JPS5839092A - Method of printing via screen electric plating resist ink - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention is a method for electroplating defined locations of nine circuit conductors formed on an insulating substrate in the production of a uniform distribution board.
This invention relates to a method for screen printing electrometallic resist ink.

When manufacturing a printed circuit board, circuit conductors are formed on an insulating substrate, and gold, nickel, etc. are electroplated on the circuit conductor connectors, or the terminals in the pattern where circuit elements or surface bonding is to be performed.ゐ〇 Perform electroplating #h Do not form plating or electroplating n, Electroplating resist on other areas) K Is plating performed after screen printing, and the underlying surface is a factor to improve the plating resistance of resist ink. Of course, the processing conditions affect the process, and the thickness of the resist ink is also a very important factor.To improve plating resistance, the thickness of the resist ink should be as thin as possible.

However, if the resist ink thickness (this will change the printability and the resist ink storage increases), in the i% tight pattern, the resist ink will be cut, replaced, plate separation, or the pad or bleed will occur. There are drawbacks such as high-density thigh pattern or 1! disappears when printing.So υ hole electroplating is performed. The above υ problem can be solved by
As shown in Fig. 2, the electric plating resist 41 is made thicker at the boundary between the circuit conductor 2υ electroplated 5 formed on the board 1 and the other υ parts than the other υ parts. Screen printing page 4 combination Figure 3 ct
J! Screen 6 with screen frame 511 on the outer periphery of the sea urchin
A screen mask 7r is formed in the area where no resist ink is printed, and then a squeegee 8 is used to press the resist ink 9 onto the printing board 10 while pressing it onto the printing board 10 to print the resist ink on the printing board 10. I'm doing it @ Konoichi 1
11. Conventionally, since the thickness of the screen mask was constant, the thickness of the resist ink υ was also constant υ. A printing plate with a screen mask formed on the areas where there is no ink or printing, and a double stamp with a squeegee
In the screen printing method of resist ink, in which the resist ink is applied while pressing it against the h board, a screen mask is required, and the 6th end is thickened at the 90th part. Print layout as shown in Figure 4
Resist ink tJ! applied to 1ii board. It is necessary to form J-
The screen mask is partially thickened.

The thickness of the screen mask (n) is 9. Part 11 has a larger distance between the screen and the printed wiring board (substrate) than other parts, so it is conveniently applied to the area 11 as shown in Figure 5. , the thickness of the mesh resist 4 is larger than the thickness of the mesh resist on the other υ parts.Need for a screen mask n, To partially thicken the edges, apply emulsion t You can do whatever you want.

Emulsion is generally used as a screen mask, and the thickness is usually about 10 to 15 μm in the 0 part.
The storm is about 0 μm.

Example 1 Apply a photosensitive solution to a 50-meter JL 0-ton plate (emulsion thickness 10μ), dry it, develop it, dry it, put a printing plate on top, and apply 20 mm width and α 1 mm QJ paper tape to the partially thickened area. Paste.

When printed using the epoxy resin ink (manufactured by Taiyo Ink Co., Ltd., trade name S-222) using the t-paper method using a hard plate and using the υ method with a printing page of 4° or more, the ink in the normal part was υ 15.
The border area where the μ paper tag is pasted is 35μ, and after 1970, the ink cL)l11 cloth and the plug were plated with nickel and gold.

There was no ink peeling due to plating on the 55μ boundary area where the paper tape was pasted.Metsukiresist was printed on the printing pattern IIM#L using the silk screen method of the present invention as explained above, and the plating resistance was confirmed. It is possible to improve the resistance to printing without impairing the printability of the resist ink.

[Brief explanation of the drawing]

Fig. 1 is a plan view of a printed laminate manufactured using the present invention, Fig. 2 is an enlarged cross-sectional view taken along the line A-A in Fig. 1, and Fig. 3 is a cross-section showing a conventional screen printing method. 4 is a sectional view showing the screen printing method of the present invention, and FIG. 5 is a printed wiring board υ
6/b in cross section. Code ctJ explanation 1 Insulating substrate 2 Circuit conductor 3 Electroplating 4 Electroplating resist 5
Screen frame 6 Screen 7 Screen mask 8 Squeegee-9 Resist ink 10
Printed substrate 11 Thickness (t172: resist ink Fig. 4

Claims (1)

[Claims] 1. Print with electric printing resist ink on the screen, form a screen mask on the areas that are not, and then print on the printing plate.
Double stamp J with a squeegee! In the screen printing method of electro-metal resist ink, in which the electro-metal resist ink is moved while being pressed against the ll1a board, a screen mask 0 is required, 11, 6 the edge part is partially thickened (t features) Denki Resist Ink V screen printing method◎