JPH0582078B2 - - Google Patents
Info
- Publication number
- JPH0582078B2 JPH0582078B2 JP60159192A JP15919285A JPH0582078B2 JP H0582078 B2 JPH0582078 B2 JP H0582078B2 JP 60159192 A JP60159192 A JP 60159192A JP 15919285 A JP15919285 A JP 15919285A JP H0582078 B2 JPH0582078 B2 JP H0582078B2
- Authority
- JP
- Japan
- Prior art keywords
- card
- external contact
- printed wiring
- wiring board
- contact terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 claims description 27
- 238000007747 plating Methods 0.000 claims description 25
- 239000004020 conductor Substances 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 238000009713 electroplating Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 238000007772 electroless plating Methods 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000010410 layer Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006355 external stress Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000008719 thickening Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 239000002650 laminated plastic Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Credit Cards Or The Like (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電気的信号を処理するためのICチ
ツプを備えた識別カード等のICカードに内蔵も
しくは装着するICカード用プリント配線板の製
造方法に関し、特に本発明は前記ICカード用プ
リント配線板において電極部である外部接点端子
の導体厚みを他の配線部分の導体厚みより厚くし
て突出させたICカード用プリント配線板の製造
方法を提供するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to the manufacture of a printed wiring board for an IC card, which is built into or attached to an IC card such as an identification card that is equipped with an IC chip for processing electrical signals. In particular, the present invention provides a method for manufacturing a printed wiring board for an IC card, in which the conductor thickness of the external contact terminal, which is an electrode part, is thicker than the conductor thickness of other wiring parts in the printed wiring board for an IC card. This is what we provide.
従来のICカード用プリント配線板を第２図に
示す。すなわち、ICカードに用いられるICカー
ド用プリント配線板においては、ICカード表面
に外部接点端子３のみを露出させることができる
ように、プリント配線板の一面に外部接点端子の
みが設けられ、必要なチツプとの配線は、外部接
点端子に導通孔５を設けることにより行われる。
Figure 2 shows a conventional printed wiring board for IC cards. That is, in an IC card printed wiring board used for an IC card, only the external contact terminals are provided on one side of the printed wiring board so that only the external contact terminals 3 can be exposed on the surface of the IC card, and the necessary Wiring with the chip is performed by providing conduction holes 5 in the external contact terminals.
このようなICカード用プリント配線板をICカ
ードに内蔵もしくは装着する場合、第４図のよう
な態様となる。あるいは、やむを得ず外部接点端
子３の他に同一面に配線を施す必要が生じた場合
は、第５図に示すような態様で内蔵もしくは装着
されるのが一般的である。いずれの場合も外部接
点端子３の導体厚みは他の配線パターンの導体厚
みとほぼ等しく、その構造上３〜４層の多層IC
カード用プリント配線板が用いられる。従つて、
ICカードに内蔵もしくは装着した場合、ICカー
ド表面には、第４図および第５図に示す様に端子
部での凹凸がさけられず、また前記ICカード用
プリント配線板が露出する構造となる。 When such a printed wiring board for an IC card is built into or attached to an IC card, the configuration is as shown in FIG. 4. Alternatively, if it is unavoidable to provide wiring on the same surface as the external contact terminal 3, it is generally built in or installed in the manner shown in FIG. In either case, the conductor thickness of the external contact terminal 3 is almost equal to the conductor thickness of other wiring patterns, and due to its structure, it is a multilayer IC with 3 to 4 layers.
A printed wiring board for cards is used. Therefore,
When built into or attached to an IC card, the surface of the IC card will have unevenness at the terminals, as shown in Figures 4 and 5, and the printed wiring board for the IC card will be exposed. .
上記従来技術のうち、第２図に示すICカード
用プリント配線板を内蔵もしくは装着した第４図
に示すICカードにあつては、ICカード全体が屈
曲した場合、ICカードの一部に単にICカード用
プリント配線板を嵌着したものであるためICカ
ード用プリント配線板が離脱し易く、また、多層
構造となるICカード用プリント配線板とICカー
ドを構成する塩化ビニール等との柔軟性が著しく
異なるため屈曲に対しては、極めて弱い構造とな
る。また、第５図に示すICカードにあつては、
イ及びロの溝の部分に使用中ゴミが蓄積し易く、
外部端末処理材等の接続において信頼性に乏しい
欠点がある。さらに、第４図または第５図いずれ
の場合においても、内蔵もしくは装着されたIC
カード用プリント配線板がICカード表面に露出
しているため、湿気の多い場合或るいは水等が付
着しやすい状態での保管及び使用に際しては、電
気的絶縁が不完全になり、故障し易くなる。
Among the above-mentioned conventional technologies, in the case of the IC card shown in FIG. 4 which has a built-in or attached IC card printed wiring board shown in FIG. Since the printed wiring board for the card is fitted, the printed wiring board for the IC card is easy to separate, and the flexibility of the printed wiring board for the IC card, which has a multilayer structure, and the vinyl chloride etc. that make up the IC card is Because of the marked difference, the structure becomes extremely weak against bending. In addition, for the IC card shown in Figure 5,
Dust tends to accumulate in the grooves of A and B during use.
It has the drawback of poor reliability in connection with external terminal processing materials, etc. Furthermore, in either case of Figure 4 or Figure 5, the built-in or attached IC
Since the printed circuit board for the card is exposed on the surface of the IC card, if it is stored or used in humid conditions or in conditions where it is easily exposed to water, electrical insulation may be incomplete and it may easily malfunction. Become.
一方、従来のICカードに用いるICカード用プ
リント配線板の製作にあたつては、前述のように
３〜４層などの多層構造とせざるを得ないので、
手間を要しコスト高となることは言うまでもな
い。 On the other hand, when manufacturing IC card printed wiring boards used in conventional IC cards, it is necessary to have a multilayer structure of 3 to 4 layers as mentioned above.
Needless to say, it is time-consuming and costly.
このような問題を解決する手段として、特開昭
58−11198号公報には外部端子を形成する大きい
断面を有する導電部材を備えた「識別カード」が
開示されている。 As a means to solve such problems,
No. 58-11198 discloses an "identification card" including a conductive member with a large cross section forming an external terminal.
しかし、この特開昭58−11198号公報の識別カ
ードにおいては導電部材をキヤリアテープ上の導
電路にただ接触させて接続しているのみで、これ
らカードを衣服のポケツトや財布に入れて持ち運
ぶときの外部応力によつて、導電部材が導電路か
ら簡単に外れて接続不良となつたのである。ま
た、前記識別カードでは導電部材を大径部として
接触面積を上げ、また別の方法として導電部にツ
メを設け接続部にくいこませる方法を開示してい
る。しかし大径部として接触面積をたとえ２倍と
することができたとしても前記外部応力に対して
は無効であるばかりでなく、ツメを設けた場合に
はツメをくいこませる深さにバラツキが生じ、従
つてカード厚みに大きなバラツキが生じて採用で
きなかつたのである。また、さらに別の方法とし
て低融点半田を予め塗布し熱圧着時に溶融接続す
る方法を開示している。しかし、ハンダの塗布の
ために使用するハンダクリーム中のフラツクス除
去がカードを接着した後ではできないばかりか、
ハンダ接続部が接続時には見えないカード内部で
あり、余分なハンダによるシヨート不良やハンダ
不足による接続不良が管理できず到底採用できな
いものであつたのである。 However, in the identification card disclosed in Japanese Patent Application Laid-Open No. 58-11198, the conductive member is simply connected to the conductive path on the carrier tape, and when the card is carried in a clothing pocket or wallet. The external stress caused the conductive member to easily come off the conductive path, resulting in a poor connection. Further, in the identification card, a method is disclosed in which the conductive member is made a large diameter part to increase the contact area, and another method is to provide a tab on the conductive part and push it into the connecting part. However, even if the contact area could be doubled as a large-diameter part, it would not only be ineffective against the external stress, but if a claw is provided, there would be variations in the depth at which the claw is inserted. This resulted in large variations in card thickness, making it impossible to adopt the card. Further, as yet another method, a method is disclosed in which a low melting point solder is applied in advance and melted and connected during thermocompression bonding. However, it is not only impossible to remove the flux from the solder cream used for applying solder after the cards are bonded.
The solder joints were inside the card and could not be seen during connection, making it impossible to manage shot defects due to excess solder and connection failures due to insufficient solder, making it impossible to adopt this method.
また別の解決手段として、特開昭58−27287号
公報には金属基材をろう付け、溶接あるいは接着
によつて外部端子領域の増さを増大した「情報処
理のための携帯用カード」が開示されている。 As another solution, JP-A-58-27287 discloses a "portable card for information processing" in which the external terminal area is increased by brazing, welding or gluing a metal base material. Disclosed.
しかし、これは前述した特開昭58−11198号公
報と同様のハンダによる溶融接続と同様の問題で
やはり採用できないものであつたのである。そし
て、特開昭58−27287号公報で新たに開示された
金属増厚材の導体網に向いた表面を銀あるいは金
メツキし、ろう付けできる表面とすることによつ
ても前述したハンダによる溶融接続と同様の問題
は何ら解決されていないのである。 However, this method could not be adopted due to the same problem as the fusion connection using solder as in the above-mentioned Japanese Patent Laid-Open Publication No. 11198/1983. Furthermore, by plating the surface facing the conductor network of the metal thickening material newly disclosed in Japanese Unexamined Patent Publication No. 58-27287 with silver or gold to make it a surface that can be brazed, it is also possible to melt it by soldering as described above. Problems similar to connectivity remain unresolved.
さらに、この特開昭58−27287号公報は、外部
電極領域を形成する金属増厚材の表面にメツキ法
によつて金、クロム、ニツケル、銀からなる別の
金属表面層を設けることを開示している。しか
し、このメツキは外部電極領域表面の単に耐摩耗
性向上のために行なつているのみであり、外部電
極の増厚は金属基材のろう付け、溶接あるいは接
着によつているのであるため、前述した問題点は
避けられないのである。 Furthermore, this Japanese Patent Application Laid-Open No. 58-27287 discloses that another metal surface layer made of gold, chromium, nickel, and silver is provided on the surface of the metal thickening material forming the external electrode region by a plating method. are doing. However, this plating is only done to improve the wear resistance of the surface of the external electrode area, and the thickness of the external electrode is increased by brazing, welding, or gluing the metal base material. The problems mentioned above are unavoidable.
本発明は、このような従来技術の欠点を除去・
改善することを目的とし、第６図のICカードの
縦断面図に示すように、外部接点端子３の導体厚
みを他の配線パターン４の導体厚より厚くして突
出させる構造とすることにより、ICカード用プ
リント配線板を安価に製造するとともに、これを
内蔵もしくは装着したとき耐久性があつて信頼性
が高く、かつ美観をそなえたICカードの製作に
適したICカード用プリント配線板の製造方法を
提供するものである。 The present invention eliminates and eliminates such drawbacks of the prior art.
As shown in the vertical cross-sectional view of the IC card in FIG. 6, the conductor thickness of the external contact terminal 3 is made thicker than the conductor thickness of other wiring patterns 4 so as to protrude. Manufacture of printed wiring boards for IC cards that are suitable for manufacturing IC cards that are inexpensive, durable, reliable, and aesthetically pleasing when built-in or installed. The present invention provides a method.
以上の問題点を解決するために、本発明の採つ
た手段は、以下に示す実施例において使用する符
号を付して説明すると、
「ICチツプを備えた識別カード等のICカード
に内蔵もしくは装着されるICカード用プリント
配線板２であつて、その各外部接点端子３の導体
を、他の配線部分の導体４の厚みより100〜200μ
ｍ厚くしたICカード用プリント配線板２を製造
する方法において、
ICカード用プリント配線板２を構成するため
の本体１に対して穴明、スルーホールメツキ、レ
ジスト形成、エツチングを施すことにより配線パ
ターンの形成を行なつた後、
本体１に200μｍ厚さに形成した感光性レジス
トを、前記導体の各外部接点端子３に対応する部
分が露出するように露光、現像するか、もしく
は、200μｍ厚みの片面接着剤付フイルムの一部
を各外部接点端子３の大きさに打抜き、その各開
口を各外部接点端子３部に位置合わせし、当該片
面接着剤付フイルムを本体１に加圧接着し、
これらの感光性レジストもしくは片面接着剤付
フイルムをメツキマスクとして、各外部接点端子
３に無電解または電解メツキによる銅またはニツ
ケルメツキを厚付けすることにより、各外部接点
端子３を均等に厚くしたICカード用プリント配
線板２の製造方法」
である。
In order to solve the above problems, the means adopted by the present invention are described with reference numerals used in the embodiments shown below. A printed wiring board 2 for an IC card, in which the conductor of each external contact terminal 3 is 100 to 200 μm thicker than the conductor 4 of other wiring parts.
In a method for manufacturing a printed wiring board 2 for an IC card having a thickness of 1.5 m, a wiring pattern is formed by drilling holes, through-hole plating, resist formation, and etching on the main body 1 for configuring the printed wiring board 2 for an IC card. After forming, a photosensitive resist formed to a thickness of 200 μm on the main body 1 is exposed and developed so that the portion corresponding to each external contact terminal 3 of the conductor is exposed, or a photoresist with a thickness of 200 μm is formed. A part of the single-sided adhesive-coated film is punched out to the size of each external contact terminal 3, each opening thereof is aligned with each external contact terminal 3, and the single-sided adhesive-coated film is bonded to the main body 1 under pressure. Using these photosensitive resists or films with one-sided adhesive as a plating mask, thick copper or nickel plating is applied to each external contact terminal 3 by electroless or electrolytic plating, thereby making each external contact terminal 3 evenly thick. "Method for manufacturing printed wiring board 2".
本発明を更に具体的にかつ詳しく説明するに当
つて、以下、図面及び実施例に基づいて説明す
る。 In order to explain the present invention more specifically and in detail, it will be described below based on drawings and examples.
第３図は、本発明の方法によつて製造したIC
カード用プリント配線基板の縦断面図である。こ
の図面において、符号１はプリント配線基板の本
体であり、一般にはガラスエポキシ複合材料から
成る銅張積層板であるが、その他、紙フエノー
ル、紙エポキシなどの複合材料のほか、トリアジ
ン変性樹脂、ポリイミド樹脂フイルムなどから成
るリジツド或いはフレキシブル基板などが使用さ
れる。 Figure 3 shows an IC manufactured by the method of the present invention.
FIG. 3 is a longitudinal cross-sectional view of a printed wiring board for a card. In this drawing, reference numeral 1 indicates the main body of the printed wiring board, which is generally a copper-clad laminate made of glass-epoxy composite material, but other composite materials such as paper phenol, paper epoxy, triazine-modified resin, polyimide, etc. A rigid or flexible substrate made of resin film or the like is used.
前記銅張り積層板からなる本体１に、ドリル或
いは金型による打抜きを行い導通孔５を加工した
後スルホールメツキ、レジスト形成、エツチング
の工程を経て、必要な配線パターンを形成する。
そして、以下に示すメツキ法により、外部接点端
子の位置するパターン上に外部接点端子３を他の
配線パターン４の導体厚みより突出させる。 The main body 1 made of the copper-clad laminate is punched with a drill or a die to form conductive holes 5, and then through-hole plating, resist formation, and etching steps are performed to form necessary wiring patterns.
Then, by the plating method described below, the external contact terminals 3 are made to protrude from the conductor thickness of the other wiring patterns 4 on the pattern where the external contact terminals are located.
ここで、外部接点端子３の形成方法としては、
パターンの適宜部分を予め必要な外部接点端子３
の大きさに露出させたメツキマスクを本体１に形
成し、パターンの露出した部分に各種の無電解あ
るいは電解メツキを施すことによつて形成するも
のである。ここで用いるメツキマスクとしては、
粘着剤のついたポリエステルあるいはポリプロピ
レンのフイルムであつて、その外部接点端子を設
けようとする所定の位置に予め金型等により接点
端子部分のみを打抜いたもの、或いは、通常プリ
ント配線板の製造で用いられる感光性レジストフ
イルム、インキ等を必要な厚さにして用いるメツ
キ浴に即応させて使用する。 Here, the method for forming the external contact terminal 3 is as follows.
External contact terminals 3 are attached to appropriate parts of the pattern in advance.
An exposed plating mask having a size of 1 is formed on the main body 1, and various types of electroless or electrolytic plating are applied to the exposed portions of the pattern. The Metsuki mask used here is
A polyester or polypropylene film coated with an adhesive, in which only the contact terminal portion is punched out using a mold or the like in advance at the predetermined position where the external contact terminal is to be installed, or the production of a regular printed wiring board. The photosensitive resist film, ink, etc. used in the process are adjusted to the required thickness and used in a plating bath.
また、メツキ方法としては、比較的外部接点端
子の厚みが薄い場合、無電解メツキ、厚い場合は
電解メツキが好ましい。メツキ金属の種類として
は、銅、ニツケルメツキが好ましい。特に電解メ
ツキにおいては、メツキ溶液を被メツキ部に噴射
させ且つメツキマスクを自動的に機械に取付けら
れたゴムなどの弾性被膜で他の部分を覆つて部分
メツキする方法は短時間のうちに必要なメツキ厚
みが得られ、厚みのバラツキも少ないので極めて
有効な方法である。 Further, as a plating method, electroless plating is preferable when the external contact terminal is relatively thin, and electrolytic plating is preferable when the external contact terminal is thick. As for the type of plating metal, copper and nickel plating are preferred. Particularly in electrolytic plating, a method of spraying plating solution onto the part to be plated and automatically covering other parts with an elastic coating such as rubber using a plating mask attached to the machine is necessary in a short period of time. This is an extremely effective method because it provides a good plating thickness and there is little variation in the thickness.
ここで外部接点端子の導体厚みが他の配線パタ
ーンが施されている導体の厚みより100μｍ〜
200μｍ厚くなつているのが必要である。100μｍ
以下であると、ICカード等の被覆に用いられる
塩化ビニール等のフイルムでのラミネートが困難
となり易く、外部接点端子での凹み、或いは又ラ
ミネート後のICカード表面の凹凸が発生しやす
いためであり、200μｍ以上となるとICカード等
の厚み規格を超えやすいためである。この際特に
前記フイルムのラミネートは、前記外部接点端子
とラミネートしたプラスチツクス表面が同一平面
となることが極めて好ましい。ICカードの美観
が優れ、外部接点端子部の信頼性が高まるからで
ある。 Here, the conductor thickness of the external contact terminal is 100 μm or more than the thickness of the conductor with other wiring patterns.
It is necessary that the thickness be 200 μm. 100μm
If it is below, it will be difficult to laminate with a film such as vinyl chloride used to cover IC cards, etc., and dents at the external contact terminals or unevenness on the surface of the IC card after lamination will easily occur. This is because when the thickness exceeds 200 μm, it tends to exceed the thickness standard for IC cards, etc. In this case, it is particularly preferable that the external contact terminal and the surface of the laminated plastic are on the same plane when laminating the film. This is because the appearance of the IC card is excellent and the reliability of the external contact terminal section is increased.
なお、本発明による外部接点端子部の突出は、
従来の３〜４層の多層構造のICカード用プリン
ト配線板にも応用でき、ICカード等の信頼性は
向上する。 Note that the protrusion of the external contact terminal portion according to the present invention is as follows:
It can also be applied to conventional printed wiring boards for IC cards with a multilayer structure of 3 to 4 layers, improving the reliability of IC cards and the like.
特に本発明によつて形成したICカード用プリ
ント配線板にあつては、外部接点端子部を突出し
た。 In particular, in the case of the printed wiring board for an IC card formed according to the present invention, the external contact terminal portion is protruded.
また本発明の方法によれば、第３図に示す如く
外部接点端子３が突出し、第６図のICカードに
内蔵もしくは装着した場合、前記外部接点端子表
面のみが露出し、他の部分はICカード本体の塩
化ビニール等からなるフイルムで完全に被覆する
ことができる。 Further, according to the method of the present invention, when the external contact terminal 3 protrudes as shown in FIG. 3 and is built into or attached to the IC card shown in FIG. The card body can be completely covered with a film made of vinyl chloride or the like.
従つて、ICカード用プリント配線板２の外部
接点端子３と同一面には、他の配線パターンもそ
の信頼性に支障なく容易に施すことが可能とな
り、従来のICカード用プリント配線板として用
いられた３〜４層からなる多層配線板も両面化で
きる。 Therefore, other wiring patterns can be easily applied to the same surface as the external contact terminals 3 of the printed wiring board 2 for IC cards without affecting its reliability, and it can be used as a conventional printed wiring board for IC cards. A multilayer wiring board consisting of three to four layers can also be made double-sided.
このように本発明によれば、両面プリント配線
板を用いることができるので低コスト化に大きく
貢献する。 As described above, according to the present invention, a double-sided printed wiring board can be used, which greatly contributes to cost reduction.
前記外部接点端子部を必要な厚さに突出させた
後、ICカード用プリント配線板にチツプを搭載
し、予めICカードに設けられた凹部に配置し、
表面のプラスチツクフイルムをラミネートする。
この際前記プラスチツクフイルムには、予めIC
カード用プリント配線板の外部接点端子位置に相
当する部分に金型など用いた打抜きで窓が設けら
れている。 After protruding the external contact terminal portion to a required thickness, a chip is mounted on a printed wiring board for an IC card, and placed in a recess provided in advance on the IC card,
Laminate the plastic film on the surface.
At this time, the plastic film has an IC in advance.
A window is provided in a portion of the card printed wiring board corresponding to the external contact terminal position by punching using a mold or the like.
次に本発明の最も代表的な実施例を示して具体
的に説明する。
Next, the most typical embodiment of the present invention will be shown and explained in detail.
実施例 １
ガラスエポキシ銅張積層板（両面銅厚18μｍ）
にNCドリルで穴明けを施した後、通常のサブト
ラクテイブ法にて必要な配線パターンを形成し
た。そして、パターン形成後に外部接点端子部の
突出を電解メツキで施すためメツキマスクとして
ダイナケム社製ラミナーTA2mils（50μｍ）を４
枚重ねてラミネートを実施したその厚さの合計は
200μｍである。次に、接点端子部を形成するの
に必要なマスクを用いオーク社製201B型の露光
機にて300mjで露光した後炭酸ソーダ２％水溶液
を用い現像を行つた。そして接点端子部の被メツ
キ部を露出させ、必要なメツキ前処理を行つた
後、硫酸銅メツキ液4A／ｄm2で、約３時間メツ
キを施した。外部接点端子の厚さは、基材表面か
ら150μｍで他の導体厚より凡そ100μｍ厚くする
ことができた。Example 1 Glass epoxy copper clad laminate (copper thickness on both sides 18 μm)
After drilling holes with an NC drill, the necessary wiring pattern was formed using the usual subtractive method. After pattern formation, in order to electrolytically plate the protrusions of the external contact terminals, 4 sheets of Dynachem's laminar TA2mils (50μm) were used as a plating mask.
The total thickness of laminated sheets is
It is 200 μm. Next, using a mask necessary for forming the contact terminal portion, the film was exposed to light at 300 mj using an exposure machine model 201B manufactured by Oak Co., Ltd., and then developed using a 2% aqueous solution of sodium carbonate. After exposing the portion of the contact terminal portion to be plated and performing necessary plating pretreatment, plating was performed for about 3 hours using a copper sulfate plating solution of 4 A/dm 2 . The thickness of the external contact terminal was 150 μm from the base material surface, which was approximately 100 μm thicker than the other conductor thicknesses.
実施例 ２
前記実施例１と同様にプリント配線パターンを
形成した後、粘着剤が片面に付着している200μ
ｍのポリエステルのフイルムを用い、金型にて必
要な外部接点端子の大きさを打抜いた後、その各
開口がパターンの各外部接点端子３となるべき部
分に対応するように前記ICカード用プリント配
線板に位置決めピンにて位置合わせを行ない、加
圧接着した。その後電解Niメツキ液（スルフア
ミン酸浴）を用い180μｍの電解メツキを行つた。
このときの電流密度は、10A／ｄm2−100分であ
つた。メツキ後ポリエステルフイルムを剥し外部
接点端子部の厚さを測定したところICカード用
プリント配線板基材表面から175μｍであつた。
他の配線パターンの導体厚みより130μｍ厚くす
ることができた。Example 2 After forming a printed wiring pattern in the same manner as in Example 1 above, a 200μ film with adhesive attached to one side was
After punching out the necessary size of external contact terminals using a mold using a polyester film of 1.5 m in size, punch out the size of the external contact terminals with a mold, and then punch out the IC card so that each opening corresponds to the part of the pattern that is to become each external contact terminal 3. It was aligned to the printed wiring board using positioning pins and bonded under pressure. Thereafter, electrolytic plating of 180 μm was performed using an electrolytic Ni plating solution (sulfamic acid bath).
The current density at this time was 10 A/dm 2 -100 minutes. After plating, the polyester film was peeled off and the thickness of the external contact terminal portion was measured and found to be 175 μm from the surface of the IC card printed wiring board substrate.
We were able to make the conductor thickness 130 μm thicker than other wiring patterns.
以上のように、本発明のICカード用プリント
配線基板の製造方法によれば、従来のICカード
用プリント配線板は３〜４層構造の多層配線板で
あつたのに対し、少なくとも２層構造の両面スル
ホール基板とすることができるので、ICカード
用プリント配線板の構造の簡素化ができるととも
に、その製造コストを低減することができる。ま
た本発明の方法によつて製造したICカード用プ
リント配線板は、ICカードの屈曲時などに対し
脱落することなく耐久性が向上し、併せて従来の
ICカードの他の表面と外部接点端子外表面との
間に形成された溝部にゴミが蓄積しない端子表面
と他の表面とが同一平面の構造であつて、信頼性
が著しく向上し、さらにはICカード表面に被覆
するポリ塩化ビニル樹脂などの熱可塑性樹脂皮膜
と端子側面が完全に密着した構造とすることがで
きるため、ICカード内部に内蔵もしくは装着し
た場合に直線露出することなく、外気の水分が
ICまで浸入することがなくなりチツプなどの電
子部品の耐久性と信頼性が著しく向上する。
As described above, according to the method of manufacturing a printed wiring board for an IC card of the present invention, the conventional printed wiring board for an IC card has a multilayer wiring board with a three to four layer structure, but it has a structure of at least two layers. Since it can be made into a double-sided through-hole board, the structure of the printed wiring board for IC cards can be simplified and the manufacturing cost can be reduced. In addition, the printed wiring board for IC cards manufactured by the method of the present invention has improved durability without falling off when the IC card is bent, and has improved durability compared to conventional IC cards.
Dust does not accumulate in the groove formed between the other surface of the IC card and the outer surface of the external contact terminal.The terminal surface and other surface are flush with each other, and reliability is significantly improved. It is possible to create a structure in which the thermoplastic resin film such as polyvinyl chloride resin that covers the surface of the IC card and the side surface of the terminal are completely in contact with each other, so there is no direct exposure to the outside air when the IC card is built in or installed inside the card. moisture
This prevents it from penetrating into the IC, significantly improving the durability and reliability of electronic components such as chips.
第１図は、本発明の方法によつて製造したIC
カード用プリント配線板の斜視図、第２図は従来
のICカード用プリント配線板の縦断面図、第３
図は本発明の方法によつて製造したICカード用
プリント配線板の縦断面図、第４図及び第５図は
従来のICカード用プリント配線板を内蔵したIC
カードの縦断面図、第６図は本発明の方法によつ
て製造したICカード用プリント配線板を用いた
ICカードの縦断面図、第７図は本発明の方法に
よつて製造したICカード用プリント配線板を内
蔵したICカードの斜視図である。
１……ICカード用プリント配線板本体、２…
…ICカード用プリント配線板、３……外部接点
端子、４……他の配線部分の導体部、５……導通
穴（スルホール）。
FIG. 1 shows an IC manufactured by the method of the present invention.
Figure 2 is a perspective view of a printed wiring board for cards; Figure 2 is a vertical cross-sectional view of a conventional printed wiring board for IC cards;
The figure is a vertical cross-sectional view of a printed wiring board for IC cards manufactured by the method of the present invention, and Figures 4 and 5 are conventional IC cards incorporating printed wiring boards for IC cards.
A vertical cross-sectional view of the card, FIG. 6, shows an IC card printed wiring board manufactured by the method of the present invention.
FIG. 7 is a longitudinal cross-sectional view of an IC card, and is a perspective view of an IC card incorporating a printed wiring board for an IC card manufactured by the method of the present invention. 1...Printed wiring board body for IC card, 2...
...Printed wiring board for IC card, 3...External contact terminal, 4...Conductor part of other wiring parts, 5...Through hole.
Claims (1)
に内蔵もしくは装着されるICカード用プリント
配線板２であつて、その各外部接点端子３の導体
を、他の配線部分の導体４の厚みより100〜200μ
ｍ厚くしたICカード用プリント配線板２を製造
する方法において、 ICカード用プリント配線板２を構成するため
の本体１に対して穴明、スルーホールメツキ、レ
ジスト形成、エツチングを施すことにより配線パ
ターンの形成を行なつた後、 本体１に200μｍ厚さに形成した感光性レジス
トを、前記導体の各外部接点端子３に対応する部
分が露出するように露光、現像するか、もしく
は、200μｍ厚みの片面接着剤付フイルムの一部
を各外部接点端子３の大きさに打抜き、その各開
口を各外部接点端子３部に位置合わせし、当該片
面接着剤付フイルムを本体１に加圧接着して、 これらの感光性レジストもしくは片面接着剤付
フイルムをメツキマスクとして、各外部接点端子
３に無電解または電解メツキによる銅またはニツ
ケルメツキを厚付けすることにより、各外部接点
端子３を均等に厚くしたICカード用プリント配
線板２の製造方法。[Claims] 1. A printed wiring board 2 for an IC card built into or attached to an IC card such as an identification card equipped with an IC chip, in which the conductor of each external contact terminal 3 is connected to another wiring part. 100~200μ from the thickness of conductor 4
In a method for manufacturing a printed wiring board 2 for an IC card having a thickness of 1.5 m, a wiring pattern is formed by drilling holes, through-hole plating, resist formation, and etching on the main body 1 for configuring the printed wiring board 2 for an IC card. After forming, a photosensitive resist formed to a thickness of 200 μm on the main body 1 is exposed and developed so that the portion corresponding to each external contact terminal 3 of the conductor is exposed, or a photoresist with a thickness of 200 μm is formed. A part of the single-sided adhesive-coated film is punched out to the size of each external contact terminal 3, each opening thereof is aligned with each external contact terminal 3, and the single-sided adhesive-coated film is bonded to the main body 1 under pressure. By using these photosensitive resists or films with one-sided adhesive as a plating mask, each external contact terminal 3 is coated with thick copper or nickel plating by electroless or electrolytic plating, thereby creating an IC card in which each external contact terminal 3 has an even thickness. A method for manufacturing a printed wiring board 2 for use in a computer.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60159192A JPS6218787A (en) | 1985-07-17 | 1985-07-17 | Printed wiring board for ic card |
| PCT/JP1986/000356 WO1987000486A1 (en) | 1985-07-17 | 1986-07-14 | Printed wiring board for ic cards |
| DE86904376T DE3689147T2 (en) | 1985-07-17 | 1986-07-14 | A method of manufacturing a printed circuit board for semiconductor circuits. |
| AT86904376T ATE95468T1 (en) | 1985-07-17 | 1986-07-14 | A METHOD OF MAKING A PRINTED CIRCUIT BOARD FOR SEMICONDUCTOR CIRCUITS. |
| EP86904376A EP0231384B1 (en) | 1985-07-17 | 1986-07-14 | A method for preparing a printed wiring board for installation in an ic card |
| US07/707,627 US5203078A (en) | 1985-07-17 | 1991-05-30 | Printed wiring board for IC cards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60159192A JPS6218787A (en) | 1985-07-17 | 1985-07-17 | Printed wiring board for ic card |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3215487A Division JPH06103781B2 (en) | 1991-08-27 | 1991-08-27 | Method for manufacturing printed wiring board for IC card |
| JP3215486A Division JPH0752785B1 (en) | 1991-08-27 | 1991-08-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6218787A JPS6218787A (en) | 1987-01-27 |
| JPH0582078B2 true JPH0582078B2 (en) | 1993-11-17 |
Family
ID=15688324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60159192A Granted JPS6218787A (en) | 1985-07-17 | 1985-07-17 | Printed wiring board for ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6218787A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2645823B2 (en) * | 1986-05-31 | 1997-08-25 | トツパン・ム−ア株式会社 | IC card |
| JPH0752785B1 (en) * | 1991-08-27 | 1995-06-05 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5811198A (en) * | 1981-07-15 | 1983-01-21 | 共同印刷株式会社 | Discriminating card and its manufacture |
| JPS5827287A (en) * | 1981-07-30 | 1983-02-17 | シ−メンス・アクチエンゲゼルシヤフト | Portable card for processing information |
-
1985
- 1985-07-17 JP JP60159192A patent/JPS6218787A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5811198A (en) * | 1981-07-15 | 1983-01-21 | 共同印刷株式会社 | Discriminating card and its manufacture |
| JPS5827287A (en) * | 1981-07-30 | 1983-02-17 | シ−メンス・アクチエンゲゼルシヤフト | Portable card for processing information |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6218787A (en) | 1987-01-27 |
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