JPS5818430B2 - 無電解メツキ浴およびメツキ方法 - Google Patents
無電解メツキ浴およびメツキ方法Info
- Publication number
- JPS5818430B2 JPS5818430B2 JP50050163A JP5016375A JPS5818430B2 JP S5818430 B2 JPS5818430 B2 JP S5818430B2 JP 50050163 A JP50050163 A JP 50050163A JP 5016375 A JP5016375 A JP 5016375A JP S5818430 B2 JPS5818430 B2 JP S5818430B2
- Authority
- JP
- Japan
- Prior art keywords
- bath
- group
- plating
- metal
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US464666A US3917885A (en) | 1974-04-26 | 1974-04-26 | Electroless gold plating process |
US464666 | 2009-05-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS50149542A JPS50149542A (ko) | 1975-11-29 |
JPS5818430B2 true JPS5818430B2 (ja) | 1983-04-13 |
Family
ID=23844812
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50050163A Expired JPS5818430B2 (ja) | 1974-04-26 | 1975-04-24 | 無電解メツキ浴およびメツキ方法 |
Country Status (10)
Country | Link |
---|---|
US (1) | US3917885A (ko) |
JP (1) | JPS5818430B2 (ko) |
BR (1) | BR7502540A (ko) |
CA (1) | CA1038559A (ko) |
DD (1) | DD117488A5 (ko) |
DE (1) | DE2518559A1 (ko) |
FR (1) | FR2268595B1 (ko) |
GB (1) | GB1448659A (ko) |
IT (1) | IT1035454B (ko) |
MX (1) | MX146110A (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60179127U (ja) * | 1984-05-09 | 1985-11-28 | ヤンマー農機株式会社 | コンバイン |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4082908A (en) * | 1976-05-05 | 1978-04-04 | Burr-Brown Research Corporation | Gold plating process and product produced thereby |
DE2747562A1 (de) * | 1977-10-20 | 1979-05-03 | Schering Ag | Verfahren und anlage zur wiedergewinnung von im abwasser von anlagen zur chemischen oberflaechenbehandlung befindlichen metallen und anderen wertstoffen |
US4162337A (en) * | 1977-11-14 | 1979-07-24 | Bell Telephone Laboratories, Incorporated | Process for fabricating III-V semiconducting devices with electroless gold plating |
FR2441666A1 (fr) * | 1978-11-16 | 1980-06-13 | Prost Tournier Patrick | Procede de depot chimique d'or par reduction autocatalytique |
US4340451A (en) * | 1979-12-17 | 1982-07-20 | Bell Telephone Laboratories, Incorporated | Method of replenishing gold/in plating baths |
DE3029785A1 (de) * | 1980-08-04 | 1982-03-25 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Saures goldbad zur stromlosen abscheidung von gold |
US4337091A (en) * | 1981-03-23 | 1982-06-29 | Hooker Chemicals & Plastics Corp. | Electroless gold plating |
US4374876A (en) * | 1981-06-02 | 1983-02-22 | Occidental Chemical Corporation | Process for the immersion deposition of gold |
US4474838A (en) * | 1982-12-01 | 1984-10-02 | Omi International Corporation | Electroless direct deposition of gold on metallized ceramics |
US4822641A (en) * | 1985-04-30 | 1989-04-18 | Inovan Gmbh & Co. Kg | Method of manufacturing a contact construction material structure |
US4863766A (en) * | 1986-09-02 | 1989-09-05 | General Electric Company | Electroless gold plating composition and method for plating |
US4925491A (en) * | 1986-09-30 | 1990-05-15 | Lamerie, N.V. | Solutions and creams for silver plating and polishing |
US4798626A (en) * | 1986-09-30 | 1989-01-17 | Lamerie, N.V. | Solutions and creams for silver plating and polishing |
US4919720A (en) * | 1988-06-30 | 1990-04-24 | Learonal, Inc. | Electroless gold plating solutions |
EP0370561B1 (en) * | 1988-11-15 | 1992-06-24 | H.B.T. Holland Biotechnology B.V. | Stained sols of non-metallic elements or compounds, their preparation and use |
US5130168A (en) * | 1988-11-22 | 1992-07-14 | Technic, Inc. | Electroless gold plating bath and method of using same |
US4978559A (en) * | 1989-11-03 | 1990-12-18 | General Electric Company | Autocatalytic electroless gold plating composition |
US4979988A (en) * | 1989-12-01 | 1990-12-25 | General Electric Company | Autocatalytic electroless gold plating composition |
US5206055A (en) * | 1991-09-03 | 1993-04-27 | General Electric Company | Method for enhancing the uniform electroless deposition of gold onto a palladium substrate |
US5338343A (en) * | 1993-07-23 | 1994-08-16 | Technic Incorporated | Catalytic electroless gold plating baths |
EP1245697A3 (de) * | 2002-07-17 | 2003-02-19 | ATOTECH Deutschland GmbH | Verfahren zum aussenstromlosen Abscheiden von Silber |
JP2004176171A (ja) * | 2002-09-30 | 2004-06-24 | Shinko Electric Ind Co Ltd | 非シアン電解金めっき液 |
US20060141149A1 (en) * | 2004-12-29 | 2006-06-29 | Industrial Technology Research Institute | Method for forming superparamagnetic nanoparticles |
US20090139264A1 (en) * | 2007-11-30 | 2009-06-04 | Rachel Brown | Antique jewelry articles and methods of making same |
US11579344B2 (en) | 2012-09-17 | 2023-02-14 | Government Of The United States Of America, As Represented By The Secretary Of Commerce | Metallic grating |
US20150345039A1 (en) * | 2015-07-20 | 2015-12-03 | National Institute Of Standards And Technology | Composition having alkaline ph and process for forming superconformation therewith |
CN102925933B (zh) * | 2012-11-05 | 2015-03-04 | 福州大学 | 一种Au-FeNi两段式合金纳米马达及其制备方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3230098A (en) * | 1962-10-09 | 1966-01-18 | Engelhard Ind Inc | Immersion plating with noble metals |
US3515571A (en) * | 1963-07-02 | 1970-06-02 | Lockheed Aircraft Corp | Deposition of gold films |
US3294578A (en) * | 1963-10-22 | 1966-12-27 | Gen Aniline & Film Corp | Deposition of a metallic coat on metal surfaces |
US3589916A (en) * | 1964-06-24 | 1971-06-29 | Photocircuits Corp | Autocatalytic gold plating solutions |
US3506462A (en) * | 1966-10-29 | 1970-04-14 | Nippon Electric Co | Electroless gold plating solutions |
US3482974A (en) * | 1966-12-27 | 1969-12-09 | Gen Electric | Method of plating gold films onto oxide-free silicon substrates |
US3700469A (en) * | 1971-03-08 | 1972-10-24 | Bell Telephone Labor Inc | Electroless gold plating baths |
US3697296A (en) * | 1971-03-09 | 1972-10-10 | Du Pont | Electroless gold plating bath and process |
-
1974
- 1974-04-26 US US464666A patent/US3917885A/en not_active Expired - Lifetime
-
1975
- 1975-04-09 MX MX157698A patent/MX146110A/es unknown
- 1975-04-23 CA CA225,269A patent/CA1038559A/en not_active Expired
- 1975-04-24 FR FR7512789A patent/FR2268595B1/fr not_active Expired
- 1975-04-24 GB GB1712775A patent/GB1448659A/en not_active Expired
- 1975-04-24 JP JP50050163A patent/JPS5818430B2/ja not_active Expired
- 1975-04-24 IT IT49280/75A patent/IT1035454B/it active
- 1975-04-25 DE DE19752518559 patent/DE2518559A1/de not_active Ceased
- 1975-04-25 BR BR3224/75A patent/BR7502540A/pt unknown
- 1975-04-25 DD DD185707A patent/DD117488A5/xx unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60179127U (ja) * | 1984-05-09 | 1985-11-28 | ヤンマー農機株式会社 | コンバイン |
Also Published As
Publication number | Publication date |
---|---|
FR2268595B1 (ko) | 1981-03-20 |
FR2268595A1 (ko) | 1975-11-21 |
MX146110A (es) | 1982-05-18 |
DD117488A5 (ko) | 1976-01-12 |
BR7502540A (pt) | 1976-03-03 |
DE2518559A1 (de) | 1975-11-13 |
IT1035454B (it) | 1979-10-20 |
JPS50149542A (ko) | 1975-11-29 |
CA1038559A (en) | 1978-09-19 |
AU8052375A (en) | 1976-10-28 |
US3917885A (en) | 1975-11-04 |
GB1448659A (en) | 1976-09-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5818430B2 (ja) | 無電解メツキ浴およびメツキ方法 | |
US4337091A (en) | Electroless gold plating | |
US4684550A (en) | Electroless copper plating and bath therefor | |
US3745039A (en) | Electroless cobalt plating bath and process | |
GB2099460A (en) | Plating bath for the immersion deposition of gold | |
JPH0247551B2 (ko) | ||
EP0156212B1 (en) | Process for plating copper from electroless plating compositions | |
JP2664231B2 (ja) | 無電解ニッケルめっき浴の製造および使用方法 | |
US3853590A (en) | Electroless plating solution and process | |
TW200416299A (en) | Electroless gold plating solution | |
CA1188458A (en) | Electroless gold plating | |
JP2927142B2 (ja) | 無電解金めっき浴及び無電解金めっき方法 | |
JPH0429740B2 (ko) | ||
TW200303372A (en) | Method of depositing gold layer on metal, method of manufacturing electronic device, and article | |
US4450191A (en) | Ammonium ions used as electroless copper plating rate controller | |
US4474838A (en) | Electroless direct deposition of gold on metallized ceramics | |
US3915718A (en) | Chemical silver bath | |
JPS60184683A (ja) | 金属付着方法 | |
US2827398A (en) | Electroless iron plating | |
JPH02294487A (ja) | 無電解銅メッキ浴およびそれから銅を析出させた基体 | |
JPH0214430B2 (ko) | ||
GB2109013A (en) | Metallic impurity control for electroless copper plating | |
JPH0753909B2 (ja) | 無電解銅めっき液 | |
JPH0361380A (ja) | 無電解すずめっき浴 | |
JPH0219473A (ja) | 無電解金沈積 |