JPS58204073A - 接着剤組成物 - Google Patents

接着剤組成物

Info

Publication number
JPS58204073A
JPS58204073A JP8678282A JP8678282A JPS58204073A JP S58204073 A JPS58204073 A JP S58204073A JP 8678282 A JP8678282 A JP 8678282A JP 8678282 A JP8678282 A JP 8678282A JP S58204073 A JPS58204073 A JP S58204073A
Authority
JP
Japan
Prior art keywords
adhesive
epoxy resin
adhesive composition
film
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8678282A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6361351B2 (enrdf_load_stackoverflow
Inventor
Toshikazu Furuhata
降籏　俊和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Petrochemical Industries Ltd
Original Assignee
Mitsui Petrochemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Petrochemical Industries Ltd filed Critical Mitsui Petrochemical Industries Ltd
Priority to JP8678282A priority Critical patent/JPS58204073A/ja
Priority to US06/467,207 priority patent/US4465542A/en
Priority to DE8383300899T priority patent/DE3368434D1/de
Priority to EP19830300899 priority patent/EP0087311B1/en
Publication of JPS58204073A publication Critical patent/JPS58204073A/ja
Publication of JPS6361351B2 publication Critical patent/JPS6361351B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Organic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP8678282A 1982-02-19 1982-05-21 接着剤組成物 Granted JPS58204073A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP8678282A JPS58204073A (ja) 1982-05-21 1982-05-21 接着剤組成物
US06/467,207 US4465542A (en) 1982-02-19 1983-02-17 Adhesive composition
DE8383300899T DE3368434D1 (en) 1982-02-19 1983-02-21 Adhesive compositions, method of making laminates using the composition, and laminates made thereby
EP19830300899 EP0087311B1 (en) 1982-02-19 1983-02-21 Adhesive compositions, method of making laminates using the composition, and laminates made thereby

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8678282A JPS58204073A (ja) 1982-05-21 1982-05-21 接着剤組成物

Publications (2)

Publication Number Publication Date
JPS58204073A true JPS58204073A (ja) 1983-11-28
JPS6361351B2 JPS6361351B2 (enrdf_load_stackoverflow) 1988-11-29

Family

ID=13896319

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8678282A Granted JPS58204073A (ja) 1982-02-19 1982-05-21 接着剤組成物

Country Status (1)

Country Link
JP (1) JPS58204073A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63105023A (ja) * 1986-10-20 1988-05-10 Sunstar Giken Kk エポキシ樹脂組成物の製造法
WO2008030049A1 (en) * 2006-09-07 2008-03-13 Henkel Korea Ltd. High-strength adhesive composition

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6370604U (enrdf_load_stackoverflow) * 1986-10-28 1988-05-12
JPH0425103U (enrdf_load_stackoverflow) * 1990-06-25 1992-02-28
JPH0487108U (enrdf_load_stackoverflow) * 1990-11-30 1992-07-29

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51135936A (en) * 1975-05-20 1976-11-25 Nitto Electric Ind Co Ltd Adhesive composition
JPS5465797A (en) * 1977-11-04 1979-05-26 Toray Ind Inc Epoxy resin composition
JPS5592757A (en) * 1979-01-09 1980-07-14 Toray Ind Inc Flame-retardant epoxy resin for reinforcing with carbon fiber
JPS58142955A (ja) * 1982-02-19 1983-08-25 Mitsui Petrochem Ind Ltd 接着剤組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51135936A (en) * 1975-05-20 1976-11-25 Nitto Electric Ind Co Ltd Adhesive composition
JPS5465797A (en) * 1977-11-04 1979-05-26 Toray Ind Inc Epoxy resin composition
JPS5592757A (en) * 1979-01-09 1980-07-14 Toray Ind Inc Flame-retardant epoxy resin for reinforcing with carbon fiber
JPS58142955A (ja) * 1982-02-19 1983-08-25 Mitsui Petrochem Ind Ltd 接着剤組成物

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63105023A (ja) * 1986-10-20 1988-05-10 Sunstar Giken Kk エポキシ樹脂組成物の製造法
WO2008030049A1 (en) * 2006-09-07 2008-03-13 Henkel Korea Ltd. High-strength adhesive composition
KR100838346B1 (ko) 2006-09-07 2008-06-13 헨켈코리아 유한회사 고강성 접착 조성물

Also Published As

Publication number Publication date
JPS6361351B2 (enrdf_load_stackoverflow) 1988-11-29

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