GB8428394D0 - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
GB8428394D0
GB8428394D0 GB848428394A GB8428394A GB8428394D0 GB 8428394 D0 GB8428394 D0 GB 8428394D0 GB 848428394 A GB848428394 A GB 848428394A GB 8428394 A GB8428394 A GB 8428394A GB 8428394 D0 GB8428394 D0 GB 8428394D0
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United Kingdom
Prior art keywords
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB848428394A
Other versions
GB2149574A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of GB8428394D0 publication Critical patent/GB8428394D0/en
Publication of GB2149574A publication Critical patent/GB2149574A/en
Withdrawn legal-status Critical Current

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    • H01L24/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
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    • H01L23/53204Conductive materials
    • H01L23/53209Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53214Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being aluminium
    • H01L23/53219Aluminium alloys
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    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01078Platinum [Pt]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/014Solder alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
GB08428394A 1983-11-11 1984-11-09 Semiconductor device and process of manufacture thereof Withdrawn GB2149574A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58210811A JPS60103655A (en) 1983-11-11 1983-11-11 Semiconductor device and manufacture thereof

Publications (2)

Publication Number Publication Date
GB8428394D0 true GB8428394D0 (en) 1984-12-19
GB2149574A GB2149574A (en) 1985-06-12

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GB08428394A Withdrawn GB2149574A (en) 1983-11-11 1984-11-09 Semiconductor device and process of manufacture thereof

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JP (1) JPS60103655A (en)
KR (1) KR850004175A (en)
GB (1) GB2149574A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02105418A (en) * 1988-10-14 1990-04-18 Mitsubishi Electric Corp Resin-sealed type semiconductor device
JP2806538B2 (en) * 1988-12-09 1998-09-30 日本電気アイシーマイコンシステム株式会社 Integrated circuit device
FI95535C (en) * 1991-12-09 1996-02-26 Polar Electro Oy Device for measuring heartbeat
JP7305587B2 (en) * 2020-03-17 2023-07-10 株式会社東芝 Semiconductor equipment and inspection equipment

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GB2149574A (en) 1985-06-12
KR850004175A (en) 1985-07-01
JPS60103655A (en) 1985-06-07

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