DE3271833D1 - Semiconductor devices and a solder for use in such devices - Google Patents

Semiconductor devices and a solder for use in such devices

Info

Publication number
DE3271833D1
DE3271833D1 DE8282200939T DE3271833T DE3271833D1 DE 3271833 D1 DE3271833 D1 DE 3271833D1 DE 8282200939 T DE8282200939 T DE 8282200939T DE 3271833 T DE3271833 T DE 3271833T DE 3271833 D1 DE3271833 D1 DE 3271833D1
Authority
DE
Germany
Prior art keywords
devices
solder
semiconductor devices
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282200939T
Other languages
German (de)
English (en)
Inventor
Neil Andrew Davies
Edward Thomas Elfed Hughes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of DE3271833D1 publication Critical patent/DE3271833D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H10W70/24—Conductive package substrates serving as an interconnection, e.g. metal plates characterised by materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
DE8282200939T 1981-07-31 1982-07-22 Semiconductor devices and a solder for use in such devices Expired DE3271833D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8123478A GB2102833B (en) 1981-07-31 1981-07-31 Lead-indium-silver alloy for use in semiconductor devices

Publications (1)

Publication Number Publication Date
DE3271833D1 true DE3271833D1 (en) 1986-07-31

Family

ID=10523597

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282200939T Expired DE3271833D1 (en) 1981-07-31 1982-07-22 Semiconductor devices and a solder for use in such devices

Country Status (5)

Country Link
US (1) US4504849A (enExample)
EP (1) EP0071314B1 (enExample)
JP (1) JPS5825894A (enExample)
DE (1) DE3271833D1 (enExample)
GB (1) GB2102833B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU591231B2 (en) * 1986-02-18 1989-11-30 Parker Chemical Company Aluminum cleaning process
GB2201545B (en) * 1987-01-30 1991-09-11 Tanaka Electronics Ind Method for connecting semiconductor material
JPH01259547A (ja) * 1988-04-08 1989-10-17 Sumitomo Electric Ind Ltd 半導体装置用部品
JPH02310330A (ja) * 1989-05-25 1990-12-26 Taiho Kogyo Co Ltd すべり軸受用オーバレイ合金
US5027189A (en) * 1990-01-10 1991-06-25 Hughes Aircraft Company Integrated circuit solder die-attach design and method
JPH09321187A (ja) * 1996-05-27 1997-12-12 Mitsubishi Electric Corp 混成集積回路の製造方法およびその構造
US5982038A (en) * 1997-05-01 1999-11-09 International Business Machines Corporation Cast metal seal for semiconductor substrates
US20070228112A1 (en) * 2006-03-31 2007-10-04 Wei Shi Method and arrangement for forming a microelectronic package
US7649730B2 (en) * 2007-03-20 2010-01-19 Avx Corporation Wet electrolytic capacitor containing a plurality of thin powder-formed anodes

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1149606A (en) * 1967-02-27 1969-04-23 Motorola Inc Mounting for a semiconductor wafer which is resistant to fatigue caused by thermal stresses
US3601667A (en) * 1968-12-09 1971-08-24 Gen Electric A semiconductor device with a heat sink having a foot portion
US3706915A (en) * 1970-03-09 1972-12-19 Gen Electric Semiconductor device with low impedance bond
US3878442A (en) * 1970-05-26 1975-04-15 Harshad J Bhatt Electrical conductor having a high resistance to electromigration
US3771211A (en) * 1970-09-18 1973-11-13 Ppg Industries Inc Method of fabricating transparent electroconductive window
US3820152A (en) * 1973-04-24 1974-06-25 Du Pont Circuit package with fugitive shorting bar
US3913120A (en) * 1973-12-28 1975-10-14 Ibm Thin film resistors and contacts for circuitry
US3986255A (en) * 1974-11-29 1976-10-19 Itek Corporation Process for electrically interconnecting chips with substrates employing gold alloy bumps and magnetic materials therein
JPS5578536A (en) * 1978-12-08 1980-06-13 Mitsubishi Electric Corp Semiconductor device

Also Published As

Publication number Publication date
US4504849A (en) 1985-03-12
GB2102833B (en) 1984-08-01
EP0071314B1 (en) 1986-06-25
JPS5825894A (ja) 1983-02-16
JPH0133278B2 (enExample) 1989-07-12
EP0071314A2 (en) 1983-02-09
GB2102833A (en) 1983-02-09
EP0071314A3 (en) 1984-04-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PHILIPS ELECTRONICS N.V., EINDHOVEN, NL

8339 Ceased/non-payment of the annual fee