JPS58200521A - Method of producing laminated electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] The present invention relates to a method for manufacturing laminated electronic components.

Many multilayer electronic components have been put into practical use, such as thick film resistor networks, multilayer ceramic capacitors, multilayer ceramic varistors, and multilayer ceramic wiring boards. These laminated electronic components are overcharged, cast electric bodies, I! It is manufactured by a manufacturing method in which conductors, electrodes, resistors, dielectrics, etc. are formed on a substrate by a thick film method, laminated, and sintered.

In forming electronic circuit patterns using the conventional thick film method, there are large variations in pattern dimensions and printing thickness during thick film printing, so it is difficult to produce parts with high precision and short 4I parts life. In addition, in the conventional thick film method, it is difficult to paste conductors, resistors, dielectrics, etc., and in order to form a reproducible AM pattern, paste and printing conditions must be adjusted every time. It was necessary to adjust this, and this was a major cause of lower productivity.

9. When printing with the thick film method, the utilization rate of paste is extremely poor. 41. Also, when expensive metals such as gold, platinum, and palladium are used for conductors, it becomes a cause of increased costs. home.

The present invention eliminates all of these drawbacks, improves the sliding properties of laminated electronic components, has less variation in characteristics, and can significantly improve productivity. The purpose is to provide a manufacturing method.

The present invention includes a step of producing a green sheet made of a mixture of an inorganic material powder and an organic substance into a predetermined shape for each of a plurality of types of inorganic materials, and forming one or more types of these green sheets into a predetermined shape. a step of punching out a raw sheet of a type other than these and pressing it onto the sheet in the shape of the initial sheet production, and the first step in which the raw sheet punched into a predetermined shape is pressed onto the surface of the sheet. The raw sheet with the shape O at the time of production and the raw sheet punched on the surface with piillm are crimped 1. It is characterized by having a step of laminating, pressing, and firing one or more unsheeted raw sheets at a ratio of 1:1.

That is, in the present invention, O materials such as conductors, resistors, and electric bodies constituting a laminated electronic component are formed into O raw sheets of a certain shape, and one or more of these raw sheets are formed using a metal lid or the like. A major feature is that it is punched into a predetermined size and shape and simultaneously press-bonded onto a 11s raw sheet other than the punched raw sheet.

In this way, the method L1 of forming electrodes, resistors, etc. by punching them out of gold and performing pressure bonding significantly improves the variation in dimension O compared to the conventional thick film method, and as a result, improves nlL and improves the characteristics. Variations can also be reduced.

In addition, the unused parts of the raw sheet after punching it can be easily recycled into new materials, and there is almost no loss during the material process. When using a conductor in the form of a raw sheet, it is important to realize a large cost reduction. 19. Since the present invention mechanically punches the raw sheet, continuous processing is easier than with conventional printing methods. It becomes possible to automate and make it more valuable.

In addition, we do not use paste-like materials, and O during production.
It is easy to manage, and there is no need to set conditions every time, and productivity can be significantly increased.

Next, the present invention will be explained while comparing with the conventional manufacturing method of laminated electronic components using the drawings. Here, explanation will be given by taking as an example a process for manufacturing multilayer ceramic capacitors.

Happy 1m! 1 (JLI~(01 is 10 which shows a diagram of a printing jig for a conventional laminated sequique capacitor OII dielectric raw sheet in the first step of forming internal electrodes on the dielectric raw sheet!).

1114 &) 0 was formed by the Yasting method on the dielectric green sheet U, as shown in No. 1rIA(l)IK, using the screen printing method. ) When printing the internal electrode paste n, the internal electrode base) 13 is formed into an electric shape as shown in No. 1110), and after drying, these internal electrodes are formed and a plurality of nine electric body raw sheets are formed. A laminated raw chip is produced by laminating and pressing dielectric green sheets that do not form electrodes.The raw chips are sintered to produce a laminated chip condenser. This will be explained using FIG. 2.

142 Figures 4 to (0) show the dielectric raw sheet 4 in each process.
, gold sin, 2i, nine diagrams showing internal electronics sheets.

On top of the dielectric raw sheet 21 formed by the casting method of 2nd wAl&l, as shown in Fig. g2 (bl), gold Min for punching and metal powder to be the internal electrode were formed at the junction of 22' by the casting method. Internal electrode raw sea) Z3tli! By applying upper pressure or pressure and heat at the same time, the inner electrode raw sheet n is pressed and formed on the electrically conductive raw sheet n as shown in FIG. 2(0)K. - The dielectric raw sheet on which internal electrodes are formed in this way is laminated and pressed together with the aforementioned dielectric raw sheet on which no internal electrodes are formed, and after sintering, it becomes a laminated chip condenser.

The 4I feature of the present invention is that the thickness of the rounded electrode using the raw electrode sheet can be kept constant and can be made very thin without using the screen printing method using paste.

Conventionally, the internal electrodes of multilayer ceramic capacitors have been formed using a screen printing method as shown in Figure 1 of Fuki.
When trying to reduce the thickness of the electrode to reduce costs,
During printing, a thickness difference occurs, and as a result, after sintering, the internal electrodes become island-like and may be partially cut off, making it impossible to obtain the capacitance to the designed value. However, it was not possible to achieve a thickness of less than 2 μm.

However, if the internal electrodes of a multilayer ceramic capacitor are formed by the method shown in FIG. The thickness of the internal conductor Ii can be reduced to 2 μm or less without forming an island shape or breaking.

1 friend, 11L2WJ"'I: Internal electrode,,,L -)
0EIII Since the remaining portion that has not been subjected to KPM can be recycled and made into a raw sheet again, the amount of internal electrode material Oo is greatly reduced.

The details of this 1j10 will be explained below using examples.

(Implementation 'f4L) A dielectric raw sheet with a thickness of μm and a metal palladium sheet with a thickness of 5 μm were cut by the slip casting method, which is usually carried out, using a dielectric powder mainly composed of titanium compact and a metal powder. I made a sheet.

At this time, polyvinylbutylene was used as the binder for the green sheet.

The dielectric raw sheet with the electrodes crimped and formed in this way was
A multilayer ceramic capacitor was fabricated by arranging a raw crocodile electric sheet with no electrodes formed on the outside of these 10 sheets, laminating them, pressing and pre-sintering them. Measured by frequency.

The variation in the thickness of the electrode after sintering, the measured value of the capacitance with respect to the designed value, and the value of the dielectric loss are determined in the i6th manner. For comparison, this table shows measurement data of a multilayer ceramic capacitor manufactured by the conventional screen printing method.

Note: Samples marked with * were prepared using the conventional method.

Table 1 shows that when the other internal parts are formed by the method of the present invention, there is little variation in the electrode thickness, and the rate of decrease in capacitance relative to the designed value is small when comparing the electrode thickness. Furthermore, even if the thickness of the internal electrode is thin, the cut of the T camellia is black, and the dielectric loss is small and shows a good value. As described above, by forming internal electrodes using the method of the present invention, compared to the conventional screen printing method, it is possible to improve
It is clear that precision productivity is significantly improved.

(Example 2) An insulator powder containing alumina and sinterable at around 900'C, a resistor powder containing silver/palladium powder, and ruthenium oxide were each mixed to a thickness of μm by the commonly used slip casting method. Insulator raw sheet, thickness bμ
A mofl palladium raw sheet and a resistor raw sheet with a thickness of 30 pEEI were made. At this time, the resistance was measured after firing the silver-palladium raw sheet and the resistor raw sheet using polyvinyl as the binder for the raw sheet. The dimensions of the resistor after sintering were 2 x 10 m and the thickness was 25 μm. Table 2 shows the resistance value and the variation in resistance value of this resistor. Table 2 shows, for reference, data when resistors were formed by the conventionally used screen printing method.

Table 2 Note: Samples marked with * are samples prepared using the conventional method.
It is 11.

As is clear from Table 2, according to the manufacturing method of the present invention, highly accurate resistors can be formed with very little variation in resistance value.

In this example as well, the unused parts of the silver palladium raw sheet and the ruthenium oxide resistor raw sheet can be reused.
The material cost of the product can be significantly reduced compared to conventional paste printing methods. Furthermore, since there is no need to determine screen printing conditions for matching resistance values, productivity can be significantly improved.

(Example 1) An insulator powder containing alumina that can be sintered at around 900°C and gold powder were each made using the commonly used slip casting method to create a 50 μm thick sugar edge sheet and a 62 m thick residual sheet. At this time, acrylic resin was used as the binder for the raw sheet.

The raw insulator sheet 41 produced in this way is punched into a 7011 wm x 100 wa O shape (Figure 4 (a)), and after that, through holes are formed.
), arrange the gold 1142.42' and the residual sheet 43 on this sheet d as shown in FIG.
One or more sheets were laminated to form a raw ceramic substrate, which was then sintered to form a ceramic wiring board or a multilayer ceramic wiring board.

Table 3 shows the results of measuring the variations in conductor width and conductor resistance per unit of the ceramic substrate thus formed.

This table also shows for reference the variation in conductor resistance when conductors are formed using the conventional screen printing method.

The Tao and Mark O samples are nine samples prepared by the conventional method.

From Table 0, it can be seen that by following the method of the present invention, a substrate with very little variation in conductor resistance can be obtained.

As shown in the examples above, when laminated electronic components are manufactured by the manufacturing method of the present invention, high-quality electronic components with excellent accuracy, little variation in characteristics, high productivity, and excellent quantity Ii can be manufactured. becomes possible.

[Brief explanation of drawings]

Figure s1 is a diagram showing an electrode forming method using a conventional screen printing method. 211 is a diagram showing a method for forming electrodes when manufacturing a laminated capacitor according to the present invention; FIG. Iris 311a original release! FIG. 3 is a diagram illustrating a process of forming a resistor using the method of I. FIG. 4 is a diagram showing the process of engraving a multilayer ceramic wiring board using the method of the present invention. In 11, 11.21... Dielectric raw sheet, 12... Screen, 13... Internal electrode paste, 14-... Squeegee-122, 2
2'---Kinran, n---Internal IE pole teacher sheet 31, 41---Insulator raw sheet, Tomi, 3
2', 34W... Gold m, 33 * 43...
- Mongolian palladium raw sheet, stamen... Resistor raw sheet, 42.42'... Gold Al. Figure 1 Figure 112 (cL) 2I (b)
2/1 Figure 3

Claims (1)

[Claims] A process of manufacturing raw sheets made of a mixture of inorganic material powder and organic matter into a constant O* shape for multiple types of inorganic materials, and punching out of these raw sheets O of class 1a or higher into a predetermined shape. The raw sheet punched out in this shape is 1. In addition to these, there is a step of press-bonding an O type O raw sheet onto the raw sheet in the shape at which the O sheet was initially produced, and a raw sheet punched into a predetermined shape is the sheet) 1! It is characterized by having the steps of laminating, pressing, and firing one or more raw sheets that are crimped on the i-side and one or more raw sheets of the same type that are punched out on the surface and do not have the mourner's sheet crimped on them. A method for manufacturing laminated electronic components.