JPS5832270Y2 - 電界効果型トランジスタ - Google Patents

電界効果型トランジスタ

Info

Publication number
JPS5832270Y2
JPS5832270Y2 JP1976175112U JP17511276U JPS5832270Y2 JP S5832270 Y2 JPS5832270 Y2 JP S5832270Y2 JP 1976175112 U JP1976175112 U JP 1976175112U JP 17511276 U JP17511276 U JP 17511276U JP S5832270 Y2 JPS5832270 Y2 JP S5832270Y2
Authority
JP
Japan
Prior art keywords
electrode
chip
ground
electrodes
ground electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1976175112U
Other languages
English (en)
Japanese (ja)
Other versions
JPS53106674U (enExample
Inventor
俊昭 斉藤
清文 太田
裕 平野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1976175112U priority Critical patent/JPS5832270Y2/ja
Publication of JPS53106674U publication Critical patent/JPS53106674U/ja
Application granted granted Critical
Publication of JPS5832270Y2 publication Critical patent/JPS5832270Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Junction Field-Effect Transistors (AREA)
JP1976175112U 1976-12-28 1976-12-28 電界効果型トランジスタ Expired JPS5832270Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976175112U JPS5832270Y2 (ja) 1976-12-28 1976-12-28 電界効果型トランジスタ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976175112U JPS5832270Y2 (ja) 1976-12-28 1976-12-28 電界効果型トランジスタ

Publications (2)

Publication Number Publication Date
JPS53106674U JPS53106674U (enExample) 1978-08-26
JPS5832270Y2 true JPS5832270Y2 (ja) 1983-07-18

Family

ID=29182364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976175112U Expired JPS5832270Y2 (ja) 1976-12-28 1976-12-28 電界効果型トランジスタ

Country Status (1)

Country Link
JP (1) JPS5832270Y2 (enExample)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5167064A (enExample) * 1974-12-09 1976-06-10 Nippon Electric Co

Also Published As

Publication number Publication date
JPS53106674U (enExample) 1978-08-26

Similar Documents

Publication Publication Date Title
JP3240292B2 (ja) 半導体パッケージ
US8294208B2 (en) Semiconductor device having a gate contact on one surface electrically connected to a gate bus on an opposing surface
JPH09321175A (ja) マイクロ波回路及びチップ
JPH07307416A (ja) 半導体チップの実装方法及び半導体デバイス
JPS6135714B2 (enExample)
JP3674780B2 (ja) 高周波半導体装置
US11810835B2 (en) Intelligent power module packaging structure
JPH0945692A (ja) 縦型構造トランジスタ及びその製造方法、並びに半導体装置
JP2839795B2 (ja) 半導体装置
US20180096921A1 (en) Package structures
US11942401B2 (en) Half-bridge semiconductor device
US5683919A (en) Transistor and circuit incorporating same
JPS5832270Y2 (ja) 電界効果型トランジスタ
CN114141723A (zh) 封装结构
JP2574510B2 (ja) 高周波半導体装置
JPH0563136A (ja) 混成集積回路装置
JP2976634B2 (ja) 半導体集積回路
JPS6241433B2 (enExample)
JP3268064B2 (ja) 半導体装置
JPH10321762A (ja) 半導体装置
JP2507475B2 (ja) フィルムキャリアを用いた半導体集積回路装置
JPS6112680Y2 (enExample)
JP2880817B2 (ja) 半導体集積回路装置
JPH0513539B2 (enExample)
JP2701348B2 (ja) 半導体装置