JPS58215309A - プラスチツク成形用金型温度調節装置 - Google Patents
プラスチツク成形用金型温度調節装置Info
- Publication number
- JPS58215309A JPS58215309A JP9962582A JP9962582A JPS58215309A JP S58215309 A JPS58215309 A JP S58215309A JP 9962582 A JP9962582 A JP 9962582A JP 9962582 A JP9962582 A JP 9962582A JP S58215309 A JPS58215309 A JP S58215309A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- medium
- low
- tank
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010137 moulding (plastic) Methods 0.000 title claims description 7
- 238000001816 cooling Methods 0.000 claims abstract description 45
- 239000007788 liquid Substances 0.000 claims abstract description 13
- 238000001514 detection method Methods 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 3
- 239000002826 coolant Substances 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 25
- 238000000034 method Methods 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 238000012423 maintenance Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000002918 waste heat Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000008235 industrial water Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000004781 supercooling Methods 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/007—Tempering units for temperature control of moulds or cores, e.g. comprising heat exchangers, controlled valves, temperature-controlled circuits for fluids
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Thermal Sciences (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Control Of Temperature (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9962582A JPS58215309A (ja) | 1982-06-09 | 1982-06-09 | プラスチツク成形用金型温度調節装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9962582A JPS58215309A (ja) | 1982-06-09 | 1982-06-09 | プラスチツク成形用金型温度調節装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58215309A true JPS58215309A (ja) | 1983-12-14 |
JPS6365001B2 JPS6365001B2 (enrdf_load_stackoverflow) | 1988-12-14 |
Family
ID=14252262
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9962582A Granted JPS58215309A (ja) | 1982-06-09 | 1982-06-09 | プラスチツク成形用金型温度調節装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58215309A (enrdf_load_stackoverflow) |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61118705U (enrdf_load_stackoverflow) * | 1985-01-12 | 1986-07-26 | ||
JPS63293028A (ja) * | 1987-05-27 | 1988-11-30 | Nippon Dennetsu Kk | 射出成形金型の温度調節装置 |
JPH057417U (ja) * | 1991-07-11 | 1993-02-02 | サンデン株式会社 | 金型温度調節装置 |
JPH0513711U (ja) * | 1991-08-02 | 1993-02-23 | サンデン株式会社 | 金型温度調節装置 |
JPH0513710U (ja) * | 1991-08-02 | 1993-02-23 | サンデン株式会社 | 金型温度調節装置 |
US5376317A (en) * | 1992-12-08 | 1994-12-27 | Galic Maus Ventures | Precision surface-replicating thermoplastic injection molding method and apparatus, using a heating phase and a cooling phase in each molding cycle |
US6936206B1 (en) | 1999-05-06 | 2005-08-30 | Mitsui Chemicals, Inc. | Synthetic resin molding mold, apparatus for and method of adjusting a temperature of the mold |
US7261551B2 (en) | 1997-10-17 | 2007-08-28 | Advanced Plastics Technologies Luxembourg S.A. | Preform molds incorporating high heat conductivity material |
EP1772246A3 (en) * | 2005-09-22 | 2007-10-17 | Star Seiki Co., Ltd. | Mold temperature regulating apparatus |
US7303387B2 (en) | 2004-06-10 | 2007-12-04 | Advanced Plastics Technologies Luxembourg S.A. | System for controlling mold temperatures |
US7367795B2 (en) | 2002-11-08 | 2008-05-06 | Advanced Plastics Technologies Luxembourg S.A. | Injection mold having a wear resistant portion and a high heat transfer portion |
US7531226B2 (en) | 1999-04-21 | 2009-05-12 | Advanced Plastics Technologies Luxembourg S.A. | Multilayer containers and preforms having barrier properties utilizing recycled material |
US7588808B2 (en) | 2004-04-16 | 2009-09-15 | Advanced Plastics Technologies Luxembourg S.A. | Mono and multi-layer articles and injection molding methods of making the same |
WO2013082675A1 (en) * | 2011-12-09 | 2013-06-13 | Ritemp Pty Ltd | Temperature regulation improvements |
KR20140089536A (ko) * | 2011-11-15 | 2014-07-15 | 도쿄엘렉트론가부시키가이샤 | 온도 제어 시스템, 반도체 제조 장치 및 온도 제어 방법 |
FR3060433A1 (fr) * | 2016-12-21 | 2018-06-22 | A2P Industrie | Installation de refroidissement de moules |
US10553463B2 (en) | 2011-11-15 | 2020-02-04 | Tokyo Electron Limited | Temperature control system, semiconductor manufacturing device, and temperature control method |
KR102220747B1 (ko) * | 2019-12-30 | 2021-02-26 | 주식회사 디케이솔루션 | 복합소재의 성형장치 |
-
1982
- 1982-06-09 JP JP9962582A patent/JPS58215309A/ja active Granted
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61118705U (enrdf_load_stackoverflow) * | 1985-01-12 | 1986-07-26 | ||
JPS63293028A (ja) * | 1987-05-27 | 1988-11-30 | Nippon Dennetsu Kk | 射出成形金型の温度調節装置 |
JPH057417U (ja) * | 1991-07-11 | 1993-02-02 | サンデン株式会社 | 金型温度調節装置 |
JPH0513711U (ja) * | 1991-08-02 | 1993-02-23 | サンデン株式会社 | 金型温度調節装置 |
JPH0513710U (ja) * | 1991-08-02 | 1993-02-23 | サンデン株式会社 | 金型温度調節装置 |
US5376317A (en) * | 1992-12-08 | 1994-12-27 | Galic Maus Ventures | Precision surface-replicating thermoplastic injection molding method and apparatus, using a heating phase and a cooling phase in each molding cycle |
US7261551B2 (en) | 1997-10-17 | 2007-08-28 | Advanced Plastics Technologies Luxembourg S.A. | Preform molds incorporating high heat conductivity material |
US7531226B2 (en) | 1999-04-21 | 2009-05-12 | Advanced Plastics Technologies Luxembourg S.A. | Multilayer containers and preforms having barrier properties utilizing recycled material |
US6936206B1 (en) | 1999-05-06 | 2005-08-30 | Mitsui Chemicals, Inc. | Synthetic resin molding mold, apparatus for and method of adjusting a temperature of the mold |
US7367795B2 (en) | 2002-11-08 | 2008-05-06 | Advanced Plastics Technologies Luxembourg S.A. | Injection mold having a wear resistant portion and a high heat transfer portion |
US7588808B2 (en) | 2004-04-16 | 2009-09-15 | Advanced Plastics Technologies Luxembourg S.A. | Mono and multi-layer articles and injection molding methods of making the same |
US7303387B2 (en) | 2004-06-10 | 2007-12-04 | Advanced Plastics Technologies Luxembourg S.A. | System for controlling mold temperatures |
US7578668B2 (en) | 2004-06-10 | 2009-08-25 | Advanced Plastics Technologies Luxembourg S.A. | Mold assembly having a pressure reducing device |
EP1772246A3 (en) * | 2005-09-22 | 2007-10-17 | Star Seiki Co., Ltd. | Mold temperature regulating apparatus |
KR20140089536A (ko) * | 2011-11-15 | 2014-07-15 | 도쿄엘렉트론가부시키가이샤 | 온도 제어 시스템, 반도체 제조 장치 및 온도 제어 방법 |
US10553463B2 (en) | 2011-11-15 | 2020-02-04 | Tokyo Electron Limited | Temperature control system, semiconductor manufacturing device, and temperature control method |
WO2013082675A1 (en) * | 2011-12-09 | 2013-06-13 | Ritemp Pty Ltd | Temperature regulation improvements |
US9789632B2 (en) | 2011-12-09 | 2017-10-17 | Ritemp Pty Ltd | Temperature regulation apparatus and method |
FR3060433A1 (fr) * | 2016-12-21 | 2018-06-22 | A2P Industrie | Installation de refroidissement de moules |
KR102220747B1 (ko) * | 2019-12-30 | 2021-02-26 | 주식회사 디케이솔루션 | 복합소재의 성형장치 |
Also Published As
Publication number | Publication date |
---|---|
JPS6365001B2 (enrdf_load_stackoverflow) | 1988-12-14 |
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