JPS583225A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法Info
- Publication number
- JPS583225A JPS583225A JP10108881A JP10108881A JPS583225A JP S583225 A JPS583225 A JP S583225A JP 10108881 A JP10108881 A JP 10108881A JP 10108881 A JP10108881 A JP 10108881A JP S583225 A JPS583225 A JP S583225A
- Authority
- JP
- Japan
- Prior art keywords
- diffusion
- film
- glass
- silicon
- impurities
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Formation Of Insulating Films (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10108881A JPS583225A (ja) | 1981-06-29 | 1981-06-29 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10108881A JPS583225A (ja) | 1981-06-29 | 1981-06-29 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS583225A true JPS583225A (ja) | 1983-01-10 |
| JPS6325700B2 JPS6325700B2 (enrdf_load_stackoverflow) | 1988-05-26 |
Family
ID=14291335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10108881A Granted JPS583225A (ja) | 1981-06-29 | 1981-06-29 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS583225A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02177535A (ja) * | 1988-12-28 | 1990-07-10 | Matsushita Electron Corp | 半導体装置の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5512709A (en) * | 1978-07-12 | 1980-01-29 | Toshiba Corp | Manufactiring method of semiconductor device |
-
1981
- 1981-06-29 JP JP10108881A patent/JPS583225A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5512709A (en) * | 1978-07-12 | 1980-01-29 | Toshiba Corp | Manufactiring method of semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02177535A (ja) * | 1988-12-28 | 1990-07-10 | Matsushita Electron Corp | 半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6325700B2 (enrdf_load_stackoverflow) | 1988-05-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS58100441A (ja) | 半導体装置の製造方法 | |
| JPH0472763A (ja) | 半導体装置およびその製造方法 | |
| JPS583225A (ja) | 半導体装置の製造方法 | |
| JPS58138035A (ja) | 半導体装置及びその製造方法 | |
| JPS61123152A (ja) | 半導体デバイスの分離方法 | |
| JPS63127531A (ja) | 半導体装置の製造方法 | |
| JPH0468770B2 (enrdf_load_stackoverflow) | ||
| JPS6362326A (ja) | 半導体装置の製造方法 | |
| JPH0666385B2 (ja) | 半導体装置の製造方法 | |
| JPH079930B2 (ja) | 半導体装置の製造方法 | |
| JPS61216329A (ja) | 半導体装置の製造方法 | |
| JPH07193204A (ja) | 半導体基板の製造方法 | |
| JPS60128635A (ja) | 素子分離領域の形成方法 | |
| JPS6116530A (ja) | 半導体装置の製造方法 | |
| JPH0427703B2 (enrdf_load_stackoverflow) | ||
| JPS58125834A (ja) | 半導体装置の製造方法 | |
| KR930008845B1 (ko) | 반도체소자의 소자 격리방법 | |
| JPS59104140A (ja) | 半導体装置の製造方法 | |
| JPH043661B2 (enrdf_load_stackoverflow) | ||
| JP2685401B2 (ja) | 酸化ケイ素単離領域の形成方法 | |
| JPS61241941A (ja) | 半導体装置の製造方法 | |
| JPS604236A (ja) | 半導体装置の製造方法 | |
| JPH02265238A (ja) | シリコン基板にアルミニウム選択拡散層を形成する方法 | |
| JPS6132441A (ja) | 誘電体分離領域の形成方法 | |
| JPS5810835A (ja) | 半導体装置の製造方法 |