JPS58175839A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58175839A
JPS58175839A JP5730382A JP5730382A JPS58175839A JP S58175839 A JPS58175839 A JP S58175839A JP 5730382 A JP5730382 A JP 5730382A JP 5730382 A JP5730382 A JP 5730382A JP S58175839 A JPS58175839 A JP S58175839A
Authority
JP
Japan
Prior art keywords
electrode
chip
insulating resin
flip
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5730382A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0136705B2 (enrdf_load_stackoverflow
Inventor
Tomoko Takebe
武部　朋子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP5730382A priority Critical patent/JPS58175839A/ja
Publication of JPS58175839A publication Critical patent/JPS58175839A/ja
Publication of JPH0136705B2 publication Critical patent/JPH0136705B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP5730382A 1982-04-08 1982-04-08 半導体装置 Granted JPS58175839A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5730382A JPS58175839A (ja) 1982-04-08 1982-04-08 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5730382A JPS58175839A (ja) 1982-04-08 1982-04-08 半導体装置

Publications (2)

Publication Number Publication Date
JPS58175839A true JPS58175839A (ja) 1983-10-15
JPH0136705B2 JPH0136705B2 (enrdf_load_stackoverflow) 1989-08-02

Family

ID=13051783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5730382A Granted JPS58175839A (ja) 1982-04-08 1982-04-08 半導体装置

Country Status (1)

Country Link
JP (1) JPS58175839A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014149579A1 (en) * 2013-03-15 2014-09-25 Microchip Technology Incorporated Insulated top side bump connection for a power device, for example for gate, source and drain contacts of a power field effect transistor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014149579A1 (en) * 2013-03-15 2014-09-25 Microchip Technology Incorporated Insulated top side bump connection for a power device, for example for gate, source and drain contacts of a power field effect transistor
US8921986B2 (en) 2013-03-15 2014-12-30 Microchip Technology Incorporated Insulated bump bonding
CN105051895A (zh) * 2013-03-15 2015-11-11 密克罗奇普技术公司 例如用于功率场效应晶体管的栅极、源极及漏极触点的用于功率装置的绝缘顶部侧凸块连接
TWI641142B (zh) * 2013-03-15 2018-11-11 微晶片科技公司 絕緣的凸塊接合

Also Published As

Publication number Publication date
JPH0136705B2 (enrdf_load_stackoverflow) 1989-08-02

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