JPS58182857A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58182857A
JPS58182857A JP6659382A JP6659382A JPS58182857A JP S58182857 A JPS58182857 A JP S58182857A JP 6659382 A JP6659382 A JP 6659382A JP 6659382 A JP6659382 A JP 6659382A JP S58182857 A JPS58182857 A JP S58182857A
Authority
JP
Japan
Prior art keywords
frame
pins
lead
semiconductor
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6659382A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6351544B2 (enExample
Inventor
Matsuki Kawakami
川上　末喜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP6659382A priority Critical patent/JPS58182857A/ja
Publication of JPS58182857A publication Critical patent/JPS58182857A/ja
Publication of JPS6351544B2 publication Critical patent/JPS6351544B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP6659382A 1982-04-21 1982-04-21 半導体装置 Granted JPS58182857A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6659382A JPS58182857A (ja) 1982-04-21 1982-04-21 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6659382A JPS58182857A (ja) 1982-04-21 1982-04-21 半導体装置

Publications (2)

Publication Number Publication Date
JPS58182857A true JPS58182857A (ja) 1983-10-25
JPS6351544B2 JPS6351544B2 (enExample) 1988-10-14

Family

ID=13320379

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6659382A Granted JPS58182857A (ja) 1982-04-21 1982-04-21 半導体装置

Country Status (1)

Country Link
JP (1) JPS58182857A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009133401A (ja) * 2007-11-30 2009-06-18 Nifco Inc 可動体の支持装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0493482U (enExample) * 1991-01-08 1992-08-13

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009133401A (ja) * 2007-11-30 2009-06-18 Nifco Inc 可動体の支持装置

Also Published As

Publication number Publication date
JPS6351544B2 (enExample) 1988-10-14

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