JPS5840870A - 受光装置の製造方法 - Google Patents

受光装置の製造方法

Info

Publication number
JPS5840870A
JPS5840870A JP56139373A JP13937381A JPS5840870A JP S5840870 A JPS5840870 A JP S5840870A JP 56139373 A JP56139373 A JP 56139373A JP 13937381 A JP13937381 A JP 13937381A JP S5840870 A JPS5840870 A JP S5840870A
Authority
JP
Japan
Prior art keywords
electrode
electrodes
frame
light receiver
amorphous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56139373A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6355789B2 (enrdf_load_stackoverflow
Inventor
Yukinori Kuwano
桑野　幸徳
Shoichi Nakano
中野　昭一
Masaru Takeuchi
勝 武内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd, Sanyo Denki Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP56139373A priority Critical patent/JPS5840870A/ja
Publication of JPS5840870A publication Critical patent/JPS5840870A/ja
Publication of JPS6355789B2 publication Critical patent/JPS6355789B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Landscapes

  • Light Receiving Elements (AREA)
JP56139373A 1981-09-03 1981-09-03 受光装置の製造方法 Granted JPS5840870A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56139373A JPS5840870A (ja) 1981-09-03 1981-09-03 受光装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56139373A JPS5840870A (ja) 1981-09-03 1981-09-03 受光装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5840870A true JPS5840870A (ja) 1983-03-09
JPS6355789B2 JPS6355789B2 (enrdf_load_stackoverflow) 1988-11-04

Family

ID=15243806

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56139373A Granted JPS5840870A (ja) 1981-09-03 1981-09-03 受光装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5840870A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6024077A (ja) * 1983-07-19 1985-02-06 Seiko Epson Corp 半導体装置
FR2626408A1 (fr) * 1988-01-22 1989-07-28 Thomson Csf Capteur d'image a faible encombrement

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS551116A (en) * 1978-06-16 1980-01-07 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS551116A (en) * 1978-06-16 1980-01-07 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6024077A (ja) * 1983-07-19 1985-02-06 Seiko Epson Corp 半導体装置
FR2626408A1 (fr) * 1988-01-22 1989-07-28 Thomson Csf Capteur d'image a faible encombrement
US5051802A (en) * 1988-01-22 1991-09-24 Thomson-Csf Compact image sensor

Also Published As

Publication number Publication date
JPS6355789B2 (enrdf_load_stackoverflow) 1988-11-04

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