JPS5827332A - リードフレームを用いた半導体装置の製造方法 - Google Patents

リードフレームを用いた半導体装置の製造方法

Info

Publication number
JPS5827332A
JPS5827332A JP12546081A JP12546081A JPS5827332A JP S5827332 A JPS5827332 A JP S5827332A JP 12546081 A JP12546081 A JP 12546081A JP 12546081 A JP12546081 A JP 12546081A JP S5827332 A JPS5827332 A JP S5827332A
Authority
JP
Japan
Prior art keywords
lead
semiconductor chip
bin
strip
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12546081A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0131687B2 (cs
Inventor
Yoshio Shimizu
義男 清水
Shigeki Takeo
竹尾　重樹
Iwao Yamazaki
巌 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP12546081A priority Critical patent/JPS5827332A/ja
Publication of JPS5827332A publication Critical patent/JPS5827332A/ja
Publication of JPH0131687B2 publication Critical patent/JPH0131687B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP12546081A 1981-08-11 1981-08-11 リードフレームを用いた半導体装置の製造方法 Granted JPS5827332A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12546081A JPS5827332A (ja) 1981-08-11 1981-08-11 リードフレームを用いた半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12546081A JPS5827332A (ja) 1981-08-11 1981-08-11 リードフレームを用いた半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5827332A true JPS5827332A (ja) 1983-02-18
JPH0131687B2 JPH0131687B2 (cs) 1989-06-27

Family

ID=14910636

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12546081A Granted JPS5827332A (ja) 1981-08-11 1981-08-11 リードフレームを用いた半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5827332A (cs)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991004575A1 (fr) * 1989-09-12 1991-04-04 Kabushiki Kaisha Toshiba Cadre de montage pour dispositif a semi-conducteurs et dispositif a semi-conducteurs utilisant ce cadre de montage
US5343072A (en) * 1990-08-20 1994-08-30 Rohm Co., Ltd. Method and leadframe for making electronic components

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5559749A (en) * 1978-10-27 1980-05-06 Hitachi Ltd Lead frame

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5559749A (en) * 1978-10-27 1980-05-06 Hitachi Ltd Lead frame

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991004575A1 (fr) * 1989-09-12 1991-04-04 Kabushiki Kaisha Toshiba Cadre de montage pour dispositif a semi-conducteurs et dispositif a semi-conducteurs utilisant ce cadre de montage
US5200806A (en) * 1989-09-12 1993-04-06 Kabushiki Kaisha Toshiba Lead frame having a plurality of island regions and a suspension pin
US5343072A (en) * 1990-08-20 1994-08-30 Rohm Co., Ltd. Method and leadframe for making electronic components

Also Published As

Publication number Publication date
JPH0131687B2 (cs) 1989-06-27

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