JPS58222527A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法Info
- Publication number
- JPS58222527A JPS58222527A JP10382782A JP10382782A JPS58222527A JP S58222527 A JPS58222527 A JP S58222527A JP 10382782 A JP10382782 A JP 10382782A JP 10382782 A JP10382782 A JP 10382782A JP S58222527 A JPS58222527 A JP S58222527A
- Authority
- JP
- Japan
- Prior art keywords
- section
- polycrystalline silicon
- silicon film
- impurity concentration
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10382782A JPS58222527A (ja) | 1982-06-18 | 1982-06-18 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10382782A JPS58222527A (ja) | 1982-06-18 | 1982-06-18 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58222527A true JPS58222527A (ja) | 1983-12-24 |
| JPH0416939B2 JPH0416939B2 (enrdf_load_stackoverflow) | 1992-03-25 |
Family
ID=14364244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10382782A Granted JPS58222527A (ja) | 1982-06-18 | 1982-06-18 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58222527A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1279927A3 (fr) * | 2001-07-03 | 2016-07-20 | Commissariat à l'Énergie Atomique et aux Énergies Alternatives | Procédés de fabrication d'un dispositif piézorésistif |
-
1982
- 1982-06-18 JP JP10382782A patent/JPS58222527A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1279927A3 (fr) * | 2001-07-03 | 2016-07-20 | Commissariat à l'Énergie Atomique et aux Énergies Alternatives | Procédés de fabrication d'un dispositif piézorésistif |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0416939B2 (enrdf_load_stackoverflow) | 1992-03-25 |
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