JPS58206132A - 搬送方式 - Google Patents
搬送方式Info
- Publication number
- JPS58206132A JPS58206132A JP57088865A JP8886582A JPS58206132A JP S58206132 A JPS58206132 A JP S58206132A JP 57088865 A JP57088865 A JP 57088865A JP 8886582 A JP8886582 A JP 8886582A JP S58206132 A JPS58206132 A JP S58206132A
- Authority
- JP
- Japan
- Prior art keywords
- discharge
- supply
- bodies
- processed
- discharged
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/0711—
-
- H10W72/073—
-
- H10W72/07337—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57088865A JPS58206132A (ja) | 1982-05-27 | 1982-05-27 | 搬送方式 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57088865A JPS58206132A (ja) | 1982-05-27 | 1982-05-27 | 搬送方式 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58206132A true JPS58206132A (ja) | 1983-12-01 |
| JPH0131688B2 JPH0131688B2 (OSRAM) | 1989-06-27 |
Family
ID=13954897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57088865A Granted JPS58206132A (ja) | 1982-05-27 | 1982-05-27 | 搬送方式 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58206132A (OSRAM) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6453554A (en) * | 1987-08-25 | 1989-03-01 | Sony Corp | Assembly system for semiconductor device |
| JP2006041195A (ja) * | 2004-07-27 | 2006-02-09 | Matsushita Electric Ind Co Ltd | 部品実装用装置及びその動作方法 |
| JP2007103872A (ja) * | 2005-10-07 | 2007-04-19 | Ultrasonic Engineering Co Ltd | ワイヤボンディング装置 |
-
1982
- 1982-05-27 JP JP57088865A patent/JPS58206132A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6453554A (en) * | 1987-08-25 | 1989-03-01 | Sony Corp | Assembly system for semiconductor device |
| JP2006041195A (ja) * | 2004-07-27 | 2006-02-09 | Matsushita Electric Ind Co Ltd | 部品実装用装置及びその動作方法 |
| JP2007103872A (ja) * | 2005-10-07 | 2007-04-19 | Ultrasonic Engineering Co Ltd | ワイヤボンディング装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0131688B2 (OSRAM) | 1989-06-27 |
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