JPS5830148A - 集積回路装置用リ−ドピンの製造方法 - Google Patents

集積回路装置用リ−ドピンの製造方法

Info

Publication number
JPS5830148A
JPS5830148A JP12841481A JP12841481A JPS5830148A JP S5830148 A JPS5830148 A JP S5830148A JP 12841481 A JP12841481 A JP 12841481A JP 12841481 A JP12841481 A JP 12841481A JP S5830148 A JPS5830148 A JP S5830148A
Authority
JP
Japan
Prior art keywords
head
diameter
pin
lead pin
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12841481A
Other languages
English (en)
Japanese (ja)
Other versions
JPS647505B2 (enExample
Inventor
Katsuyuki Takarasawa
宝沢　勝幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP12841481A priority Critical patent/JPS5830148A/ja
Publication of JPS5830148A publication Critical patent/JPS5830148A/ja
Publication of JPS647505B2 publication Critical patent/JPS647505B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4885—Wire-like parts or pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP12841481A 1981-08-17 1981-08-17 集積回路装置用リ−ドピンの製造方法 Granted JPS5830148A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12841481A JPS5830148A (ja) 1981-08-17 1981-08-17 集積回路装置用リ−ドピンの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12841481A JPS5830148A (ja) 1981-08-17 1981-08-17 集積回路装置用リ−ドピンの製造方法

Publications (2)

Publication Number Publication Date
JPS5830148A true JPS5830148A (ja) 1983-02-22
JPS647505B2 JPS647505B2 (enExample) 1989-02-09

Family

ID=14984170

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12841481A Granted JPS5830148A (ja) 1981-08-17 1981-08-17 集積回路装置用リ−ドピンの製造方法

Country Status (1)

Country Link
JP (1) JPS5830148A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990064755A (ko) * 1999-05-07 1999-08-05 홍성결 은이 부착된 헤딩 리드 핀의 제조방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990064755A (ko) * 1999-05-07 1999-08-05 홍성결 은이 부착된 헤딩 리드 핀의 제조방법

Also Published As

Publication number Publication date
JPS647505B2 (enExample) 1989-02-09

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