JPS58220441A - ダイ詰め換え装置 - Google Patents

ダイ詰め換え装置

Info

Publication number
JPS58220441A
JPS58220441A JP10434982A JP10434982A JPS58220441A JP S58220441 A JPS58220441 A JP S58220441A JP 10434982 A JP10434982 A JP 10434982A JP 10434982 A JP10434982 A JP 10434982A JP S58220441 A JPS58220441 A JP S58220441A
Authority
JP
Japan
Prior art keywords
tray
die
conveyor
trays
wafer ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10434982A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6258148B2 (enExample
Inventor
Noboru Fujino
昇 藤野
Seiichi Chiba
誠一 千葉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP10434982A priority Critical patent/JPS58220441A/ja
Publication of JPS58220441A publication Critical patent/JPS58220441A/ja
Publication of JPS6258148B2 publication Critical patent/JPS6258148B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Die Bonding (AREA)
JP10434982A 1982-06-17 1982-06-17 ダイ詰め換え装置 Granted JPS58220441A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10434982A JPS58220441A (ja) 1982-06-17 1982-06-17 ダイ詰め換え装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10434982A JPS58220441A (ja) 1982-06-17 1982-06-17 ダイ詰め換え装置

Publications (2)

Publication Number Publication Date
JPS58220441A true JPS58220441A (ja) 1983-12-22
JPS6258148B2 JPS6258148B2 (enExample) 1987-12-04

Family

ID=14378404

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10434982A Granted JPS58220441A (ja) 1982-06-17 1982-06-17 ダイ詰め換え装置

Country Status (1)

Country Link
JP (1) JPS58220441A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0194628A (ja) * 1987-10-06 1989-04-13 Rohm Co Ltd チップボンディング装置
JPH0328726U (enExample) * 1989-07-28 1991-03-22

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0194628A (ja) * 1987-10-06 1989-04-13 Rohm Co Ltd チップボンディング装置
JPH0328726U (enExample) * 1989-07-28 1991-03-22

Also Published As

Publication number Publication date
JPS6258148B2 (enExample) 1987-12-04

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