JPS58180050A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58180050A
JPS58180050A JP57063414A JP6341482A JPS58180050A JP S58180050 A JPS58180050 A JP S58180050A JP 57063414 A JP57063414 A JP 57063414A JP 6341482 A JP6341482 A JP 6341482A JP S58180050 A JPS58180050 A JP S58180050A
Authority
JP
Japan
Prior art keywords
parts
lead
semiconductor device
electrode
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57063414A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0258780B2 (https=
Inventor
Shigeo Amagi
滋夫 天城
Masahiro Ono
正博 小野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57063414A priority Critical patent/JPS58180050A/ja
Publication of JPS58180050A publication Critical patent/JPS58180050A/ja
Publication of JPH0258780B2 publication Critical patent/JPH0258780B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Wire Bonding (AREA)
JP57063414A 1982-04-15 1982-04-15 半導体装置 Granted JPS58180050A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57063414A JPS58180050A (ja) 1982-04-15 1982-04-15 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57063414A JPS58180050A (ja) 1982-04-15 1982-04-15 半導体装置

Publications (2)

Publication Number Publication Date
JPS58180050A true JPS58180050A (ja) 1983-10-21
JPH0258780B2 JPH0258780B2 (https=) 1990-12-10

Family

ID=13228602

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57063414A Granted JPS58180050A (ja) 1982-04-15 1982-04-15 半導体装置

Country Status (1)

Country Link
JP (1) JPS58180050A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015142018A (ja) * 2014-01-29 2015-08-03 三菱電機株式会社 電力用半導体装置
WO2018020729A1 (ja) * 2016-07-27 2018-02-01 株式会社日立製作所 半導体モジュールおよび半導体モジュールの製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015142018A (ja) * 2014-01-29 2015-08-03 三菱電機株式会社 電力用半導体装置
WO2018020729A1 (ja) * 2016-07-27 2018-02-01 株式会社日立製作所 半導体モジュールおよび半導体モジュールの製造方法
JPWO2018020729A1 (ja) * 2016-07-27 2019-03-07 株式会社日立製作所 半導体モジュールおよび半導体モジュールの製造方法
US10937731B2 (en) 2016-07-27 2021-03-02 Hitachi, Ltd. Semiconductor module and method for manufacturing semiconductor module

Also Published As

Publication number Publication date
JPH0258780B2 (https=) 1990-12-10

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