JPS58176958A - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS58176958A JPS58176958A JP57059953A JP5995382A JPS58176958A JP S58176958 A JPS58176958 A JP S58176958A JP 57059953 A JP57059953 A JP 57059953A JP 5995382 A JP5995382 A JP 5995382A JP S58176958 A JPS58176958 A JP S58176958A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- carboxyl group
- semiconductor device
- curing agent
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57059953A JPS58176958A (ja) | 1982-04-09 | 1982-04-09 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57059953A JPS58176958A (ja) | 1982-04-09 | 1982-04-09 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58176958A true JPS58176958A (ja) | 1983-10-17 |
| JPS6258665B2 JPS6258665B2 (enExample) | 1987-12-07 |
Family
ID=13128012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57059953A Granted JPS58176958A (ja) | 1982-04-09 | 1982-04-09 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58176958A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6068066A (ja) * | 1982-10-15 | 1985-04-18 | アイエフエム デベロツプメント アクチ−ボラグ | 噴射ランス用ノズル |
| JPS60248769A (ja) * | 1984-04-25 | 1985-12-09 | Matsushita Electric Works Ltd | Ic封止用樹脂組成物 |
| JPS614721A (ja) * | 1984-06-19 | 1986-01-10 | Sumitomo Chem Co Ltd | エポキシ樹脂組成物 |
| US4829124A (en) * | 1986-11-17 | 1989-05-09 | Armstrong World Industries, Inc. | Dynamically crosslinked thermoplastic elastomer |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58121653A (ja) * | 1982-01-12 | 1983-07-20 | Hitachi Ltd | 半導体装置封止用エポキシ樹脂組成物とその製法 |
-
1982
- 1982-04-09 JP JP57059953A patent/JPS58176958A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58121653A (ja) * | 1982-01-12 | 1983-07-20 | Hitachi Ltd | 半導体装置封止用エポキシ樹脂組成物とその製法 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6068066A (ja) * | 1982-10-15 | 1985-04-18 | アイエフエム デベロツプメント アクチ−ボラグ | 噴射ランス用ノズル |
| JPS60248769A (ja) * | 1984-04-25 | 1985-12-09 | Matsushita Electric Works Ltd | Ic封止用樹脂組成物 |
| JPS614721A (ja) * | 1984-06-19 | 1986-01-10 | Sumitomo Chem Co Ltd | エポキシ樹脂組成物 |
| US4829124A (en) * | 1986-11-17 | 1989-05-09 | Armstrong World Industries, Inc. | Dynamically crosslinked thermoplastic elastomer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6258665B2 (enExample) | 1987-12-07 |
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