JPS58175817A - チツプ形積層セラミツクコンデンサ - Google Patents
チツプ形積層セラミツクコンデンサInfo
- Publication number
- JPS58175817A JPS58175817A JP5882582A JP5882582A JPS58175817A JP S58175817 A JPS58175817 A JP S58175817A JP 5882582 A JP5882582 A JP 5882582A JP 5882582 A JP5882582 A JP 5882582A JP S58175817 A JPS58175817 A JP S58175817A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- chip type
- multilayer chip
- main component
- surface roughness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title description 5
- 229910002113 barium titanate Inorganic materials 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 8
- 239000003985 ceramic capacitor Substances 0.000 claims 1
- 229910010293 ceramic material Inorganic materials 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 16
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Chemical compound O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 description 12
- 230000003746 surface roughness Effects 0.000 description 12
- 238000001354 calcination Methods 0.000 description 11
- 239000000203 mixture Substances 0.000 description 11
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 5
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- -1 0o2es Chemical compound 0.000 description 1
- 229910002971 CaTiO3 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910010252 TiO3 Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5882582A JPS58175817A (ja) | 1982-04-08 | 1982-04-08 | チツプ形積層セラミツクコンデンサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5882582A JPS58175817A (ja) | 1982-04-08 | 1982-04-08 | チツプ形積層セラミツクコンデンサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58175817A true JPS58175817A (ja) | 1983-10-15 |
| JPH0322044B2 JPH0322044B2 (enrdf_load_stackoverflow) | 1991-03-26 |
Family
ID=13095414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5882582A Granted JPS58175817A (ja) | 1982-04-08 | 1982-04-08 | チツプ形積層セラミツクコンデンサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58175817A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190055187A (ko) | 2016-09-23 | 2019-05-22 | 티디케이가부시기가이샤 | 전자 부품 및 전자 부품 장치 |
-
1982
- 1982-04-08 JP JP5882582A patent/JPS58175817A/ja active Granted
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190055187A (ko) | 2016-09-23 | 2019-05-22 | 티디케이가부시기가이샤 | 전자 부품 및 전자 부품 장치 |
| DE112017004775T5 (de) | 2016-09-23 | 2019-06-19 | Tdk Corporation | Elektronisches bauelement und elektronische bauelementevorrichtung |
| KR20200077604A (ko) | 2016-09-23 | 2020-06-30 | 티디케이가부시기가이샤 | 전자 부품 및 전자 부품 장치 |
| KR20210021125A (ko) | 2016-09-23 | 2021-02-24 | 티디케이가부시기가이샤 | 전자 부품 및 전자 부품 장치 |
| US11264172B2 (en) | 2016-09-23 | 2022-03-01 | Tdk Corporation | Electronic component and electronic component device |
| KR20220121920A (ko) | 2016-09-23 | 2022-09-01 | 티디케이가부시기가이샤 | 전자 부품 및 전자 부품 장치 |
| US11594378B2 (en) | 2016-09-23 | 2023-02-28 | Tdk Corporation | Electronic component and electronic component device |
| US11763996B2 (en) | 2016-09-23 | 2023-09-19 | Tdk Corporation | Electronic component and electronic component device |
| US12142438B2 (en) | 2016-09-23 | 2024-11-12 | Tdk Corporation | Electronic component and electronic component device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0322044B2 (enrdf_load_stackoverflow) | 1991-03-26 |
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