JPS58197863A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58197863A
JPS58197863A JP57080936A JP8093682A JPS58197863A JP S58197863 A JPS58197863 A JP S58197863A JP 57080936 A JP57080936 A JP 57080936A JP 8093682 A JP8093682 A JP 8093682A JP S58197863 A JPS58197863 A JP S58197863A
Authority
JP
Japan
Prior art keywords
ceramic substrate
semiconductor element
metallic
island
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57080936A
Other languages
English (en)
Japanese (ja)
Other versions
JPS639749B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Takashi Miyamoto
隆 宮本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP57080936A priority Critical patent/JPS58197863A/ja
Publication of JPS58197863A publication Critical patent/JPS58197863A/ja
Publication of JPS639749B2 publication Critical patent/JPS639749B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2224/45001—Core members of the connector
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
JP57080936A 1982-05-14 1982-05-14 半導体装置 Granted JPS58197863A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57080936A JPS58197863A (ja) 1982-05-14 1982-05-14 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57080936A JPS58197863A (ja) 1982-05-14 1982-05-14 半導体装置

Publications (2)

Publication Number Publication Date
JPS58197863A true JPS58197863A (ja) 1983-11-17
JPS639749B2 JPS639749B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1988-03-01

Family

ID=13732342

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57080936A Granted JPS58197863A (ja) 1982-05-14 1982-05-14 半導体装置

Country Status (1)

Country Link
JP (1) JPS58197863A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63500692A (ja) * 1985-08-27 1988-03-10 ヒユ−ズ・エアクラフト・カンパニ− 超小形電子パッケ−ジ
US5027191A (en) * 1989-05-11 1991-06-25 Westinghouse Electric Corp. Cavity-down chip carrier with pad grid array

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63500692A (ja) * 1985-08-27 1988-03-10 ヒユ−ズ・エアクラフト・カンパニ− 超小形電子パッケ−ジ
US5027191A (en) * 1989-05-11 1991-06-25 Westinghouse Electric Corp. Cavity-down chip carrier with pad grid array

Also Published As

Publication number Publication date
JPS639749B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1988-03-01

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