JPS58171833A - レ−ザによる配線接続方法 - Google Patents

レ−ザによる配線接続方法

Info

Publication number
JPS58171833A
JPS58171833A JP5381782A JP5381782A JPS58171833A JP S58171833 A JPS58171833 A JP S58171833A JP 5381782 A JP5381782 A JP 5381782A JP 5381782 A JP5381782 A JP 5381782A JP S58171833 A JPS58171833 A JP S58171833A
Authority
JP
Japan
Prior art keywords
wiring
laser
layer
resistance part
low resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5381782A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0318335B2 (enrdf_load_stackoverflow
Inventor
Mikio Hongo
幹雄 本郷
Takeoki Miyauchi
宮内　建興
Takao Kawanabe
川那部　隆夫
Osamu Minato
湊　修
Toshiaki Masuhara
増原　利明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5381782A priority Critical patent/JPS58171833A/ja
Publication of JPS58171833A publication Critical patent/JPS58171833A/ja
Publication of JPH0318335B2 publication Critical patent/JPH0318335B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP5381782A 1982-04-02 1982-04-02 レ−ザによる配線接続方法 Granted JPS58171833A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5381782A JPS58171833A (ja) 1982-04-02 1982-04-02 レ−ザによる配線接続方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5381782A JPS58171833A (ja) 1982-04-02 1982-04-02 レ−ザによる配線接続方法

Publications (2)

Publication Number Publication Date
JPS58171833A true JPS58171833A (ja) 1983-10-08
JPH0318335B2 JPH0318335B2 (enrdf_load_stackoverflow) 1991-03-12

Family

ID=12953338

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5381782A Granted JPS58171833A (ja) 1982-04-02 1982-04-02 レ−ザによる配線接続方法

Country Status (1)

Country Link
JP (1) JPS58171833A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019149513A (ja) * 2018-02-28 2019-09-05 新日本無線株式会社 抵抗素子を形成するための中間体およびそれを用いた抵抗素子の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5650531A (en) * 1979-10-01 1981-05-07 Hitachi Ltd Semiconductor integrated circuit and programming method therefor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5650531A (en) * 1979-10-01 1981-05-07 Hitachi Ltd Semiconductor integrated circuit and programming method therefor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019149513A (ja) * 2018-02-28 2019-09-05 新日本無線株式会社 抵抗素子を形成するための中間体およびそれを用いた抵抗素子の製造方法

Also Published As

Publication number Publication date
JPH0318335B2 (enrdf_load_stackoverflow) 1991-03-12

Similar Documents

Publication Publication Date Title
US6300590B1 (en) Laser processing
KR950001305B1 (ko) 레이저에 의한 배선패턴 절단방법 및 장치
US6593542B2 (en) UV laser system and method for single pulse severing of IC fuses
KR20010007252A (ko) 리페어용 퓨즈를 구비한 반도체 장치 및 퓨즈의 레이저트리밍 방법
US20070117227A1 (en) Method And System for Iteratively, Selectively Tuning A Parameter Of A Doped Workpiece Using A Pulsed Laser
JPS6267834A (ja) レ−ザ処理方法
JPS58171833A (ja) レ−ザによる配線接続方法
JP2002043605A (ja) レーザーエッチング方法
JPS63136545A (ja) レ−ザ−・トリミング装置
JPS6234131B2 (enrdf_load_stackoverflow)
US5235154A (en) Laser removal of metal interconnects
JPS59107579A (ja) 光電変換装置の作製方法
JPS5650531A (en) Semiconductor integrated circuit and programming method therefor
JPS58171834A (ja) レ−ザによる配線接続方法
JPH0783006B2 (ja) 薄膜加工方法
JP2524049B2 (ja) 半導体集積回路およびその製造方法
JP2633306B2 (ja) レーザ加工方法
JPH06104338A (ja) メモリセルリペア用ヒューズ素子
JPH03136299A (ja) 回路基板の製造方法
JPS5940548A (ja) 半導体集積回路におけるプログラミング方法
JP3558411B2 (ja) 半導体集積回路装置の製造方法
JPH11197863A (ja) レーザ加工装置
JPS63253674A (ja) 光起電力装置の製造方法
JPH0426219B2 (enrdf_load_stackoverflow)
JPS59178748A (ja) レ−ザ処理方法