JPS5840335B2 - Separable multiple semiconductor devices - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor device, and an object of the present invention is to provide a semiconductor device having a plurality of units that can be adjusted to a desired number of units.

A conventional semiconductor device in which a plurality of semiconductor elements are encapsulated is as illustrated in FIG. 1 or 2.

These are made up of a plurality of semiconductor elements having the same function sealed together with a synthetic resin body 1 such as epoxy, and a plurality of terminal groups 3a led out from the semiconductor elements.
, 3b, and connects the terminal group to a desired portion of the wiring circuit.

For example, if a semiconductor device containing three diodes is desired, it is often necessary to use an existing five-strand diode with two diodes left unused.

Such an application is disadvantageous in terms of cost and has been a significant obstacle to increasing the degree of integration or obtaining a compact wiring circuit.

Furthermore, arranging three single semiconductor devices in the above case is disadvantageous in terms of space and cost.

The present application provides a structure of a semiconductor device that eliminates the drawbacks of the conventional semiconductor device described above.

That is, the present application is characterized in that a plurality of series of semiconductor elements having the same function are sealed, and the connecting portion of the sealed body is formed to be divisible.

A semiconductor device according to an embodiment of the present application will be described in detail below with reference to the drawings.

3 to 8 are drawings showing a part of the embodiment of the present application. - As an example, the semiconductor device shown in FIG. 3 corresponds to the conventional semiconductor device shown in FIG. 1, and the semiconductor device shown in FIG. The semiconductor devices correspond to the conventional semiconductor devices shown in FIG.

Alternatively, the arrangement may be as shown in FIG. 5 and FIG. 6, respectively.

Each of the semiconductor devices described above is formed by integrally sealing a plurality of semiconductor element groups having the same function with a synthetic resin body 11 such as epoxy.
, 1 lb, 11c... As shown in FIGS.
a, Notching Figure 12b etc. are provided.

In this manner, it is easy to divide the semiconductor device with the notches to form a semiconductor device suitable for a desired number of wiring circuits.

FIG. 8 is a drawing showing another embodiment, in which a is a plan view and b is a plan view.
C shows a front view and C shows a side view.

In this embodiment O, each series of sealing bodies 11a, llb, 1
1c99. A connection 12 is provided at a part of the lower part of the holder, and a notching 12b is formed in the connection 12.

According to the present application, a semiconductor device having a desired number of series can be formed very easily by dividing a plurality of series of semiconductor devices having the same function at a connecting part, thereby reducing the cost of the semiconductor device and increasing the integration of the circuit. It has the remarkable advantage of being able to be formed compactly with a high temperature.

In the above embodiments, a resin-sealed semiconductor device is exemplified, but the present invention is not limited to this, and can be widely applied even when metal is used for the sealing body.

It can also be applied to electronic circuits.

[Brief explanation of the drawing]

Figures 1 and 2 are perspective views of conventional semiconductor devices;
6 to 6 are perspective views illustrating a semiconductor device according to an embodiment of the present application, and FIG. 7 is a perspective view illustrating a notch applied to the present application. FIG. FIG. 8 is a drawing showing another embodiment of the present application, in which FIG. 8A shows a plan view, B shows a front view, and C shows a side view. The same reference numerals in the figures indicate the same or corresponding parts. 11000 synthetic resin body, 11a, 11b... sealing body,
12, , Connecting portion, 12a, 12b... Cut, 13a
. 13b...Terminal group.

Claims (1)

[Claims] 1 A device comprising a plurality of semiconductor elements having the same function, a sealing body that seals each of the semiconductor elements, and a connecting portion that connects each of the sealing bodies and is made of the same material as the sealing body. A divisible multi-unit semiconductor device, characterized in that, by providing a notch in the connecting portion, the semiconductor device can be finally divided into a required number of series of sealed bodies at the notch.