JPS5817638A - バンプ形成装置 - Google Patents

バンプ形成装置

Info

Publication number
JPS5817638A
JPS5817638A JP11508481A JP11508481A JPS5817638A JP S5817638 A JPS5817638 A JP S5817638A JP 11508481 A JP11508481 A JP 11508481A JP 11508481 A JP11508481 A JP 11508481A JP S5817638 A JPS5817638 A JP S5817638A
Authority
JP
Japan
Prior art keywords
electrode
wafer
plated
bump
auxiliary electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11508481A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6325709B2 (enrdf_load_stackoverflow
Inventor
Kazuhisa Nakamoto
中元　和久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11508481A priority Critical patent/JPS5817638A/ja
Publication of JPS5817638A publication Critical patent/JPS5817638A/ja
Publication of JPS6325709B2 publication Critical patent/JPS6325709B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
JP11508481A 1981-07-24 1981-07-24 バンプ形成装置 Granted JPS5817638A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11508481A JPS5817638A (ja) 1981-07-24 1981-07-24 バンプ形成装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11508481A JPS5817638A (ja) 1981-07-24 1981-07-24 バンプ形成装置

Publications (2)

Publication Number Publication Date
JPS5817638A true JPS5817638A (ja) 1983-02-01
JPS6325709B2 JPS6325709B2 (enrdf_load_stackoverflow) 1988-05-26

Family

ID=14653788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11508481A Granted JPS5817638A (ja) 1981-07-24 1981-07-24 バンプ形成装置

Country Status (1)

Country Link
JP (1) JPS5817638A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6025149U (ja) * 1983-07-27 1985-02-20 関西日本電気株式会社 バンプ電極形成ウエ−ハ
JPS636860A (ja) * 1986-06-27 1988-01-12 Oki Electric Ind Co Ltd フリップチップ用バンプ形成方法
JPH01156566A (ja) * 1987-12-07 1989-06-20 Pellerin Milnor Corp 液体吸収織物の処理機械
DE19803490C2 (de) * 1997-04-28 2003-04-24 Mitsubishi Electric Corp Abscheidevorrichtung

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6025149U (ja) * 1983-07-27 1985-02-20 関西日本電気株式会社 バンプ電極形成ウエ−ハ
JPS636860A (ja) * 1986-06-27 1988-01-12 Oki Electric Ind Co Ltd フリップチップ用バンプ形成方法
JPH01156566A (ja) * 1987-12-07 1989-06-20 Pellerin Milnor Corp 液体吸収織物の処理機械
DE19803490C2 (de) * 1997-04-28 2003-04-24 Mitsubishi Electric Corp Abscheidevorrichtung

Also Published As

Publication number Publication date
JPS6325709B2 (enrdf_load_stackoverflow) 1988-05-26

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