのハンド
JP3234372B2 (ja) 電子部品自動装着装置及び電子部品の装着方法
JPH05143150A (ja) 作業ロボツトのツール先端位置ずれ補正装置
JPH0343170A (ja) ロボット
JPS641024Y2 (mo)