JPS58164240U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58164240U
JPS58164240U JP1982062579U JP6257982U JPS58164240U JP S58164240 U JPS58164240 U JP S58164240U JP 1982062579 U JP1982062579 U JP 1982062579U JP 6257982 U JP6257982 U JP 6257982U JP S58164240 U JPS58164240 U JP S58164240U
Authority
JP
Japan
Prior art keywords
chip
semiconductor device
hermetically sealed
semiconductor equipment
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982062579U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6336686Y2 (enExample
Inventor
正孝 水越
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1982062579U priority Critical patent/JPS58164240U/ja
Publication of JPS58164240U publication Critical patent/JPS58164240U/ja
Application granted granted Critical
Publication of JPS6336686Y2 publication Critical patent/JPS6336686Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
JP1982062579U 1982-04-28 1982-04-28 半導体装置 Granted JPS58164240U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982062579U JPS58164240U (ja) 1982-04-28 1982-04-28 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982062579U JPS58164240U (ja) 1982-04-28 1982-04-28 半導体装置

Publications (2)

Publication Number Publication Date
JPS58164240U true JPS58164240U (ja) 1983-11-01
JPS6336686Y2 JPS6336686Y2 (enExample) 1988-09-28

Family

ID=30072727

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982062579U Granted JPS58164240U (ja) 1982-04-28 1982-04-28 半導体装置

Country Status (1)

Country Link
JP (1) JPS58164240U (enExample)

Also Published As

Publication number Publication date
JPS6336686Y2 (enExample) 1988-09-28

Similar Documents

Publication Publication Date Title
JPS58164240U (ja) 半導体装置
JPS59177949U (ja) 半導体装置
JPS6032769Y2 (ja) 半導体素子
JPS5899841U (ja) 半導体装置
JPS58109254U (ja) フエ−スダウン接続形チツプ用チツプキヤリヤ−
JPS58182438U (ja) 半導体装置
JPS58166041U (ja) 半導体装置
JPS5881940U (ja) 半導体素子の取付構造
JPS60931U (ja) 半導体装置
JPS60141148U (ja) 半導体装置
JPS60144252U (ja) 半導体装置
JPS60179037U (ja) 半導体集積回路
JPS6134747U (ja) 小形気密端子
JPS61240U (ja) 半導体装置
JPS6122362U (ja) 混成集積回路
JPS6033456U (ja) 半導体装置
JPS6122380U (ja) 混成集積回路基板
JPS5916138U (ja) 半導体装置
JPS6142839U (ja) 集積回路パツケ−ジ
JPS5929051U (ja) 半導体装置
JPS5933255U (ja) 半導体装置
JPS63140625U (enExample)
JPS5887339U (ja) 半導体装置
JPS6298242U (enExample)
JPS59152746U (ja) パワ−トランジスタの素子構造