JPS58166761A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法Info
- Publication number
- JPS58166761A JPS58166761A JP57049765A JP4976582A JPS58166761A JP S58166761 A JPS58166761 A JP S58166761A JP 57049765 A JP57049765 A JP 57049765A JP 4976582 A JP4976582 A JP 4976582A JP S58166761 A JPS58166761 A JP S58166761A
- Authority
- JP
- Japan
- Prior art keywords
- film
- films
- semiconductor device
- isolation
- elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
Landscapes
- Element Separation (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57049765A JPS58166761A (ja) | 1982-03-26 | 1982-03-26 | 半導体装置の製造方法 |
DE8383301696T DE3380285D1 (en) | 1982-03-26 | 1983-03-25 | Mos semiconductor device and method of producing the same |
EP83301696A EP0090624B1 (en) | 1982-03-26 | 1983-03-25 | Mos semiconductor device and method of producing the same |
US06/846,486 US4665419A (en) | 1982-03-26 | 1986-04-01 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57049765A JPS58166761A (ja) | 1982-03-26 | 1982-03-26 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58166761A true JPS58166761A (ja) | 1983-10-01 |
JPH026227B2 JPH026227B2 (enrdf_load_stackoverflow) | 1990-02-08 |
Family
ID=12840266
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57049765A Granted JPS58166761A (ja) | 1982-03-26 | 1982-03-26 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58166761A (enrdf_load_stackoverflow) |
-
1982
- 1982-03-26 JP JP57049765A patent/JPS58166761A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH026227B2 (enrdf_load_stackoverflow) | 1990-02-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH01315159A (ja) | 誘電体分離半導体基板とその製造方法 | |
US4046606A (en) | Simultaneous location of areas having different conductivities | |
JPS6081839A (ja) | 半導体装置の製造方法 | |
JPS6015155B2 (ja) | 半導体装置の製造方法 | |
JPS58166761A (ja) | 半導体装置の製造方法 | |
JPH02219252A (ja) | 半導体装置の製造方法 | |
JPH0363219B2 (enrdf_load_stackoverflow) | ||
JPS618944A (ja) | 半導体装置およびその製造方法 | |
JPH0779127B2 (ja) | 半導体装置の製造方法 | |
JPS5933271B2 (ja) | 半導体装置の製造方法 | |
JPS58213444A (ja) | 半導体装置の製造方法 | |
JPS63202034A (ja) | 半導体装置の製造方法 | |
JPH0463432A (ja) | 半導体装置の製造方法 | |
JPS61184845A (ja) | 相補型絶縁物分離基板の製造方法 | |
JPH0332232B2 (enrdf_load_stackoverflow) | ||
JPS5844748A (ja) | 半導体装置の製造方法 | |
JPS60128633A (ja) | 半導体装置ならびにその製造方法 | |
JPH1050824A (ja) | Soi基板の製造方法 | |
JPS6028142B2 (ja) | 半導体装置の製造方法 | |
JPS62122143A (ja) | 半導体素子形成用基板の製造方法 | |
JPS5813032B2 (ja) | 半導体装置の製造方法 | |
JPS59202647A (ja) | 半導体装置の製造方法 | |
JPS63213932A (ja) | 相補形誘電体分離基板の製造方法 | |
JPH04258152A (ja) | 半導体装置の製造方法 | |
JPH1012720A (ja) | 半導体装置の製造方法 |