JPS58215309A - プラスチツク成形用金型温度調節装置 - Google Patents

プラスチツク成形用金型温度調節装置

Info

Publication number
JPS58215309A
JPS58215309A JP9962582A JP9962582A JPS58215309A JP S58215309 A JPS58215309 A JP S58215309A JP 9962582 A JP9962582 A JP 9962582A JP 9962582 A JP9962582 A JP 9962582A JP S58215309 A JPS58215309 A JP S58215309A
Authority
JP
Japan
Prior art keywords
temperature
medium
low
tank
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9962582A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6365001B2 (enrdf_load_stackoverflow
Inventor
Minoru Araki
荒木 稔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KANSAI NETSUKEN KOGYO KK
Original Assignee
KANSAI NETSUKEN KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KANSAI NETSUKEN KOGYO KK filed Critical KANSAI NETSUKEN KOGYO KK
Priority to JP9962582A priority Critical patent/JPS58215309A/ja
Publication of JPS58215309A publication Critical patent/JPS58215309A/ja
Publication of JPS6365001B2 publication Critical patent/JPS6365001B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/007Tempering units for temperature control of moulds or cores, e.g. comprising heat exchangers, controlled valves, temperature-controlled circuits for fluids

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Control Of Temperature (AREA)
JP9962582A 1982-06-09 1982-06-09 プラスチツク成形用金型温度調節装置 Granted JPS58215309A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9962582A JPS58215309A (ja) 1982-06-09 1982-06-09 プラスチツク成形用金型温度調節装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9962582A JPS58215309A (ja) 1982-06-09 1982-06-09 プラスチツク成形用金型温度調節装置

Publications (2)

Publication Number Publication Date
JPS58215309A true JPS58215309A (ja) 1983-12-14
JPS6365001B2 JPS6365001B2 (enrdf_load_stackoverflow) 1988-12-14

Family

ID=14252262

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9962582A Granted JPS58215309A (ja) 1982-06-09 1982-06-09 プラスチツク成形用金型温度調節装置

Country Status (1)

Country Link
JP (1) JPS58215309A (enrdf_load_stackoverflow)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61118705U (enrdf_load_stackoverflow) * 1985-01-12 1986-07-26
JPS63293028A (ja) * 1987-05-27 1988-11-30 Nippon Dennetsu Kk 射出成形金型の温度調節装置
JPH057417U (ja) * 1991-07-11 1993-02-02 サンデン株式会社 金型温度調節装置
JPH0513711U (ja) * 1991-08-02 1993-02-23 サンデン株式会社 金型温度調節装置
JPH0513710U (ja) * 1991-08-02 1993-02-23 サンデン株式会社 金型温度調節装置
US5376317A (en) * 1992-12-08 1994-12-27 Galic Maus Ventures Precision surface-replicating thermoplastic injection molding method and apparatus, using a heating phase and a cooling phase in each molding cycle
US6936206B1 (en) 1999-05-06 2005-08-30 Mitsui Chemicals, Inc. Synthetic resin molding mold, apparatus for and method of adjusting a temperature of the mold
US7261551B2 (en) 1997-10-17 2007-08-28 Advanced Plastics Technologies Luxembourg S.A. Preform molds incorporating high heat conductivity material
EP1772246A3 (en) * 2005-09-22 2007-10-17 Star Seiki Co., Ltd. Mold temperature regulating apparatus
US7303387B2 (en) 2004-06-10 2007-12-04 Advanced Plastics Technologies Luxembourg S.A. System for controlling mold temperatures
US7367795B2 (en) 2002-11-08 2008-05-06 Advanced Plastics Technologies Luxembourg S.A. Injection mold having a wear resistant portion and a high heat transfer portion
US7531226B2 (en) 1999-04-21 2009-05-12 Advanced Plastics Technologies Luxembourg S.A. Multilayer containers and preforms having barrier properties utilizing recycled material
US7588808B2 (en) 2004-04-16 2009-09-15 Advanced Plastics Technologies Luxembourg S.A. Mono and multi-layer articles and injection molding methods of making the same
WO2013082675A1 (en) * 2011-12-09 2013-06-13 Ritemp Pty Ltd Temperature regulation improvements
KR20140089536A (ko) * 2011-11-15 2014-07-15 도쿄엘렉트론가부시키가이샤 온도 제어 시스템, 반도체 제조 장치 및 온도 제어 방법
FR3060433A1 (fr) * 2016-12-21 2018-06-22 A2P Industrie Installation de refroidissement de moules
US10553463B2 (en) 2011-11-15 2020-02-04 Tokyo Electron Limited Temperature control system, semiconductor manufacturing device, and temperature control method
KR102220747B1 (ko) * 2019-12-30 2021-02-26 주식회사 디케이솔루션 복합소재의 성형장치

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61118705U (enrdf_load_stackoverflow) * 1985-01-12 1986-07-26
JPS63293028A (ja) * 1987-05-27 1988-11-30 Nippon Dennetsu Kk 射出成形金型の温度調節装置
JPH057417U (ja) * 1991-07-11 1993-02-02 サンデン株式会社 金型温度調節装置
JPH0513711U (ja) * 1991-08-02 1993-02-23 サンデン株式会社 金型温度調節装置
JPH0513710U (ja) * 1991-08-02 1993-02-23 サンデン株式会社 金型温度調節装置
US5376317A (en) * 1992-12-08 1994-12-27 Galic Maus Ventures Precision surface-replicating thermoplastic injection molding method and apparatus, using a heating phase and a cooling phase in each molding cycle
US7261551B2 (en) 1997-10-17 2007-08-28 Advanced Plastics Technologies Luxembourg S.A. Preform molds incorporating high heat conductivity material
US7531226B2 (en) 1999-04-21 2009-05-12 Advanced Plastics Technologies Luxembourg S.A. Multilayer containers and preforms having barrier properties utilizing recycled material
US6936206B1 (en) 1999-05-06 2005-08-30 Mitsui Chemicals, Inc. Synthetic resin molding mold, apparatus for and method of adjusting a temperature of the mold
US7367795B2 (en) 2002-11-08 2008-05-06 Advanced Plastics Technologies Luxembourg S.A. Injection mold having a wear resistant portion and a high heat transfer portion
US7588808B2 (en) 2004-04-16 2009-09-15 Advanced Plastics Technologies Luxembourg S.A. Mono and multi-layer articles and injection molding methods of making the same
US7303387B2 (en) 2004-06-10 2007-12-04 Advanced Plastics Technologies Luxembourg S.A. System for controlling mold temperatures
US7578668B2 (en) 2004-06-10 2009-08-25 Advanced Plastics Technologies Luxembourg S.A. Mold assembly having a pressure reducing device
EP1772246A3 (en) * 2005-09-22 2007-10-17 Star Seiki Co., Ltd. Mold temperature regulating apparatus
KR20140089536A (ko) * 2011-11-15 2014-07-15 도쿄엘렉트론가부시키가이샤 온도 제어 시스템, 반도체 제조 장치 및 온도 제어 방법
US10553463B2 (en) 2011-11-15 2020-02-04 Tokyo Electron Limited Temperature control system, semiconductor manufacturing device, and temperature control method
WO2013082675A1 (en) * 2011-12-09 2013-06-13 Ritemp Pty Ltd Temperature regulation improvements
US9789632B2 (en) 2011-12-09 2017-10-17 Ritemp Pty Ltd Temperature regulation apparatus and method
FR3060433A1 (fr) * 2016-12-21 2018-06-22 A2P Industrie Installation de refroidissement de moules
KR102220747B1 (ko) * 2019-12-30 2021-02-26 주식회사 디케이솔루션 복합소재의 성형장치

Also Published As

Publication number Publication date
JPS6365001B2 (enrdf_load_stackoverflow) 1988-12-14

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