JPS5825894A - 半導体装置およびこれに用いるはんだ - Google Patents

半導体装置およびこれに用いるはんだ

Info

Publication number
JPS5825894A
JPS5825894A JP57132297A JP13229782A JPS5825894A JP S5825894 A JPS5825894 A JP S5825894A JP 57132297 A JP57132297 A JP 57132297A JP 13229782 A JP13229782 A JP 13229782A JP S5825894 A JPS5825894 A JP S5825894A
Authority
JP
Japan
Prior art keywords
solder
indium
silver
semiconductor device
content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57132297A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0133278B2 (enExample
Inventor
ネイル・アンドリユウ・デイビ−ズ
エドワ−ド・ト−マス・エルフエツド・ヒユ−ゲス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of JPS5825894A publication Critical patent/JPS5825894A/ja
Publication of JPH0133278B2 publication Critical patent/JPH0133278B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/24—
    • H10W72/30—
    • H10W72/073—
    • H10W72/07336—
    • H10W72/352—

Landscapes

  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP57132297A 1981-07-31 1982-07-30 半導体装置およびこれに用いるはんだ Granted JPS5825894A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8123478A GB2102833B (en) 1981-07-31 1981-07-31 Lead-indium-silver alloy for use in semiconductor devices
GB8123478 1981-07-31

Publications (2)

Publication Number Publication Date
JPS5825894A true JPS5825894A (ja) 1983-02-16
JPH0133278B2 JPH0133278B2 (enExample) 1989-07-12

Family

ID=10523597

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57132297A Granted JPS5825894A (ja) 1981-07-31 1982-07-30 半導体装置およびこれに用いるはんだ

Country Status (5)

Country Link
US (1) US4504849A (enExample)
EP (1) EP0071314B1 (enExample)
JP (1) JPS5825894A (enExample)
DE (1) DE3271833D1 (enExample)
GB (1) GB2102833B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01259547A (ja) * 1988-04-08 1989-10-17 Sumitomo Electric Ind Ltd 半導体装置用部品

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU591231B2 (en) * 1986-02-18 1989-11-30 Parker Chemical Company Aluminum cleaning process
GB2201545B (en) * 1987-01-30 1991-09-11 Tanaka Electronics Ind Method for connecting semiconductor material
JPH02310330A (ja) * 1989-05-25 1990-12-26 Taiho Kogyo Co Ltd すべり軸受用オーバレイ合金
US5027189A (en) * 1990-01-10 1991-06-25 Hughes Aircraft Company Integrated circuit solder die-attach design and method
JPH09321187A (ja) * 1996-05-27 1997-12-12 Mitsubishi Electric Corp 混成集積回路の製造方法およびその構造
US5982038A (en) * 1997-05-01 1999-11-09 International Business Machines Corporation Cast metal seal for semiconductor substrates
US20070228112A1 (en) * 2006-03-31 2007-10-04 Wei Shi Method and arrangement for forming a microelectronic package
US7649730B2 (en) * 2007-03-20 2010-01-19 Avx Corporation Wet electrolytic capacitor containing a plurality of thin powder-formed anodes

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1149606A (en) * 1967-02-27 1969-04-23 Motorola Inc Mounting for a semiconductor wafer which is resistant to fatigue caused by thermal stresses
US3601667A (en) * 1968-12-09 1971-08-24 Gen Electric A semiconductor device with a heat sink having a foot portion
US3706915A (en) * 1970-03-09 1972-12-19 Gen Electric Semiconductor device with low impedance bond
US3878442A (en) * 1970-05-26 1975-04-15 Harshad J Bhatt Electrical conductor having a high resistance to electromigration
US3771211A (en) * 1970-09-18 1973-11-13 Ppg Industries Inc Method of fabricating transparent electroconductive window
US3820152A (en) * 1973-04-24 1974-06-25 Du Pont Circuit package with fugitive shorting bar
US3913120A (en) * 1973-12-28 1975-10-14 Ibm Thin film resistors and contacts for circuitry
US3986255A (en) * 1974-11-29 1976-10-19 Itek Corporation Process for electrically interconnecting chips with substrates employing gold alloy bumps and magnetic materials therein
JPS5578536A (en) * 1978-12-08 1980-06-13 Mitsubishi Electric Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01259547A (ja) * 1988-04-08 1989-10-17 Sumitomo Electric Ind Ltd 半導体装置用部品

Also Published As

Publication number Publication date
DE3271833D1 (en) 1986-07-31
US4504849A (en) 1985-03-12
GB2102833B (en) 1984-08-01
EP0071314A2 (en) 1983-02-09
JPH0133278B2 (enExample) 1989-07-12
GB2102833A (en) 1983-02-09
EP0071314A3 (en) 1984-04-25
EP0071314B1 (en) 1986-06-25

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