JPS5839093A - Method of producing printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a printed wiring board O in which electrolytic gold plating is applied to circuit conductor υ plugs, etc. in 1% of the manufacturing method for a printed wiring board. Absolutely, form a circuit conductor on a board, and electroplate gold, nickel, etc. on the circuit conductor's plug portion or the patterned circular terminal where the circuit element is surface bonded! There are 29 males.

When electroplating is performed, electroplating is formed and plating is performed after screen printing in addition to the 4 seconds, or resist ink V improves plating resistance, so the surface treatment condition of the base υ is a contributing factor. Of course, the thickness of the resist ink is also a very important factor.
〇Plating resistance tJ: To achieve this, it is better to make the resist ink as thick as possible.@However, if the resist ink is thicker (then the printability will change)◎As the resist ink thickness increases, the resist in high-density patterns Ink cut,
Kawaru <Each edition n.

The present invention was developed in consideration of these points. Nine circuit conductors υj, formed in n, are electrically attached to the predetermined locations (J1m).

In the printed wiring board 1/1 manufacturing method in which circuit conductors are electroplated with surface bonding circuit elements, electroplating is performed partially on the boundary area of the electroplating layer. Thickening II
-Characteristics 〇 Figures 1 and 2 are printed wiring boards obtained according to the present invention, where 1 is an insulating substrate, 2 is a circuit conductor, 5 is a plug, and 4 is an electric wiring board. Electroplating 5 is performed using a metal resist, so that the boundary portion 6 is thicker than the other portions.

As electric mesh resist ink, epoxy W resin type, melamine resin type t)%υ or nl is used, usually 10~
Electroplating of 15μm% is performed, and a thickness of approximately 25 to 35μm is formed at the boundary area where the electroplating resist ink is thickened. ◎Electroplating is done by gold plating on the ± of the nickel plating. , Ru.

Screen printing of electroplated resist ink is generally carried out by the method shown in FIG. In FIG. 5, 7 is a screen frame, 8 is a screen, 9 is a resist ink formed at a printing arrangement I&, and a position W where it is not formed.
screen mask (emulsion), 10fl squeegee-11
Step 1 prints the resist ink r on the printing substrate 12 by moving the squeegee. In conventional printing plates, the thickness of the screen mask is constant, and the thickness of the resist ink is only one inch.

In order to make the boundary part of the present invention qJ 5 electroplated, nl, 6, the electroplating resist is made to float higher than other parts.
This is achieved by thickening the resist ink 13 adjacent to a certain area as shown in Figure 4. To make the screen mask thicker, it is necessary to make it thicker. V Apply emulsion k (5 times) to a certain area, or paste paper tape 1, etc. i5 Ru〇Example 150 Messy a (Apply photosensitive liquid to IJ Tetron plate (emulsion thickness 10μ)) After drying, expose Then, develop and dry the printing plate.
” Width 2D IInIJI on the top plate and partially thickened part
Paste 11t of 11ffL+11+7J paper tape 〇 For stiff version klK, Evo medium-proof oil-based ink (manufactured by Taiyo Ink Co., Ltd.,
Song name S-222) II-Print for convenience - Print using the above method and 7tF9r21! It was a paper tape with a thickness of 15μ and ink [4μ on the border of the pasted box.

No ink peeling occurred due to plating on the 5th 40 μm border between paper tape and 27t.

As explained above, in the method of the present invention, the electrical resistance is improved without deteriorating the printability of the resist ink.
*Quick and easy to perform.

[Brief explanation of drawings]

Figure 1 is a plan view of the printed wiring board υ obtained by the present invention, and
The figure is an enlarged sectional view taken along the line A-A in Figure 1, and Figures 3.4 and 3.4 are views showing the silk screen printing method. 8 Screen 9 Screen mask 10 Squeegee-11 Resist ink 1
2 Printed substrate 13 Screen mask

Claims (1)

[Claims] 1. The circuit conductor υ formed on the e-edge board has electric plating resists at nine predetermined locations) kl! In the printed wiring board V manufacturing method, which involves electroplating circuit conductors that have not been coated with electroplating resist, electroplating is applied to the boundary area. A method for producing a printed wiring board with a thick layer and r% characteristic.