JPS5819817A - 電線被覆用積層フィルム - Google Patents

Info

Publication number

JPS5819817A

JPS5819817A JP11898281A JP11898281A JPS5819817A JP S5819817 A JPS5819817 A JP S5819817A JP 11898281 A JP11898281 A JP 11898281A JP 11898281 A JP11898281 A JP 11898281A JP S5819817 A JPS5819817 A JP S5819817A

Authority

JP

Japan

Prior art keywords

film

laminated film

plastic

resin

coating

Prior art date

1981-07-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Granted

Links

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• 238000000576 coating method Methods 0.000 title description 9
• 239000011248 coating agent Substances 0.000 title description 7
• 239000002985 plastic film Substances 0.000 claims description 9
• 229920006255 plastic film Polymers 0.000 claims description 9
• KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 1
• 229920002799 BoPET Polymers 0.000 claims 1
• 239000005001 laminate film Substances 0.000 claims 1
• 239000005011 phenolic resin Substances 0.000 claims 1
• 229920001568 phenolic resin Polymers 0.000 claims 1
• 238000000034 method Methods 0.000 description 11
• 229920005989 resin Polymers 0.000 description 8
• 239000011347 resin Substances 0.000 description 7
• -1 polyethylene Polymers 0.000 description 6
• 239000004698 Polyethylene Substances 0.000 description 5
• 239000013034 phenoxy resin Substances 0.000 description 5
• 229920006287 phenoxy resin Polymers 0.000 description 5
• 229920000573 polyethylene Polymers 0.000 description 5
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
• 229910000831 Steel Inorganic materials 0.000 description 4
• 239000000088 plastic resin Substances 0.000 description 4
• 239000010959 steel Substances 0.000 description 4
• VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
• 239000005977 Ethylene Substances 0.000 description 3
• 238000009413 insulation Methods 0.000 description 2
• 238000010030 laminating Methods 0.000 description 2
• 241000041377 Hiroa Species 0.000 description 1
• 240000007839 Kleinhovia hospita Species 0.000 description 1
• 239000004743 Polypropylene Substances 0.000 description 1
• BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
• 230000006866 deterioration Effects 0.000 description 1
• XEKOWRVHYACXOJ-UHFFFAOYSA-N ethyl acetate Substances CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 1
• 238000001125 extrusion Methods 0.000 description 1
• 230000004907 flux Effects 0.000 description 1
• 230000008595 infiltration Effects 0.000 description 1
• 238000001764 infiltration Methods 0.000 description 1
• 239000010954 inorganic particle Substances 0.000 description 1
• 239000000463 material Substances 0.000 description 1
• 239000012046 mixed solvent Substances 0.000 description 1
• 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
• 230000000379 polymerizing effect Effects 0.000 description 1
• 229920001155 polypropylene Polymers 0.000 description 1
• 238000005096 rolling process Methods 0.000 description 1
• 238000007789 sealing Methods 0.000 description 1
• 238000004804 winding Methods 0.000 description 1
• 238000010618 wire wrap Methods 0.000 description 1
• 239000002023 wood Substances 0.000 description 1

Cited By (2)