JPS58218132A - 半導体ウエ−ハ特性検査処理方法 - Google Patents
半導体ウエ−ハ特性検査処理方法Info
- Publication number
- JPS58218132A JPS58218132A JP8695682A JP8695682A JPS58218132A JP S58218132 A JPS58218132 A JP S58218132A JP 8695682 A JP8695682 A JP 8695682A JP 8695682 A JP8695682 A JP 8695682A JP S58218132 A JPS58218132 A JP S58218132A
- Authority
- JP
- Japan
- Prior art keywords
- memory
- inspection
- semiconductor
- marking
- recording medium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 title claims abstract description 15
- 230000002950 deficient Effects 0.000 claims abstract description 16
- 230000006870 function Effects 0.000 claims abstract description 8
- 230000006386 memory function Effects 0.000 claims abstract description 6
- 238000012360 testing method Methods 0.000 claims description 11
- 230000007547 defect Effects 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 abstract description 28
- 238000007689 inspection Methods 0.000 abstract description 27
- 238000013507 mapping Methods 0.000 abstract description 3
- 238000005070 sampling Methods 0.000 abstract 1
- 238000012805 post-processing Methods 0.000 description 3
- 241000219793 Trifolium Species 0.000 description 2
- 239000003550 marker Substances 0.000 description 2
- 239000011295 pitch Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 235000017788 Cydonia oblonga Nutrition 0.000 description 1
- 238000004501 airglow Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 235000009508 confectionery Nutrition 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004242 micellar liquid chromatography Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8695682A JPS58218132A (ja) | 1982-05-21 | 1982-05-21 | 半導体ウエ−ハ特性検査処理方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8695682A JPS58218132A (ja) | 1982-05-21 | 1982-05-21 | 半導体ウエ−ハ特性検査処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58218132A true JPS58218132A (ja) | 1983-12-19 |
| JPH0312463B2 JPH0312463B2 (cg-RX-API-DMAC7.html) | 1991-02-20 |
Family
ID=13901319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8695682A Granted JPS58218132A (ja) | 1982-05-21 | 1982-05-21 | 半導体ウエ−ハ特性検査処理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58218132A (cg-RX-API-DMAC7.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60211956A (ja) * | 1984-04-06 | 1985-10-24 | Tokyo Seimitsu Co Ltd | プロ−ビングマシン |
| JPS62293124A (ja) * | 1986-06-12 | 1987-12-19 | Matsushita Electric Ind Co Ltd | プリント基板の検査装置 |
-
1982
- 1982-05-21 JP JP8695682A patent/JPS58218132A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60211956A (ja) * | 1984-04-06 | 1985-10-24 | Tokyo Seimitsu Co Ltd | プロ−ビングマシン |
| JPS62293124A (ja) * | 1986-06-12 | 1987-12-19 | Matsushita Electric Ind Co Ltd | プリント基板の検査装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0312463B2 (cg-RX-API-DMAC7.html) | 1991-02-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2001505299A (ja) | 半導体ウェーハーの拡大光学検査による自動選別器/精査器 | |
| JPWO2000057458A1 (ja) | 半導体装置の製造方法及びそれを使用して製造された半導体装置 | |
| DE112005000548T5 (de) | Verfahren zur Unterstützung der Maskenherstellung, Verfahren zur Bereitstellung von Maskenrohlingen und Verfahren zur Handhabung von Maskenrohlingen | |
| WO2016165828A1 (de) | Verfahren zum prüfen eines elektronischen bauteils | |
| US20060223340A1 (en) | Manufacturing managing method of semiconductor devices and a semiconductor substrate | |
| CN210847220U (zh) | 电路板检测机的工位转盘改良装置 | |
| US9134342B2 (en) | Intergrated apparatus and method for testing of semiconductor components using a turret machine | |
| JPS58218132A (ja) | 半導体ウエ−ハ特性検査処理方法 | |
| JPH02208949A (ja) | 半導体製造装置 | |
| KR20060009533A (ko) | 기판 정렬 방법 및 장치, 이를 이용한 기판의 패턴 검사방법 및 장치 | |
| US7855088B2 (en) | Method for manufacturing integrated circuits by guardbanding die regions | |
| JP2952882B2 (ja) | Icウェハ及びicの良否識別方法 | |
| CN101210932A (zh) | 一种可提高缺陷检验可靠性的方法 | |
| TWI298924B (en) | Method for recognizing dice positions by multiple alignments comparing to a wafer map | |
| JPS59122971A (ja) | プリント基板の自動検査方式 | |
| JPS6399541A (ja) | 半導体ウエハプロ−バ装置 | |
| JPS6184029A (ja) | 半導体検査装置 | |
| JPS5821838A (ja) | ウエハテストシステム | |
| JPS60120519A (ja) | ホトマスクおよび自動欠陥検査装置 | |
| JPS6049643A (ja) | ウエハ検査装置 | |
| JPS5817632A (ja) | Icチツプの選別方法 | |
| JP2622714B2 (ja) | パターン検査装置 | |
| JPH0316781B2 (cg-RX-API-DMAC7.html) | ||
| KR100595139B1 (ko) | 프루브 카드의 아이디 인식 장치 및 그 인식 방법 | |
| JPS6170735A (ja) | 電気測定用アライメントマ−クを有するウエハまたはチツプ |