JPS58166761A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS58166761A
JPS58166761A JP57049765A JP4976582A JPS58166761A JP S58166761 A JPS58166761 A JP S58166761A JP 57049765 A JP57049765 A JP 57049765A JP 4976582 A JP4976582 A JP 4976582A JP S58166761 A JPS58166761 A JP S58166761A
Authority
JP
Japan
Prior art keywords
film
films
semiconductor device
isolation
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57049765A
Other languages
English (en)
Japanese (ja)
Other versions
JPH026227B2 (enrdf_load_stackoverflow
Inventor
Nobuo Sasaki
伸夫 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP57049765A priority Critical patent/JPS58166761A/ja
Priority to DE8383301696T priority patent/DE3380285D1/de
Priority to EP83301696A priority patent/EP0090624B1/en
Publication of JPS58166761A publication Critical patent/JPS58166761A/ja
Priority to US06/846,486 priority patent/US4665419A/en
Publication of JPH026227B2 publication Critical patent/JPH026227B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates

Landscapes

  • Element Separation (AREA)
JP57049765A 1982-03-26 1982-03-26 半導体装置の製造方法 Granted JPS58166761A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP57049765A JPS58166761A (ja) 1982-03-26 1982-03-26 半導体装置の製造方法
DE8383301696T DE3380285D1 (en) 1982-03-26 1983-03-25 Mos semiconductor device and method of producing the same
EP83301696A EP0090624B1 (en) 1982-03-26 1983-03-25 Mos semiconductor device and method of producing the same
US06/846,486 US4665419A (en) 1982-03-26 1986-04-01 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57049765A JPS58166761A (ja) 1982-03-26 1982-03-26 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS58166761A true JPS58166761A (ja) 1983-10-01
JPH026227B2 JPH026227B2 (enrdf_load_stackoverflow) 1990-02-08

Family

ID=12840266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57049765A Granted JPS58166761A (ja) 1982-03-26 1982-03-26 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS58166761A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH026227B2 (enrdf_load_stackoverflow) 1990-02-08

Similar Documents

Publication Publication Date Title
US4046606A (en) Simultaneous location of areas having different conductivities
JPS6081839A (ja) 半導体装置の製造方法
JPS6015155B2 (ja) 半導体装置の製造方法
JPS58166761A (ja) 半導体装置の製造方法
JPH02219252A (ja) 半導体装置の製造方法
JPH0363219B2 (enrdf_load_stackoverflow)
JPS618944A (ja) 半導体装置およびその製造方法
JPH0779127B2 (ja) 半導体装置の製造方法
JPS5933271B2 (ja) 半導体装置の製造方法
JPS61135136A (ja) 半導体装置の製造方法
JPS63202034A (ja) 半導体装置の製造方法
JPS58213444A (ja) 半導体装置の製造方法
JPH0463432A (ja) 半導体装置の製造方法
JPS61184845A (ja) 相補型絶縁物分離基板の製造方法
JPH0332232B2 (enrdf_load_stackoverflow)
JPS5844748A (ja) 半導体装置の製造方法
JPS60128633A (ja) 半導体装置ならびにその製造方法
JPH1050824A (ja) Ｓｏｉ基板の製造方法
JPS6028142B2 (ja) 半導体装置の製造方法
JPS62122143A (ja) 半導体素子形成用基板の製造方法
JPS5813032B2 (ja) 半導体装置の製造方法
JPS59202647A (ja) 半導体装置の製造方法
JPS60175449A (ja) 半導体装置の製造方法
JPS63213932A (ja) 相補形誘電体分離基板の製造方法
JPH04258152A (ja) 半導体装置の製造方法