JPH0140500B2 - - Google Patents
Info
- Publication number
- JPH0140500B2 JPH0140500B2 JP12265981A JP12265981A JPH0140500B2 JP H0140500 B2 JPH0140500 B2 JP H0140500B2 JP 12265981 A JP12265981 A JP 12265981A JP 12265981 A JP12265981 A JP 12265981A JP H0140500 B2 JPH0140500 B2 JP H0140500B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- wiring
- fuse
- thickness
- fuse part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
- H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
- H01L23/5258—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive the change of state resulting from the use of an external beam, e.g. laser beam or ion beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Read Only Memory (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Semiconductor Memories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56122659A JPS5823475A (ja) | 1981-08-05 | 1981-08-05 | 半導体装置及び製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56122659A JPS5823475A (ja) | 1981-08-05 | 1981-08-05 | 半導体装置及び製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5823475A JPS5823475A (ja) | 1983-02-12 |
| JPH0140500B2 true JPH0140500B2 (enrdf_load_stackoverflow) | 1989-08-29 |
Family
ID=14841447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56122659A Granted JPS5823475A (ja) | 1981-08-05 | 1981-08-05 | 半導体装置及び製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5823475A (enrdf_load_stackoverflow) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58115687A (ja) * | 1981-12-28 | 1983-07-09 | Fujitsu Ltd | 読出し専用メモリ−の書込み方法 |
| US4853758A (en) * | 1987-08-12 | 1989-08-01 | American Telephone And Telegraph Company, At&T Bell Laboratories | Laser-blown links |
| US5070392A (en) * | 1988-03-18 | 1991-12-03 | Digital Equipment Corporation | Integrated circuit having laser-alterable metallization layer |
| US5521116A (en) * | 1995-04-24 | 1996-05-28 | Texas Instruments Incorporated | Sidewall formation process for a top lead fuse |
| US6372522B1 (en) | 1999-10-05 | 2002-04-16 | Vlsi Technology, Inc. | Use of optimized film stacks for increasing absorption for laser repair of fuse links |
| US6306746B1 (en) | 1999-12-30 | 2001-10-23 | Koninklijke Philips Electronics | Backend process for fuse link opening |
-
1981
- 1981-08-05 JP JP56122659A patent/JPS5823475A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5823475A (ja) | 1983-02-12 |
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