JPS58204542A - 半導体用樹脂封止装置 - Google Patents

半導体用樹脂封止装置

Info

Publication number
JPS58204542A
JPS58204542A JP8731282A JP8731282A JPS58204542A JP S58204542 A JPS58204542 A JP S58204542A JP 8731282 A JP8731282 A JP 8731282A JP 8731282 A JP8731282 A JP 8731282A JP S58204542 A JPS58204542 A JP S58204542A
Authority
JP
Japan
Prior art keywords
plunger
pot
resin
mold
sealing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8731282A
Other languages
English (en)
Japanese (ja)
Other versions
JPH023299B2 (enExample
Inventor
Kimio Hoshina
保科　喜美雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8731282A priority Critical patent/JPS58204542A/ja
Publication of JPS58204542A publication Critical patent/JPS58204542A/ja
Publication of JPH023299B2 publication Critical patent/JPH023299B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP8731282A 1982-05-25 1982-05-25 半導体用樹脂封止装置 Granted JPS58204542A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8731282A JPS58204542A (ja) 1982-05-25 1982-05-25 半導体用樹脂封止装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8731282A JPS58204542A (ja) 1982-05-25 1982-05-25 半導体用樹脂封止装置

Publications (2)

Publication Number Publication Date
JPS58204542A true JPS58204542A (ja) 1983-11-29
JPH023299B2 JPH023299B2 (enExample) 1990-01-23

Family

ID=13911318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8731282A Granted JPS58204542A (ja) 1982-05-25 1982-05-25 半導体用樹脂封止装置

Country Status (1)

Country Link
JP (1) JPS58204542A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0372638A (ja) * 1989-06-19 1991-03-27 Matsushita Electric Ind Co Ltd 半導体封止金型

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0372638A (ja) * 1989-06-19 1991-03-27 Matsushita Electric Ind Co Ltd 半導体封止金型

Also Published As

Publication number Publication date
JPH023299B2 (enExample) 1990-01-23

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