JPS639997A - Surface mounting printed wiring board - Google Patents
Surface mounting printed wiring boardInfo
- Publication number
- JPS639997A JPS639997A JP15443786A JP15443786A JPS639997A JP S639997 A JPS639997 A JP S639997A JP 15443786 A JP15443786 A JP 15443786A JP 15443786 A JP15443786 A JP 15443786A JP S639997 A JPS639997 A JP S639997A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- external connection
- connection terminal
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 24
- 239000004020 conductor Substances 0.000 claims description 13
- 238000005498 polishing Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 12
- 238000009713 electroplating Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分！ｆ）
本発明は表面χ装用プリント配線板、特に表面実装用パ
ッケージとの接続信頼性を向、ヒならしめた表面実装用
プリント配線板に関するものである。Detailed Description of the Invention (Industrial Application!f) The present invention relates to a surface-mounted printed wiring board, and particularly to a surface-mounted printed wiring board that improves and strengthens connection reliability with a surface-mounted package. It is something.
（従来の技術）
表面実装用パッケージをプリント配線板に接続する方法
として、半田フロー法、あるいは１表面実装用パッケー
ジに半Ｉｌｌペーストを印刷した後に加ｐ％溶融して接
続する半［Ｈリフロー法か多く採用されている。従来、
その際使用されるプリント配線板ては、第２図に示した
ように、外部接続端子部の導体厚みと、他の配線部の導
体厚みとは回−又はほぼ同一であり１表面実装用パッケ
ージとしては、第２図に示したチップキャリア以外にフ
ラットバ・ンケーシ、チップ部品等があった。(Prior art) As a method for connecting a surface mount package to a printed wiring board, there is a solder flow method, or a half [H reflow method] in which a half Ill paste is printed on one surface mount package and then melted by adding p%. It is widely adopted. Conventionally,
As shown in Figure 2, the printed wiring board used in this case has a conductor thickness in the external connection terminal section and a conductor thickness in other wiring sections that are approximately the same. In addition to the chip carrier shown in Fig. 2, there were flat bank cases, chip parts, etc.
（発１す１か解決しようとする問題点）前記従来型プリ
ント配線板においては、第８図（ａ）に示したように、
プリント配線板に全くそりかないが、あるいはそりの量
がわずかである場合には外部接続端子部を表面実装用パ
ッケージ側に接続するのに殆ど問題はないが、第８図（
ｂ）に示したように、接続時にプリント配線板にそりが
発生している場合には接続不能という問題か生じていた
。すなわち、第８図（ａ）に示したように表面実装用パ
ッケージの（５）底面が、プリント配線板に接触しない
範囲であれば、外部接続端子部（ｌａ）と表面実装用パ
ッケージ（５）との接続は完成し得るが、第８図（ｂ）
に示したようにそりの量かある限度を越すと、この場合
の外部接続端子（ｌｂ）は表面実装用パッケージ（５）
の底面とプリント配線板上面か接触するため接続ができ
ず、接続の信頼性が大きく低下することとなるのである
。(Problems to be solved) In the conventional printed wiring board, as shown in FIG. 8(a),
If there is no warpage at all on the printed wiring board, or if the amount of warpage is small, there will be little problem in connecting the external connection terminal section to the surface mount package, but as shown in Figure 8 (
As shown in b), if the printed wiring board is warped during connection, there is a problem that connection is impossible. That is, as shown in FIG. 8(a), as long as the bottom surface (5) of the surface mount package does not come into contact with the printed wiring board, the external connection terminal portion (la) and the surface mount package (5) The connection can be completed, but as shown in Fig. 8(b)
As shown in , if the amount of warpage exceeds a certain limit, the external connection terminal (lb) in this case will be connected to the surface mount package (5).
Since the bottom surface of the printed wiring board comes into contact with the top surface of the printed wiring board, connection cannot be established, and the reliability of the connection is greatly reduced.
また、半田リフロー法において接続する場合。Also, when connecting using the solder reflow method.
表面実装用パッケージに印刷する印刷半田ベーストの厚
みは、可能な限り一定に保つのか好ましいが、ある程度
のバラツキは生じるものである。そのバラツキが、第９
図に示した外部接続端子（１ａ）の場合の如く、ある範
囲内であるうちは接続は完成する。しかし、第９図に示
した外部接続端子（１ｃ）のように、バラツキかある程
度を越し、しかも第９図に示した半田ペースト（６ｂ）
のように厚みの薄い半［ｆＪペーストに対応させて接続
する場合には、当該外部接続端子（１ｃ）は表面実装用
パッケージに対して接続ができず、接続信頼性が大きく
低下することになるのである。Although it is preferable to keep the thickness of the printed solder base printed on the surface mount package as constant as possible, some variation will occur. That variation is the 9th
As in the case of the external connection terminal (1a) shown in the figure, the connection is completed within a certain range. However, as shown in the external connection terminal (1c) shown in Fig. 9, the variation exceeds a certain degree, and moreover, the solder paste (6b) shown in Fig. 9
When connecting to a thin semi-fJ paste like this, the external connection terminal (1c) cannot be connected to the surface mount package, resulting in a significant drop in connection reliability. It is.
さらに、半田フロー法においては、表面実装用パッケー
ジをプリント配線板に接続するにあたワフラックスを使
用するが１通常プリント配線板と表面実装用パッケージ
のすき間（７ａ）か数十ＡＬｍと狭いため、接続完成後
フラックス等の不純物除去が十分に行えず、接続信頼性
を大きく低下させるのである。Furthermore, in the solder flow method, wax flux is used to connect the surface mount package to the printed wiring board, but 1.The gap between the printed wiring board and the surface mount package is usually narrow (7a) or several tens of ALm. After the connection is completed, impurities such as flux cannot be removed sufficiently, which greatly reduces the connection reliability.
本発明は以上のような実状を踏まえてなされたもので、
その目的とするところは、高信頼性か得られる状態で、
外部接続端子を表面実装用パッケージに接続できる表面
実装用プリント配線板を提供することにある。The present invention was made based on the above-mentioned circumstances, and
The aim is to achieve high reliability,
An object of the present invention is to provide a surface mount printed wiring board capable of connecting external connection terminals to a surface mount package.
（問題点を解決するための１段） 上記の問題点を解決するために本発明か採った手段は。(1 step to solve the problem) What are the measures taken by the present invention to solve the above problems?
「表面実装用パッケージに接続される、導体回路の外部
接続端子部が、他の導体回路に較べ、不滑に突出したこ
とを特徴とする表面実装用プリント配線板」
である。``A surface mount printed wiring board characterized in that the external connection terminal portion of the conductor circuit connected to the surface mount package protrudes more smoothly than other conductor circuits.''
この本発明の構成を１図面及び実施例に基づいて更に具
体的かつ詳しく説明する。The configuration of the present invention will be explained more specifically and in detail based on one drawing and an example.
第１図は本発明に係る表面実装用プリント配線板の斜視
図であり、第３図は本発明を実施した表面実装用プリン
ト配線板の縦断面図である。これらの］Ａにおいて、符
号（４）はプリント配線板本体てあり、この本体（４）
は一般にガラスエポキシ複合材料からなる銅張り！Ｉｉ
層板であり、その他１紙フェノール、紙エポキシなどの
複合材料のほか。FIG. 1 is a perspective view of a printed wiring board for surface mounting according to the present invention, and FIG. 3 is a longitudinal sectional view of the printed wiring board for surface mounting according to the present invention. In these]A, the code (4) is the printed wiring board main body, and this main body (4)
Copper cladding is generally made of glass-epoxy composite material! Ii
It is a laminated board, and other composite materials such as paper phenol, paper epoxy, etc.
トリアジン変性樹脂、ポリイミド樹脂フィルムなどから
成るリジッド或いはフレキシブル基板などが使用される
。A rigid or flexible substrate made of triazine-modified resin, polyimide resin film, or the like is used.
このプリント配線板本体（４）に対して通常のサブトラ
クティブ法にて必要な配線パターンを形成する。そして
、メッキ法により表面実装用パッケージの外部接続端子
に対応するパターン上に、外部接続端子（ｌｄ）を他の
配線部（２）の導体厚みより突出させる。ここで、前記
外部接続端子（Ｉｄ）の形成方法としては、予め必要な
前記外部接続端子（Ｉｄ）の大きさに露出させたメッキ
マスクを形成し、各種の無電解メッキ及び″電解メッキ
を施すことによって形成することができる。ここて使用
するメッキマスクとしては、粘若剤のついたポリエステ
ルあるいは、ポリプロピレンのフィルムの外部接続端子
を設けようとする所定の位置に、予め金型等により外部
接続端子形成用共通孔を打ち抜いたもの、或いは１通常
プリント配線板の製造で使用される感光性レジストフィ
ルム、インキ等をる。またメッキ方法としては、外部接
続端子の厚みが厚い場合、電解メッキか好ましい、メッ
キ金属の種類としては、銅、ニッケルが好ましい。A necessary wiring pattern is formed on this printed wiring board main body (4) by a normal subtractive method. Then, the external connection terminal (ld) is made to protrude from the conductor thickness of the other wiring portion (2) on the pattern corresponding to the external connection terminal of the surface mount package by plating. Here, as a method for forming the external connection terminal (Id), a plating mask is formed in advance to expose the size of the external connection terminal (Id), and various types of electroless plating and electrolytic plating are applied. The plating mask used here is a polyester or polypropylene film with a thickening agent attached to the predetermined position where the external connection terminal is to be provided. A common hole for forming a terminal is punched out, or a photosensitive resist film, ink, etc., which is normally used in the manufacture of printed wiring boards.As for the plating method, if the external connection terminal is thick, electrolytic plating is used. Preferred types of plating metal include copper and nickel.
また電解メッキに３いては、予め必要な外部接続端子に
位置する部分にのみ貫通穴のあいたゴムなどの弾性被膜
で他の部分を覆ってメッキ液を被メツキ部に噴射させる
部分メッキ法は短時間のうちに必要なメッキ厚みが得ら
れ、厚みのバラツキも少ないので、外部接続端子の厚み
か特に厚い場。In addition, in electrolytic plating, the partial plating method, in which the other parts are covered with an elastic coating such as rubber that has through-holes only in the parts located at the required external connection terminals, and the plating solution is sprayed onto the parts to be plated, is short-lived. The required plating thickness can be obtained in a short amount of time, and there is little variation in the thickness, so it is suitable for cases where the external connection terminal is particularly thick.
合には、極めて有効な方法である。This is an extremely effective method in some cases.
なおメッキにより、外部接続端子を突出させる場合、電
解メッキにおいては被メッキ物の位置、給電部の位置、
メッキ液撹拌状態の変化などにより、外部接続端子の厚
みにバラツキか生しる。このバラツキのうち、プリント
配線板内の外部接続端子間のバラツキがあげられるが、
これか大きいままにしておくと、第４ Ｉ５＋１の外部
接続端子（ｌｅ）の如く厚みが足らなくなるから、この
外部接続端子（ｌｅ）を第３図に示したように、他の外
部接続端子（１ｄ）の上面を平滑にして外部接続端子（
ｌｅ）の表面と同一にするのである。In addition, when making external connection terminals protrude by plating, in electrolytic plating, the position of the object to be plated, the position of the power supply part,
Variations in the thickness of external connection terminals may occur due to changes in the stirring state of the plating solution. Among these variations, variations among external connection terminals within the printed wiring board can be cited.
If you leave it this large, it will not be thick enough like the external connection terminal (le) of No. 4 I5+1, so you can connect this external connection terminal (le) to other external connection terminals ( 1d) Smooth the top surface and attach the external connection terminal (
le).
そこで、メッキにより外部接続端子形成後、前記外部接
続端子（ｌｄ）のと面を平滑にするため研磨するわけで
あるが、研磨するにあたり、予め研磨する外ｆ４接続端
子部（ｌｄ）のみ貫通穴のあいた、研磨マスクを使用す
るのか好ましい、また、メッキ時に使用したメッキマス
クをそのまま使用しても差し支えない。Therefore, after forming the external connection terminal by plating, the external connection terminal (LD) is polished to make the surface smooth. However, when polishing, only the outer F4 connection terminal part (LD) to be polished in advance has a through hole. It is preferable to use a polishing mask with holes, or the plating mask used during plating may be used as is.
ここで、その表面か均一にされた各外部接続端子の厚み
は基材表面より、１００〜１１０００ｐ厚くなっている
のか好ましい、 １００１４ｍ未満であると突出させた
ことによる効果か薄く、また１０００＃Ｌｍを超える・
と、メッキにより突出させるには多大な時間かかかると
同時に、それ以上を超えてもその効果については大差か
見られないためである。Here, the thickness of each external connection terminal whose surface is made uniform is preferably 100 to 11000p thicker than the base material surface, and if it is less than 10014m, the effect of protruding is thin, and 1000#Lm. Exceeding
This is because it takes a great deal of time to make it protrude by plating, and at the same time, there is little difference in the effect even if the amount of time is exceeded.
以上詳述の通り、外部接続端子を必要な厚みに平滑に突
出させたプリント配線板においては、外部接続端子か突
出していない従来型プリント配線板では接続の信頼性低
下を招くようなそりか表面実装用プリント配線板に見ら
れても、外部接続端子を突出させたことにより、表面実
装用パッケージ底面とプリント配線板上面のすき間か十
分に存在するため、第５図の如く接続は完成するのであ
る。As detailed above, printed wiring boards with external connection terminals that protrude smoothly to the required thickness have warped surfaces that would reduce connection reliability on conventional printed wiring boards where external connection terminals do not protrude. Even if it is seen on a printed wiring board for mounting, there is a sufficient gap between the bottom of the surface mounting package and the top of the printed wiring board due to the protruding external connection terminals, so the connection is completed as shown in Figure 5. be.
また、このようにした外部接続端子を表面実装用プリン
ト配線板に半田リフロー法によって接続する場合、表面
実装用パッケージに印刷した半田ペーストの厚みのバラ
ツキにより、厚みか薄くて接続のできない外部接続端子
（前述の第４図において示した外部Ｊｌｉ続端子端子ｅ
）、あるいは第６図で示した外部接続端子（Ｉｆ））が
あるが、例えば第６図のように突出した外部接続端子（
１ｆ）においては、当該外ｉｒ＆接続端子（Ｉｆ）の厚
みを厚くすることにより、外部接続端子の表面桔を増大
させ、厚くついた半［ロペーストを広い面積に拡げるこ
とができる。すなわち、半田ペーストの厚みは、第７図
に示した符号（６ｃ）の如く薄くなり、従来型プリント
配線板では信頼性低下を招くような半田ペーストの厚み
のバラツキかある場合（第６図で示した半田ペースト（
６ａ）と（６ｂ）のような場合）ても、外部接続端子か
突出したプリント配線板ては第７図の如く接続は完成す
るのである。In addition, when connecting such external connection terminals to a surface mount printed wiring board using the solder reflow method, the external connection terminals may be too thin to connect due to variations in the thickness of the solder paste printed on the surface mount package. (External Jli connection terminal e shown in Figure 4 above)
), or the external connection terminal (If) shown in Figure 6), but for example, there is a protruding external connection terminal (If) as shown in Figure 6.
In 1f), by increasing the thickness of the external IR&connection terminal (If), the surface area of the external connection terminal can be increased, and the thick half paste can be spread over a wide area. In other words, the thickness of the solder paste becomes thinner as shown by the symbol (6c) in Fig. 7, and when there is a variation in the thickness of the solder paste that causes a decrease in reliability in conventional printed wiring boards (as shown in Fig. 6). The solder paste shown (
6a) and (6b), the connection is completed as shown in FIG. 7 if the external connection terminal or the printed wiring board is protruded.
さらに半田フロー法において接続を行う場合、接続完成
後使用したフラックスの残留物等、不純物の除去が、プ
リント配線板上面と表面実装用パッケージ下面とのすき
間（７ｂ）が第３図の如く十分存在するため、より完全
なものとなる。Furthermore, when connecting using the solder flow method, it is necessary to remove impurities such as the residue of the flux used after the connection is completed, so that there is a sufficient gap (7b) between the top surface of the printed wiring board and the bottom surface of the surface mount package as shown in Figure 3. Therefore, it becomes more complete.
次に本発明の最も代表的な実施例を示して具体的に説明
する。Next, the most typical embodiment of the present invention will be shown and explained in detail.
（実施例）
夫ム勇ユ
ガラスエボリシ銅張積層板（両面銅厚Ｉ８ル）に通常の
サブトラクティブ法にて必要な配線パターンを形成した
。そして、パターン形成後に外部接続端子部の突出を電
解メウキで形成するためのメッキマスクとしてダイナケ
ム社製ラミナーＴＡ２ ａｉｌｓを４枚重ねてラミネー
トを実施した０次に外部接続端子を形成するのに必要な
マスクを用い、オーク社ＩＪ ｚａｌＢＱ露光機にて３
００■ｊで露光した後、炭酸ソーダ２％水溶液を用い現
像を行った。そして外部接続端子の被メツキ部を露光さ
せ、必要なメッキ処理を行った後、電解Ｎｉメッキ液（
スルファミン酸浴）を用い１８０ｇｍの電解メッキを行
なった。この時の電流密度は１０Ａ／ｄｒｒｒ’で１回
分間メッキした。(Example) Necessary wiring patterns were formed on a glass evoluted copper-clad laminate (copper thickness on both sides I8) by a normal subtractive method. After pattern formation, four sheets of Dynachem's laminar TA2 ails were stacked and laminated as a plating mask for forming the protrusions of the external connection terminals using electrolytic coating. Using a mask, use Oak's IJ zalBQ exposure machine.
After exposure at 00■j, development was performed using a 2% aqueous solution of sodium carbonate. Then, the part to be plated of the external connection terminal is exposed to light, and after performing the necessary plating treatment, electrolytic Ni plating solution (
Electrolytic plating of 180 gm was performed using a sulfamic acid bath). At this time, plating was carried out for one minute at a current density of 10 A/drrr'.
その後、外部接続端子上面を平滑化するため、菊用鉄二
「新製ベルトサンダーＴＯＰＩ２６Ｍ２Ｗ型を用い研磨
した。以との行程を実施することにより外部ｕｉ衷続子
の厚さは基材表面から １７５ｇｍ、他の導体部より約
１３１３μｍ事情に突出させることかてきた。After that, in order to smooth the top surface of the external connection terminal, it was polished using Tetsuji Kikuyo's new belt sander TOPI26M2W model. By performing the following steps, the thickness of the external UI connector was 175 g from the base material surface. , the conductor portion was made to protrude by approximately 1313 μm from other conductor portions.
実施例２
前記実施例１と同様にプリント配線板において必要な配
線パターンを形成した後、粘着剤が片面に付着している
４１１０ｇｍのポリエステルフィルムを用い、金層にて
必要な外部接続端子の大きさを打抜いた後、前記プリン
ト配線板に１位置決めピンにて位置合せを行い加圧接着
した。その後硫酸銅メッキ液７ Ａ／ｄｍ’で約５．５
時間メ・フキを施した。さらに外部接続端子上面を平滑
化するために研磨した。その結果基材表面から ３６０
ｇｍ、他の導体部より約３１０．ｕ、ｍ平滑に突出させ
ることかできた。Example 2 After forming the necessary wiring pattern on a printed wiring board in the same manner as in Example 1, using a 4110 gm polyester film with adhesive attached to one side, the required size of external connection terminals was formed using a gold layer. After punching out the sheet, it was aligned with the printed wiring board using one positioning pin and bonded under pressure. After that, copper sulfate plating solution was applied at 7 A/dm' to approx. 5.5
A time-blasting was applied. Furthermore, the top surface of the external connection terminal was polished to make it smooth. As a result, from the base material surface 360
gm, about 310. I was able to make u and m protrude smoothly.
前記実施例１あるいは２と同様に、プリント配線板にお
いて必要な配線パターンを形成した後、ＥＥＪＡ製部分
メッキ装ＨＭＯＤＬＪＬＥ−ＭＡＳＱ型を用い、外部接
続端子形成部にのみ穴のあいたシリコンゴムなメッキマ
スクとし、硫酸銅メッキ液８０Ａ ／ ｄ ｒｎ’て約
５０分メッキを施した。その後、外部接続端子上面を平
滑化するために、外部接続端子の位置する部分にのみ穴
のあいた厚さ７５１１７Ｌｍのポリエステルフィルムを
研磨マスクとして用い研磨を行った。その結果基板表面
から７００ ｐ、 ｍ 、他の導体部より約６５０ルｍ
平滑に突出させることがてきた。As in Example 1 or 2, after forming the necessary wiring pattern on the printed wiring board, a silicone rubber plating mask with holes only in the external connection terminal formation area was formed using a partial plating device HMODLJLE-MASQ manufactured by EEJA. Then, plating was performed using a copper sulfate plating solution at 80 A/drn' for about 50 minutes. Thereafter, in order to smooth the upper surface of the external connection terminal, polishing was performed using a polyester film with a thickness of 75117 Lm with holes formed only in the portion where the external connection terminal is located as a polishing mask. As a result, the distance is 700 p, m from the board surface and about 650 lm from other conductor parts.
I was able to make it protrude smoothly.
（発明の効果）
以上にように１本発明に係る外部を表子端子が平滑に突
出した表面実装用プリント配線板においては、基板のソ
リ、印刷半田ペーストの厚みのバラツキか発生しても１
表面実装用パッケージとの接続は確実なものとなり、そ
の接続信頼性は大きく向上する。また１表面実装用プリ
ント配線板上面と表面実装用パッケージｒ面とのすき間
か大きくとれ、実装後洗ｎ一時に不！物除去か確実に行
え、電気的信頼性か著しく向上する。(Effects of the Invention) As described above, in the surface mounting printed wiring board according to the present invention in which the front terminal smoothly protrudes from the outside, even if warping of the board or variation in the thickness of the printed solder paste occurs,
The connection with the surface mount package becomes reliable, and the reliability of the connection is greatly improved. In addition, there is a large gap between the top surface of the printed wiring board for surface mounting and the r surface of the package for surface mounting, making it difficult to clean after mounting. Objects can be removed reliably, and electrical reliability is significantly improved.
第１図は本発明の表面実装用プリント配線板の斜視図、
第２図は従来型プリント配線板の斜視図である。
また、第３図〜第７図のそれぞれは本発明の表面実装用
プリント配線板の縦断面図である。
さらに、第８図及び第９図は従来の表面実装用プリント
配線板の縦断面図である。
符 号 の 説 ＋７１１・・・外部
接続端子、２・・・配線部（導体１０１路）、３・・・
表面実装用パッケージ（チップキャリア）、４・・・プ
リントｆｉ！、線板、５・・・表面実装用パッケージ（
フラットパッケージ）、６・・・印刷゛ｈ田ペースト７
・・・空間。FIG. 1 is a perspective view of a printed wiring board for surface mounting according to the present invention;
FIG. 2 is a perspective view of a conventional printed wiring board. Moreover, each of FIGS. 3 to 7 is a longitudinal cross-sectional view of the surface mounting printed wiring board of the present invention. Furthermore, FIGS. 8 and 9 are vertical cross-sectional views of conventional surface-mount printed wiring boards. Code explanation +711...External connection terminal, 2...Wiring section (conductor 101 path), 3...
Surface mount package (chip carrier), 4...Print fi! , Wire board, 5...Surface mounting package (
flat package), 6... printing paste 7
···space.
Claims (1)
有するプリント配線板において、 前記表面実装用パッケージに接続される、導体回路の外
部接続端子部が、他の導体回路に較べ、平滑に突出した
ことを特徴とする表面実装用プリント配線板。 ２）、前記外部接続端子部の導体厚みが、基材表面より
１００〜１０００μｍ平滑に突出したことを特徴とする
特許請求の範囲第１項記載の表面実装用プリント配線板
。 ３）、前記外部接続端子部はメッキにより形成後、表面
を研磨することにより平滑化されたことを特徴とする特
許請求の範囲第１項あるいは第２項記載の表面実装用プ
リント配線板。[Claims] 1) In a printed wiring board having a conductor circuit on which a surface mount package is mounted, an external connection terminal portion of the conductor circuit connected to the surface mount package is connected to another conductor circuit. A printed wiring board for surface mounting, which is characterized by a smooth protrusion compared to the above. 2) The printed wiring board for surface mounting according to claim 1, wherein the conductor thickness of the external connection terminal portion protrudes smoothly from the surface of the base material by 100 to 1000 μm. 3) The surface mounting printed wiring board according to claim 1 or 2, wherein the external connection terminal portion is formed by plating and then smoothed by polishing the surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15443786A JPS639997A (en) | 1986-06-30 | 1986-06-30 | Surface mounting printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15443786A JPS639997A (en) | 1986-06-30 | 1986-06-30 | Surface mounting printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS639997A true JPS639997A (en) | 1988-01-16 |
Family
ID=15584172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15443786A Pending JPS639997A (en) | 1986-06-30 | 1986-06-30 | Surface mounting printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS639997A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02134896A (en) * | 1988-11-15 | 1990-05-23 | Nec Corp | Mounting of semiconductor device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56167393A (en) * | 1980-05-27 | 1981-12-23 | Tokyo Shibaura Electric Co | Method of producing printed circuit board with bonding part |
| JPS5722438A (en) * | 1980-07-11 | 1982-02-05 | Yamaha Motor Co Ltd | Oil-hydraulic damper |
| JPS59163889A (en) * | 1983-03-08 | 1984-09-14 | 松下電器産業株式会社 | Method of partially plating conductor on substrate |
-
1986
- 1986-06-30 JP JP15443786A patent/JPS639997A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56167393A (en) * | 1980-05-27 | 1981-12-23 | Tokyo Shibaura Electric Co | Method of producing printed circuit board with bonding part |
| JPS5722438A (en) * | 1980-07-11 | 1982-02-05 | Yamaha Motor Co Ltd | Oil-hydraulic damper |
| JPS59163889A (en) * | 1983-03-08 | 1984-09-14 | 松下電器産業株式会社 | Method of partially plating conductor on substrate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02134896A (en) * | 1988-11-15 | 1990-05-23 | Nec Corp | Mounting of semiconductor device |
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